Produkte > SAMTEC INC. > QFSS-032-04.25-L-D-DP-PC4
QFSS-032-04.25-L-D-DP-PC4

QFSS-032-04.25-L-D-DP-PC4 Samtec Inc.

qfxx-xxx-xx.xx-x-d-x-xxx-footprint.pdf Hersteller: Samtec Inc.
Description: CONN DIFF ARRAY RCP 64P SMD GOLD
Packaging: Tray
Features: Board Guide, Ground Bus (Plane), Power Pins (8), Shielded
Connector Type: Differential Pair Array, Female
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 72 (64 + 8 Power)
Pitch: 0.025" (0.64mm)
Height Above Board: 0.278" (7.06mm)
Contact Finish Thickness: 10.0µin (0.25µm)
Mated Stacking Heights: 11mm
Number of Rows: 2
auf Bestellung 506 Stücke:
Lieferzeit 21-28 Tag (e)
Anzahl Preis ohne MwSt
1+49.45 EUR
10+ 42.84 EUR
25+ 40.6 EUR
40+ 40.01 EUR
80+ 35.31 EUR
230+ 32.95 EUR
440+ 32.25 EUR
Produktrezensionen
Produktbewertung abgeben

Technische Details QFSS-032-04.25-L-D-DP-PC4 Samtec Inc.

Description: CONN DIFF ARRAY RCP 64P SMD GOLD, Packaging: Tray, Features: Board Guide, Ground Bus (Plane), Power Pins (8), Shielded, Connector Type: Differential Pair Array, Female, Contact Finish: Gold, Mounting Type: Surface Mount, Number of Positions: 72 (64 + 8 Power), Pitch: 0.025" (0.64mm), Height Above Board: 0.278" (7.06mm), Contact Finish Thickness: 10.0µin (0.25µm), Mated Stacking Heights: 11mm, Number of Rows: 2.