SIDC59D170HX1SA2 Infineon Technologies
Hersteller: Infineon Technologies
Description: DIODE GP 1.7KV 100A WAFER
Supplier Device Package: Sawn on foil
Current - Average Rectified (Io): 100A
Technology: Standard
Speed: Standard Recovery >500ns, > 200mA (Io)
Mounting Type: Surface Mount
Package / Case: Die
Packaging: Bulk
Current - Reverse Leakage @ Vr: 27 µA @ 1700 V
Voltage - Forward (Vf) (Max) @ If: 1.8 V @ 100 A
Voltage - DC Reverse (Vr) (Max): 1700 V
Operating Temperature - Junction: -55°C ~ 150°C
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Technische Details SIDC59D170HX1SA2 Infineon Technologies
Description: DIODE GP 1.7KV 100A WAFER, Supplier Device Package: Sawn on foil, Current - Average Rectified (Io): 100A, Technology: Standard, Speed: Standard Recovery >500ns, > 200mA (Io), Mounting Type: Surface Mount, Package / Case: Die, Packaging: Bulk, Current - Reverse Leakage @ Vr: 27 µA @ 1700 V, Voltage - Forward (Vf) (Max) @ If: 1.8 V @ 100 A, Voltage - DC Reverse (Vr) (Max): 1700 V, Operating Temperature - Junction: -55°C ~ 150°C.