SKIIP 26GB12F4V1 25241223 SEMIKRON DANFOSS


Category: IGBT modules
Description: Module: IGBT; transistor/transistor; IGBT half-bridge; Ic: 200A
Case: MiniSKiiP® 2
Max. off-state voltage: 1.2kV
Semiconductor structure: transistor/transistor
Gate-emitter voltage: ±20V
Collector current: 200A
Pulsed collector current: 400A
Application: for UPS; Inverter; photovoltaics
Electrical mounting: Press-Fit
Mechanical mounting: screw
Topology: IGBT half-bridge; NTC thermistor
Type of semiconductor module: IGBT
Anzahl je Verpackung: 1 Stücke
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Technische Details SKIIP 26GB12F4V1 25241223 SEMIKRON DANFOSS
Category: IGBT modules, Description: Module: IGBT; transistor/transistor; IGBT half-bridge; Ic: 200A, Case: MiniSKiiP® 2, Max. off-state voltage: 1.2kV, Semiconductor structure: transistor/transistor, Gate-emitter voltage: ±20V, Collector current: 200A, Pulsed collector current: 400A, Application: for UPS; Inverter; photovoltaics, Electrical mounting: Press-Fit, Mechanical mounting: screw, Topology: IGBT half-bridge; NTC thermistor, Type of semiconductor module: IGBT, Anzahl je Verpackung: 1 Stücke.
Weitere Produktangebote SKIIP 26GB12F4V1 25241223
Foto | Bezeichnung | Hersteller | Beschreibung |
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SKIIP 26GB12F4V1 25241223 | Hersteller : SEMIKRON DANFOSS |
![]() ![]() Description: Module: IGBT; transistor/transistor; IGBT half-bridge; Ic: 200A Case: MiniSKiiP® 2 Max. off-state voltage: 1.2kV Semiconductor structure: transistor/transistor Gate-emitter voltage: ±20V Collector current: 200A Pulsed collector current: 400A Application: for UPS; Inverter; photovoltaics Electrical mounting: Press-Fit Mechanical mounting: screw Topology: IGBT half-bridge; NTC thermistor Type of semiconductor module: IGBT |
Produkt ist nicht verfügbar |