Technische Details SIP050-1X09-157B FCI
Description: 1X09-157B-SIP SOCKET 9 CTS, Packaging: Bulk, Features: Closed Frame, Mounting Type: Through Hole, Type: SIP, Number of Positions or Pins (Grid): 9 (1 x 9), Termination: Solder, Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 200.0µin (5.08µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin, Contact Finish Thickness - Post: 200.0µin (5.08µm), Contact Material - Post: Brass.
Weitere Produktangebote SIP050-1X09-157B
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
|---|---|---|---|---|---|
| SIP050-1X09-157B | Hersteller : Amphenol ICC (FCI) |
 Description: 1X09-157B-SIP SOCKET 9 CTSPackaging: Bulk Features: Closed Frame Mounting Type: Through Hole Type: SIP Number of Positions or Pins (Grid): 9 (1 x 9) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 200.0µin (5.08µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
Produkt ist nicht verfügbar |