Produkte > SAMTEC INC. > QFSS-032-04.25-L-D-DP-PC4
QFSS-032-04.25-L-D-DP-PC4

QFSS-032-04.25-L-D-DP-PC4 Samtec Inc.

qfss-xxx-xx.xx-x-d-dp-x-xxx-x-xx-mkt.pdf Hersteller: Samtec Inc.
Description: CONN DIFF ARRAY RCP 64P SMD GOLD
Features: Board Guide, Ground Bus (Plane), Power Pins (8), Shielded
Packaging: Tray
Connector Type: Differential Pair Array, Female
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 72 (64 + 8 Power)
Pitch: 0.025" (0.64mm)
Height Above Board: 0.278" (7.06mm)
Contact Finish Thickness: 10.0µin (0.25µm)
Mated Stacking Heights: 11mm
Number of Rows: 2
auf Bestellung 506 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+38.53 EUR
10+36.47 EUR
25+35.1 EUR
50+34.24 EUR
100+27.24 EUR
250+24.91 EUR
500+20.25 EUR
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Technische Details QFSS-032-04.25-L-D-DP-PC4 Samtec Inc.

Description: CONN DIFF ARRAY RCP 64P SMD GOLD, Features: Board Guide, Ground Bus (Plane), Power Pins (8), Shielded, Packaging: Tray, Connector Type: Differential Pair Array, Female, Contact Finish: Gold, Mounting Type: Surface Mount, Number of Positions: 72 (64 + 8 Power), Pitch: 0.025" (0.64mm), Height Above Board: 0.278" (7.06mm), Contact Finish Thickness: 10.0µin (0.25µm), Mated Stacking Heights: 11mm, Number of Rows: 2.