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RASW.031 1LB

RASW.031 1LB Chip Quik Inc.


RASW.031 1LB.pdf Hersteller: Chip Quik Inc.
Description: SOLDER WIRE 63/37 TIN/LEAD ROSIN
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 21 AWG, 20 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: Rosin Activated (RA)
Shelf Life Start: Date of Manufacture
Shelf Life: 60 Months
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Lieferzeit 10-14 Tag (e)
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Technische Details RASW.031 1LB Chip Quik Inc.

Description: SOLDER WIRE 63/37 TIN/LEAD ROSIN, Packaging: Bulk, Diameter: 0.031" (0.79mm), Wire Gauge: 21 AWG, 20 SWG, Composition: Sn63Pb37 (63/37), Type: Wire Solder, Melting Point: 361°F (183°C), Form: Spool, 1 lb (454 g), Process: Leaded, Flux Type: Rosin Activated (RA), Shelf Life Start: Date of Manufacture, Shelf Life: 60 Months.