RASWLF.031 4OZ Chip Quik Inc.
Hersteller: Chip Quik Inc.Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SI
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 21 AWG, 20 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 422 ~ 428°F (217 ~ 220°C)
Form: Spool, 4 oz (113.40g)
Process: Lead Free
Flux Type: Rosin Activated (RA)
Shelf Life Start: Date of Manufacture
Shelf Life: 60 Months
auf Bestellung 22 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 34.65 EUR |
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Technische Details RASWLF.031 4OZ Chip Quik Inc.
Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SI, Packaging: Bulk, Diameter: 0.031" (0.79mm), Wire Gauge: 21 AWG, 20 SWG, Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Type: Wire Solder, Melting Point: 422 ~ 428°F (217 ~ 220°C), Form: Spool, 4 oz (113.40g), Process: Lead Free, Flux Type: Rosin Activated (RA), Shelf Life Start: Date of Manufacture, Shelf Life: 60 Months.