WCI2012CP36NGDG INPAQ Technology Co., Ltd
Hersteller: INPAQ Technology Co., LtdDescription: CHIP IND 2012,36NH,G,55Q,0.5A,3K
Packaging: Cut Tape (CT)
Tolerance: ±2%
Package / Case: 0805 (2012 Metric)
Size / Dimension: 0.090" L x 0.068" W (2.29mm x 1.73mm)
Mounting Type: Surface Mount
Shielding: Unshielded
Type: Wirewound
Operating Temperature: -25°C ~ 125°C
DC Resistance (DCR): 270mOhm Max
Q @ Freq: 55 @ 500MHz
Frequency - Self Resonant: 1.7GHz
Material - Core: Ceramic
Inductance Frequency - Test: 250 MHz
Supplier Device Package: 0805
Height - Seated (Max): 0.060" (1.52mm)
Inductance: 36 nH
Current Rating (Amps): 500 mA
auf Bestellung 2900 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 77+ | 0.23 EUR |
| 94+ | 0.19 EUR |
| 103+ | 0.17 EUR |
| 116+ | 0.15 EUR |
| 133+ | 0.13 EUR |
| 500+ | 0.12 EUR |
| 1000+ | 0.09 EUR |
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Technische Details WCI2012CP36NGDG INPAQ Technology Co., Ltd
Description: CHIP IND 2012,36NH,G,55Q,0.5A,3K, Packaging: Cut Tape (CT), Tolerance: ±2%, Package / Case: 0805 (2012 Metric), Size / Dimension: 0.090" L x 0.068" W (2.29mm x 1.73mm), Mounting Type: Surface Mount, Shielding: Unshielded, Type: Wirewound, Operating Temperature: -25°C ~ 125°C, DC Resistance (DCR): 270mOhm Max, Q @ Freq: 55 @ 500MHz, Frequency - Self Resonant: 1.7GHz, Material - Core: Ceramic, Inductance Frequency - Test: 250 MHz, Supplier Device Package: 0805, Height - Seated (Max): 0.060" (1.52mm), Inductance: 36 nH, Current Rating (Amps): 500 mA.