WIREFC-500572-0454 Indium Corporation of America
Hersteller: Indium Corporation of America
Description: IND291 CW818 3% 0.062" 1LB
Packaging: Spool
Diameter: 0.062" (1.57mm)
Wire Gauge: 14 AWG, 16 SWG
Composition: Sn99.244Cu0.7Ni0.05Ge0.006 (99.244/0.7/0.05/0.006)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Spool, 1 lb (454 g)
Process: Lead Free
Flux Type: No-Clean
Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 120 Months
Description: IND291 CW818 3% 0.062" 1LB
Packaging: Spool
Diameter: 0.062" (1.57mm)
Wire Gauge: 14 AWG, 16 SWG
Composition: Sn99.244Cu0.7Ni0.05Ge0.006 (99.244/0.7/0.05/0.006)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Spool, 1 lb (454 g)
Process: Lead Free
Flux Type: No-Clean
Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 120 Months
auf Bestellung 50 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 130.8 EUR |
| 5+ | 112.72 EUR |
| 10+ | 105.7 EUR |
| 25+ | 97.07 EUR |
| 50+ | 91 EUR |
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Technische Details WIREFC-500572-0454 Indium Corporation of America
Description: IND291 CW818 3% 0.062" 1LB, Packaging: Spool, Diameter: 0.062" (1.57mm), Wire Gauge: 14 AWG, 16 SWG, Composition: Sn99.244Cu0.7Ni0.05Ge0.006 (99.244/0.7/0.05/0.006), Type: Wire Solder, Melting Point: 441°F (227°C), Form: Spool, 1 lb (454 g), Process: Lead Free, Flux Type: No-Clean, Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C), Shelf Life Start: Date of Manufacture, Shelf Life: 120 Months.