SN99CU07AG03-1.1.3/0.5MM 500G CYNEL
Hersteller: CYNEL
Category: Solder wires - lead free
Description: Tin; lead free; Sn99Ag0,3Cu0,7; 500um; 500g; reel; 216÷227°C; 3%
Kind of flux: halide-free; No Clean; ROM0; rosin
Appearance: soldering wire
Density: 7.44g/cm3
Conform to the norm: EN ISO 9453; PN EN 29454 1.1.3
Kind of package: reel
Alloy composition: Sn99Ag0,3Cu0,7
Flux name: SW32
Type of solder: tin
Diameter: 0.5mm
Version: for soft soldering
Flux content: 3%
Flux residues: non-corrosive; transparent; yes
Melting point: 216...227°C
Kind of solder: lead free
Binder weight: 0.5kg
Category: Solder wires - lead free
Description: Tin; lead free; Sn99Ag0,3Cu0,7; 500um; 500g; reel; 216÷227°C; 3%
Kind of flux: halide-free; No Clean; ROM0; rosin
Appearance: soldering wire
Density: 7.44g/cm3
Conform to the norm: EN ISO 9453; PN EN 29454 1.1.3
Kind of package: reel
Alloy composition: Sn99Ag0,3Cu0,7
Flux name: SW32
Type of solder: tin
Diameter: 0.5mm
Version: for soft soldering
Flux content: 3%
Flux residues: non-corrosive; transparent; yes
Melting point: 216...227°C
Kind of solder: lead free
Binder weight: 0.5kg
auf Bestellung 22 Stücke:
Lieferzeit 14-21 Tag (e)
| Anzahl | Preis |
|---|---|
| 2+ | 63.26 EUR |
| 5+ | 61.26 EUR |
| 10+ | 56.07 EUR |
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Technische Details SN99CU07AG03-1.1.3/0.5MM 500G CYNEL
Category: Solder wires - lead free, Description: Tin; lead free; Sn99Ag0,3Cu0,7; 500um; 500g; reel; 216÷227°C; 3%, Kind of flux: halide-free; No Clean; ROM0; rosin, Appearance: soldering wire, Density: 7.44g/cm3, Conform to the norm: EN ISO 9453; PN EN 29454 1.1.3, Kind of package: reel, Alloy composition: Sn99Ag0,3Cu0,7, Flux name: SW32, Type of solder: tin, Diameter: 0.5mm, Version: for soft soldering, Flux content: 3%, Flux residues: non-corrosive; transparent; yes, Melting point: 216...227°C, Kind of solder: lead free, Binder weight: 0.5kg.