TMSDVC5510AGGWA2 Texas Instruments
Hersteller: Texas Instruments
Description: IC DSP FIXED POINT BGA
Packaging: Tray
Package / Case: 240-LFBGA
Mounting Type: Surface Mount
Interface: Host Interface, McBSP
Type: Fixed Point
Operating Temperature: -40°C ~ 85°C (TC)
Non-Volatile Memory: ROM (32kB)
On-Chip RAM: 320kB
Voltage - I/O: 3.30V
Voltage - Core: 1.60V
Clock Rate: 200MHz
Supplier Device Package: 240-BGA MICROSTAR (15x15)
Description: IC DSP FIXED POINT BGA
Packaging: Tray
Package / Case: 240-LFBGA
Mounting Type: Surface Mount
Interface: Host Interface, McBSP
Type: Fixed Point
Operating Temperature: -40°C ~ 85°C (TC)
Non-Volatile Memory: ROM (32kB)
On-Chip RAM: 320kB
Voltage - I/O: 3.30V
Voltage - Core: 1.60V
Clock Rate: 200MHz
Supplier Device Package: 240-BGA MICROSTAR (15x15)
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Technische Details TMSDVC5510AGGWA2 Texas Instruments
Description: IC DSP FIXED POINT BGA, Packaging: Tray, Package / Case: 240-LFBGA, Mounting Type: Surface Mount, Interface: Host Interface, McBSP, Type: Fixed Point, Operating Temperature: -40°C ~ 85°C (TC), Non-Volatile Memory: ROM (32kB), On-Chip RAM: 320kB, Voltage - I/O: 3.30V, Voltage - Core: 1.60V, Clock Rate: 200MHz, Supplier Device Package: 240-BGA MICROSTAR (15x15).