UPD70F3370AM1GBA-GAH-AX Renesas Electronics Corporation
Hersteller: Renesas Electronics CorporationDescription: IC MCU 32BIT 128KB FLASH 64LFQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 32K x 8
Core Processor: V850ES
Data Converters: A/D 10x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3.3V ~ 5.5V
Connectivity: CANbus, CSI, I2C, LINbus, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 64-LFQFP (10x10)
Number of I/O: 51
DigiKey Programmable: Not Verified
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Technische Details UPD70F3370AM1GBA-GAH-AX Renesas Electronics Corporation
Description: IC MCU 32BIT 128KB FLASH 64LFQFP, Packaging: Tray, Package / Case: 64-LQFP, Mounting Type: Surface Mount, Speed: 32MHz, Program Memory Size: 128KB (128K x 8), RAM Size: 8K x 8, Operating Temperature: -40°C ~ 85°C (TA), Oscillator Type: Internal, Program Memory Type: FLASH, EEPROM Size: 32K x 8, Core Processor: V850ES, Data Converters: A/D 10x10b, Core Size: 32-Bit Single-Core, Voltage - Supply (Vcc/Vdd): 3.3V ~ 5.5V, Connectivity: CANbus, CSI, I2C, LINbus, UART/USART, Peripherals: DMA, LVD, POR, PWM, WDT, Supplier Device Package: 64-LFQFP (10x10), Number of I/O: 51, DigiKey Programmable: Not Verified.