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| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||||||||||
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Adapter SO8/DIP zum Programmieren (ZIF SO8/DIP8 150mil) Produktcode: 58316
5
zu Favoriten hinzufügen
Lieblingsprodukt
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Steckverbinder, Reihenklemmen > IC-Nullkraftsockel-Testsockel Beschreibung: Adapter SO8/DIP Anzahl der Kontakte: 8 Gruppe: Adapter |
auf Bestellung 2 St.: Lieferzeit 21-28 Tag (e) |
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IR2E01 Produktcode: 29369
zu Favoriten hinzufügen
Lieblingsprodukt
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IR |
IC > IC LED-TreiberGehäuse: DIP-16 Versorgungsspannung Vcc, V: <18 В Bemerkung: Treiber für Segment-Ziffern-Display mit seriellem Eingang |
auf Bestellung 12 St.: Lieferzeit 21-28 Tag (e) |
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Nullkraftsockel 14pin (214-3345) Produktcode: 158778
2
zu Favoriten hinzufügen
Lieblingsprodukt
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TEXTDOL |
Steckverbinder, Reihenklemmen > IC-Nullkraftsockel-Testsockel Beschreibung: Nullkraftsockel 14pin Anzahl der Kontakte: 14 Gruppe: DIP Nullkraftsockel |
auf Bestellung 40 St.: Lieferzeit 21-28 Tag (e) |
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Nullkraftsockel 16pin (216-3341) Produktcode: 158779
2
zu Favoriten hinzufügen
Lieblingsprodukt
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TEXTDOL |
Steckverbinder, Reihenklemmen > IC-Nullkraftsockel-Testsockel Beschreibung: Nullkraftsockel 16pin Anzahl der Kontakte: 16 Gruppe: DIP Nullkraftsockel |
auf Bestellung 1 St.: Lieferzeit 21-28 Tag (e) erwartet 50 St.: 50 St. - erwartet |
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Nullkraftsockel 18pin (ZIF 218-3341) Produktcode: 45747
1
zu Favoriten hinzufügen
Lieblingsprodukt
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TEXTDOL |
Steckverbinder, Reihenklemmen > IC-Nullkraftsockel-Testsockel Beschreibung: Nullkraftsockel 18pin schmal Anzahl der Kontakte: 18 Gruppe: DIP Nullkraftsockel |
auf Bestellung 36 St.: Lieferzeit 21-28 Tag (e) |
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Nullkraftsockel 28pin schmal 0,3 (ZIF 228-3341) Produktcode: 86705
2
zu Favoriten hinzufügen
Lieblingsprodukt
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TEXTDOL |
Steckverbinder, Reihenklemmen > IC-Nullkraftsockel-Testsockel Beschreibung: Nullkraftsockel 28pin schmal 0,3 Anzahl der Kontakte: 28 Gruppe: DIP Nullkraftsockel |
auf Bestellung 5 St.: Lieferzeit 21-28 Tag (e) |
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Nullkraftsockel 32pin breit (ZIF 232-3345) Produktcode: 60247
2
zu Favoriten hinzufügen
Lieblingsprodukt
|
TEXTDOL |
Steckverbinder, Reihenklemmen > IC-Nullkraftsockel-Testsockel Beschreibung: Nullkraftsockel 32pin Anzahl der Kontakte: 32 Gruppe: DIP Nullkraftsockel |
auf Bestellung 8 St.: Lieferzeit 21-28 Tag (e) |
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Nullkraftsockel 40pin (ZIF 240-3345) Produktcode: 54221
1
zu Favoriten hinzufügen
Lieblingsprodukt
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TEXTDOL |
Steckverbinder, Reihenklemmen > IC-Nullkraftsockel-Testsockel Beschreibung: Nullkraftsockel 40pin, 21x65mm Anzahl der Kontakte: 40 Gruppe: DIP Nullkraftsockel |
Produkt ist nicht verfügbar
erwartet: 20 St.
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1-84984-6 | TE Connectivity |
FFC & FPC Connectors 1mm DIP V ASSY 16P |
auf Bestellung 4145 Stücke: Lieferzeit 10-14 Tag (e) |
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214-3339-19-0602J | 3M Electronic Solutions Division |
IC & Component Sockets RECPT FOR DIP SOCKET 14 Contact Qty. |
auf Bestellung 30 Stücke: Lieferzeit 10-14 Tag (e) |
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216-3340-00-0602J | 3M |
Description: CONN IC DIP SOCKET ZIF 16POS GLDPackaging: Tube Features: Closed Frame Mounting Type: Connector Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 16 (2 x 8) Termination: Press-Fit Housing Material: Polysulfone (PSU), Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 30.0µin (0.76µm) Contact Material - Post: Beryllium Copper Part Status: Active |
auf Bestellung 151 Stücke: Lieferzeit 10-14 Tag (e) |
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216-3340-19-0602J | 3M Electronic Solutions Division |
IC & Component Sockets RECPT FOR DIP SOCKET 16 Contact Qty. |
auf Bestellung 35 Stücke: Lieferzeit 10-14 Tag (e) |
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218-3341-00-0602J | 3M |
Description: CONN IC DIP SOCKET ZIF 18POS GLDPackaging: Tray Features: Closed Frame Mounting Type: Connector Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 18 (2 x 9) Termination: Press-Fit Housing Material: Polysulfone (PSU), Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 30.0µin (0.76µm) Contact Material - Post: Beryllium Copper Part Status: Active |
auf Bestellung 8 Stücke: Lieferzeit 10-14 Tag (e) |
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224-1275-00-0602J | 3M |
Description: CONN IC DIP SOCKET ZIF 24POS GLDPackaging: Tube Features: Closed Frame Mounting Type: Connector Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 24 (2 x 12) Termination: Press-Fit Housing Material: Polysulfone (PSU), Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 30.0µin (0.76µm) Contact Material - Post: Beryllium Copper Part Status: Active |
auf Bestellung 393 Stücke: Lieferzeit 10-14 Tag (e) |
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224-5248-00-0602J | 3M |
Description: CONN IC DIP SOCKET ZIF 24POS GLDPackaging: Bulk Features: Closed Frame Mounting Type: Connector Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 24 (2 x 12) Termination: Press-Fit Housing Material: Polysulfone (PSU), Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 30.0µin (0.76µm) Contact Material - Post: Beryllium Copper Part Status: Active |
auf Bestellung 63 Stücke: Lieferzeit 10-14 Tag (e) |
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228-1277-19-0602J | 3M Electronic Solutions Division |
IC & Component Sockets RECPT FOR DIP SOCKET 28 Contact Qty. |
auf Bestellung 39 Stücke: Lieferzeit 10-14 Tag (e) |
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228-1277-39-0602J | 3M Electronic Solutions Division |
IC & Component Sockets RECPT FOR DIP SOCKET 28 Contact Qty. |
auf Bestellung 10 Stücke: Lieferzeit 10-14 Tag (e) |
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228-1290-00-0602J | 3M |
Description: CONN IC DIP SOCKET ZIF 28POS GLDPackaging: Bulk Features: Closed Frame Mounting Type: Connector Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 28 (2 x 14) Termination: Press-Fit Housing Material: Polysulfone (PSU), Glass Filled Pitch - Mating: 0.070" (1.78mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 30.0µin (0.76µm) Contact Material - Post: Beryllium Copper Part Status: Active |
auf Bestellung 5 Stücke: Lieferzeit 10-14 Tag (e) |
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228-1290-00-0602J | 3M Electronic Solutions Division |
IC & Component Sockets 0.070" DIP SOCKET 28 Contact Qty. |
auf Bestellung 42 Stücke: Lieferzeit 10-14 Tag (e) |
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228-4817-00-0602J | 3M |
Description: CONN IC DIP SOCKET ZIF 28POS GLDPackaging: Bulk Features: Closed Frame Mounting Type: Connector Type: DIP, ZIF (ZIP), 0.4" (10.16mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 28 (2 x 14) Termination: Press-Fit Housing Material: Polysulfone (PSU), Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 30.0µin (0.76µm) Contact Material - Post: Beryllium Copper Part Status: Active |
auf Bestellung 28 Stücke: Lieferzeit 10-14 Tag (e) |
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228-4817-09-0602J | 3M Electronic Solutions Division |
IC & Component Sockets RECPT FOR DIP SOCKET 28 Contact Qty. |
auf Bestellung 5 Stücke: Lieferzeit 10-14 Tag (e) |
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232-1285-00-0602J | 3M |
Description: CONN IC DIP SOCKET ZIF 32POS GLDPackaging: Tube Features: Closed Frame Mounting Type: Connector Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 32 (2 x 16) Termination: Press-Fit Housing Material: Polysulfone (PSU), Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 30.0µin (0.76µm) Contact Material - Post: Beryllium Copper Part Status: Active |
auf Bestellung 3 Stücke: Lieferzeit 10-14 Tag (e) |
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232-1287-00-0602J | 3M |
Description: CONN IC DIP SOCKET ZIF 32POS GLDPackaging: Bulk Features: Closed Frame Mounting Type: Connector Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 32 (2 x 16) Termination: Press-Fit Housing Material: Polysulfone (PSU), Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 30.0µin (0.76µm) Contact Material - Post: Beryllium Copper Part Status: Active |
auf Bestellung 4 Stücke: Lieferzeit 10-14 Tag (e) |
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232-1291-00-0602J | 3M Electronic Solutions Division |
IC & Component Sockets 0.070" DIP SOCKET 32 Contact Qty. |
auf Bestellung 12 Stücke: Lieferzeit 10-14 Tag (e) |
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24-3551-11 | Aries Electronics |
IC & Component Sockets DIP TEST SCKT GOLD 24 PINS |
auf Bestellung 47 Stücke: Lieferzeit 10-14 Tag (e) |
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24-3553-10 | Aries Electronics |
IC & Component Sockets DIP TEST SCKT TIN 24 PINS |
auf Bestellung 32 Stücke: Lieferzeit 10-14 Tag (e) |
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24-3554-10 | Aries Electronics |
IC & Component Sockets DIP TEST SCKT TIN 24 PINS |
auf Bestellung 12 Stücke: Lieferzeit 10-14 Tag (e) |
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24-526-10 | Aries Electronics |
Description: CONN IC DIP SOCKET ZIF 24POS TINPackaging: Bulk Features: Closed Frame Mounting Type: Through Hole Type: DIP, ZIF (ZIP) Operating Temperature: -55°C ~ 105°C Number of Positions or Pins (Grid): 24 (2 x 12) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Beryllium Copper Part Status: Active |
auf Bestellung 82 Stücke: Lieferzeit 10-14 Tag (e) |
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24-526-11 | Aries Electronics |
IC & Component Sockets Zero-Insertion-Force Socket |
auf Bestellung 15 Stücke: Lieferzeit 10-14 Tag (e) |
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24-6553-10 | Aries Electronics |
IC & Component Sockets DIP TEST SCKT TIN 24 PINS |
auf Bestellung 33 Stücke: Lieferzeit 10-14 Tag (e) |
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24-6554-10 | Aries Electronics |
Description: CONN IC DIP SOCKET ZIF 24POS TINPackaging: Tube Features: Closed Frame Mounting Type: Through Hole Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 24 (2 x 12) Termination: Solder Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 200.0µin (5.08µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Beryllium Copper Part Status: Active |
auf Bestellung 42 Stücke: Lieferzeit 10-14 Tag (e) |
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24-6554-11 | Aries Electronics |
IC & Component Sockets 24 PIN W/HANDLE |
auf Bestellung 43 Stücke: Lieferzeit 10-14 Tag (e) |
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24-6554-11 | Aries Electronics |
Description: CONN IC DIP SOCKET ZIF 24POS GLDPackaging: Bulk Features: Closed Frame Mounting Type: Through Hole Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 24 (2 x 12) Termination: Solder Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Material - Post: Beryllium Copper Part Status: Active |
auf Bestellung 137 Stücke: Lieferzeit 10-14 Tag (e) |
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24-6554-18 | Aries Electronics |
IC & Component Sockets FORCE DIP TEST SCKT HIGH TEMP 24 PINS |
auf Bestellung 16 Stücke: Lieferzeit 10-14 Tag (e) |
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24-6572-11 | Aries Electronics |
IC & Component Sockets QUICK RELEASE 24 PIN GOLD |
auf Bestellung 19 Stücke: Lieferzeit 10-14 Tag (e) |
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240-1280-00-0602J | 3M |
Description: CONN IC DIP SOCKET ZIF 40POS GLDPackaging: Tube Features: Closed Frame Mounting Type: Connector Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 40 (2 x 20) Termination: Press-Fit Housing Material: Polysulfone (PSU), Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 30.0µin (0.76µm) Contact Material - Post: Beryllium Copper Part Status: Active |
auf Bestellung 77 Stücke: Lieferzeit 10-14 Tag (e) |
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240-1288-00-0602J | 3M |
Description: CONN IC DIP SOCKET ZIF 40POS GLDPackaging: Tube Features: Closed Frame Mounting Type: Connector Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 40 (2 x 20) Termination: Press-Fit Housing Material: Polysulfone (PSU), Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 30.0µin (0.76µm) Contact Material - Post: Beryllium Copper Part Status: Active |
auf Bestellung 102 Stücke: Lieferzeit 10-14 Tag (e) |
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240-1288-00-0602J | 3M Electronic Solutions Division |
IC & Component Sockets 0.100" DIP SOCKET 40 Contact Qty. |
auf Bestellung 29 Stücke: Lieferzeit 10-14 Tag (e) |
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240-3639-00-0602J | 3M |
Description: CONN IC DIP SOCKET ZIF 40POS GLDPackaging: Bulk Features: Closed Frame Mounting Type: Connector Type: DIP, ZIF (ZIP), 1.0" (25.40mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 40 (2 x 20) Termination: Press-Fit Housing Material: Polysulfone (PSU), Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 30.0µin (0.76µm) Contact Material - Post: Beryllium Copper Part Status: Active |
auf Bestellung 16 Stücke: Lieferzeit 10-14 Tag (e) |
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240-3639-19-0602J | 3M Electronic Solutions Division |
IC & Component Sockets RECPT FOR DIP SOCKET 40 Contact Qty. |
auf Bestellung 13 Stücke: Lieferzeit 10-14 Tag (e) |
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242-1281-00-0602J | 3M |
Description: CONN IC DIP SOCKET ZIF 42POS GLDPackaging: Tube Features: Closed Frame Mounting Type: Connector Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 42 (2 x 21) Termination: Press-Fit Housing Material: Polysulfone (PSU), Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 30.0µin (0.76µm) Contact Material - Post: Beryllium Copper Part Status: Active |
auf Bestellung 2 Stücke: Lieferzeit 10-14 Tag (e) |
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242-1281-09-0602J | 3M Electronic Solutions Division |
IC & Component Sockets RECPT FOR DIP SOCKET 42 Contact Qty. |
auf Bestellung 2 Stücke: Lieferzeit 10-14 Tag (e) |
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242-1289-00-0602J | 3M |
Description: CONN IC DIP SOCKET ZIF 42POS GLDPackaging: Bulk Features: Closed Frame Mounting Type: Connector Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 42 (2 x 21) Termination: Press-Fit Housing Material: Polysulfone (PSU), Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 30.0µin (0.76µm) Contact Material - Post: Beryllium Copper Part Status: Active |
auf Bestellung 3 Stücke: Lieferzeit 10-14 Tag (e) |
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242-1293-00-0602J | 3M |
Description: CONN IC DIP SOCKET ZIF 42POS GLDPackaging: Bulk Features: Closed Frame Mounting Type: Connector Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 42 (2 x 21) Termination: Press-Fit Housing Material: Polysulfone (PSU), Glass Filled Pitch - Mating: 0.070" (1.78mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 30.0µin (0.76µm) Contact Material - Post: Beryllium Copper Part Status: Active |
auf Bestellung 27 Stücke: Lieferzeit 10-14 Tag (e) |
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242-1293-09-0602J | 3M Electronic Solutions Division |
IC & Component Sockets RECPT FOR DIP SOCKET 42 Contact Qty. |
auf Bestellung 11 Stücke: Lieferzeit 10-14 Tag (e) |
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248-1282-00-0602J | 3M |
Description: CONN IC DIP SOCKET ZIF 48POS GLDPackaging: Tube Features: Closed Frame Mounting Type: Connector Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 48 (2 x 24) Termination: Press-Fit Housing Material: Polysulfone (PSU), Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 30.0µin (0.76µm) Contact Material - Post: Beryllium Copper Part Status: Active |
auf Bestellung 521 Stücke: Lieferzeit 10-14 Tag (e) |
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248-1282-29-0602J | 3M Electronic Solutions Division |
IC & Component Sockets RECPT FOR DIP SOCKET 48 Contact Qty. |
auf Bestellung 27 Stücke: Lieferzeit 10-14 Tag (e) |
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251-5949-02-0602 | 3M Electronic Solutions Division |
IC & Component Sockets ZIP STRIP SCKT AXIAL LEAD |
auf Bestellung 7 Stücke: Lieferzeit 10-14 Tag (e) |
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264-4493-09-0602J | 3M Electronic Solutions Division |
IC & Component Sockets RECPT FOR DIP SOCKET 64 Contact Qty. |
auf Bestellung 2 Stücke: Lieferzeit 10-14 Tag (e) |
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28-3551-11 | Aries Electronics |
IC & Component Sockets DIP TEST SCKT GOLD 28 PINS |
auf Bestellung 57 Stücke: Lieferzeit 10-14 Tag (e) |
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28-3553-10* | Aries Electronics |
IC & Component Sockets |
auf Bestellung 30 Stücke: Lieferzeit 10-14 Tag (e) |
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28-3554-10 | Aries Electronics |
IC & Component Sockets DIP TEST SCKT TIN 28 PINS |
auf Bestellung 20 Stücke: Lieferzeit 10-14 Tag (e) |
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28-3554-16 | Aries Electronics |
IC & Component Sockets DIP TEST SCKT NICKEL 28 PINS |
auf Bestellung 7 Stücke: Lieferzeit 10-14 Tag (e) |
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28-526-10 | Aries Electronics |
Description: CONN IC DIP SOCKET ZIF 28POS TINPackaging: Bulk Features: Closed Frame Mounting Type: Through Hole Type: DIP, ZIF (ZIP) Operating Temperature: -55°C ~ 105°C Number of Positions or Pins (Grid): 28 (2 x 14) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Beryllium Copper Part Status: Active |
auf Bestellung 33 Stücke: Lieferzeit 10-14 Tag (e) |
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28-526-11 | Aries Electronics |
Description: CONN IC DIP SOCKET ZIF 28POS GLDFeatures: Closed Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, ZIF (ZIP) Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 28 (2 x 14) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Beryllium Copper Part Status: Active |
auf Bestellung 22 Stücke: Lieferzeit 10-14 Tag (e) |
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| 28-6551-10* | Aries Electronics |
IC & Component Sockets |
auf Bestellung 2 Stücke: Lieferzeit 10-14 Tag (e) |
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| 28-6552-10* | Aries Electronics |
IC & Component Sockets |
auf Bestellung 36 Stücke: Lieferzeit 10-14 Tag (e) |
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| 28-6553-10* | Aries Electronics |
IC & Component Sockets |
auf Bestellung 1 Stücke: Lieferzeit 10-14 Tag (e) |
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28-6554-10 | Aries Electronics |
Description: CONN IC DIP SOCKET ZIF 28POS TINPackaging: Tube Features: Closed Frame Mounting Type: Through Hole Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 28 (2 x 14) Termination: Solder Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 200.0µin (5.08µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Beryllium Copper Part Status: Active |
auf Bestellung 201 Stücke: Lieferzeit 10-14 Tag (e) |
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28-6554-11 | Aries Electronics |
Description: CONN IC DIP SOCKET ZIF 28POS GLDPackaging: Bulk Features: Closed Frame Mounting Type: Through Hole Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 28 (2 x 14) Termination: Solder Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Material - Post: Beryllium Copper Part Status: Active |
auf Bestellung 66 Stücke: Lieferzeit 10-14 Tag (e) |
|
| Adapter SO8/DIP zum Programmieren (ZIF SO8/DIP8 150mil) Produktcode: 58316
5
zu Favoriten hinzufügen
Lieblingsprodukt
|
Steckverbinder, Reihenklemmen > IC-Nullkraftsockel-Testsockel
Beschreibung: Adapter SO8/DIP
Anzahl der Kontakte: 8
Gruppe: Adapter
Beschreibung: Adapter SO8/DIP
Anzahl der Kontakte: 8
Gruppe: Adapter
auf Bestellung 2 St.:
Lieferzeit 21-28 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 4.7 EUR |
| IR2E01 Produktcode: 29369
zu Favoriten hinzufügen
Lieblingsprodukt
|
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Hersteller: IR
IC > IC LED-Treiber
Gehäuse: DIP-16
Versorgungsspannung Vcc, V: <18 В
Bemerkung: Treiber für Segment-Ziffern-Display mit seriellem Eingang
IC > IC LED-Treiber
Gehäuse: DIP-16
Versorgungsspannung Vcc, V: <18 В
Bemerkung: Treiber für Segment-Ziffern-Display mit seriellem Eingang
auf Bestellung 12 St.:
Lieferzeit 21-28 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 0.79 EUR |
| 10+ | 0.73 EUR |
| Nullkraftsockel 14pin (214-3345) Produktcode: 158778
2
zu Favoriten hinzufügen
Lieblingsprodukt
|
Hersteller: TEXTDOL
Steckverbinder, Reihenklemmen > IC-Nullkraftsockel-Testsockel
Beschreibung: Nullkraftsockel 14pin
Anzahl der Kontakte: 14
Gruppe: DIP Nullkraftsockel
Steckverbinder, Reihenklemmen > IC-Nullkraftsockel-Testsockel
Beschreibung: Nullkraftsockel 14pin
Anzahl der Kontakte: 14
Gruppe: DIP Nullkraftsockel
auf Bestellung 40 St.:
Lieferzeit 21-28 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 1.02 EUR |
| 10+ | 0.88 EUR |
| Nullkraftsockel 16pin (216-3341) Produktcode: 158779
2
zu Favoriten hinzufügen
Lieblingsprodukt
|
Hersteller: TEXTDOL
Steckverbinder, Reihenklemmen > IC-Nullkraftsockel-Testsockel
Beschreibung: Nullkraftsockel 16pin
Anzahl der Kontakte: 16
Gruppe: DIP Nullkraftsockel
Steckverbinder, Reihenklemmen > IC-Nullkraftsockel-Testsockel
Beschreibung: Nullkraftsockel 16pin
Anzahl der Kontakte: 16
Gruppe: DIP Nullkraftsockel
auf Bestellung 1 St.:
Lieferzeit 21-28 Tag (e)
erwartet 50 St.:
50 St. - erwartet| Anzahl | Privatkunde |
|---|---|
| 1+ | 1.09 EUR |
| 10+ | 0.98 EUR |
| Nullkraftsockel 18pin (ZIF 218-3341) Produktcode: 45747
1
zu Favoriten hinzufügen
Lieblingsprodukt
|
Hersteller: TEXTDOL
Steckverbinder, Reihenklemmen > IC-Nullkraftsockel-Testsockel
Beschreibung: Nullkraftsockel 18pin schmal
Anzahl der Kontakte: 18
Gruppe: DIP Nullkraftsockel
Steckverbinder, Reihenklemmen > IC-Nullkraftsockel-Testsockel
Beschreibung: Nullkraftsockel 18pin schmal
Anzahl der Kontakte: 18
Gruppe: DIP Nullkraftsockel
auf Bestellung 36 St.:
Lieferzeit 21-28 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 4 EUR |
| 10+ | 0.86 EUR |
| Nullkraftsockel 28pin schmal 0,3 (ZIF 228-3341) Produktcode: 86705
2
zu Favoriten hinzufügen
Lieblingsprodukt
|
Hersteller: TEXTDOL
Steckverbinder, Reihenklemmen > IC-Nullkraftsockel-Testsockel
Beschreibung: Nullkraftsockel 28pin schmal 0,3
Anzahl der Kontakte: 28
Gruppe: DIP Nullkraftsockel
Steckverbinder, Reihenklemmen > IC-Nullkraftsockel-Testsockel
Beschreibung: Nullkraftsockel 28pin schmal 0,3
Anzahl der Kontakte: 28
Gruppe: DIP Nullkraftsockel
auf Bestellung 5 St.:
Lieferzeit 21-28 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 2.38 EUR |
| 10+ | 1.71 EUR |
| Nullkraftsockel 32pin breit (ZIF 232-3345) Produktcode: 60247
2
zu Favoriten hinzufügen
Lieblingsprodukt
|
Hersteller: TEXTDOL
Steckverbinder, Reihenklemmen > IC-Nullkraftsockel-Testsockel
Beschreibung: Nullkraftsockel 32pin
Anzahl der Kontakte: 32
Gruppe: DIP Nullkraftsockel
Steckverbinder, Reihenklemmen > IC-Nullkraftsockel-Testsockel
Beschreibung: Nullkraftsockel 32pin
Anzahl der Kontakte: 32
Gruppe: DIP Nullkraftsockel
auf Bestellung 8 St.:
Lieferzeit 21-28 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 4.47 EUR |
| 10+ | 1.87 EUR |
| Nullkraftsockel 40pin (ZIF 240-3345) Produktcode: 54221
1
zu Favoriten hinzufügen
Lieblingsprodukt
|
Hersteller: TEXTDOL
Steckverbinder, Reihenklemmen > IC-Nullkraftsockel-Testsockel
Beschreibung: Nullkraftsockel 40pin, 21x65mm
Anzahl der Kontakte: 40
Gruppe: DIP Nullkraftsockel
Steckverbinder, Reihenklemmen > IC-Nullkraftsockel-Testsockel
Beschreibung: Nullkraftsockel 40pin, 21x65mm
Anzahl der Kontakte: 40
Gruppe: DIP Nullkraftsockel
Produkt ist nicht verfügbar
erwartet: 20 St.
- 20 St. - erwartet 09.08.2026
| Anzahl | Privatkunde |
|---|---|
| 1+ | 3.57 EUR |
| 1-84984-6 |
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Hersteller: TE Connectivity
FFC & FPC Connectors 1mm DIP V ASSY 16P
FFC & FPC Connectors 1mm DIP V ASSY 16P
auf Bestellung 4145 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 1.69 EUR |
| 10+ | 1.44 EUR |
| 26+ | 1.38 EUR |
| 104+ | 1.29 EUR |
| 260+ | 1.17 EUR |
| 520+ | 1.05 EUR |
| 1014+ | 0.96 EUR |
| 214-3339-19-0602J |
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Hersteller: 3M Electronic Solutions Division
IC & Component Sockets RECPT FOR DIP SOCKET 14 Contact Qty.
IC & Component Sockets RECPT FOR DIP SOCKET 14 Contact Qty.
auf Bestellung 30 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 59.8 EUR |
| 10+ | 49.28 EUR |
| 20+ | 46.24 EUR |
| 50+ | 44.82 EUR |
| 100+ | 43.65 EUR |
| 200+ | 42.47 EUR |
| 216-3340-00-0602J |
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Hersteller: 3M
Description: CONN IC DIP SOCKET ZIF 16POS GLD
Packaging: Tube
Features: Closed Frame
Mounting Type: Connector
Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Press-Fit
Housing Material: Polysulfone (PSU), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Description: CONN IC DIP SOCKET ZIF 16POS GLD
Packaging: Tube
Features: Closed Frame
Mounting Type: Connector
Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Press-Fit
Housing Material: Polysulfone (PSU), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 151 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 54.6 EUR |
| 10+ | 46.4 EUR |
| 30+ | 42.94 EUR |
| 50+ | 41.41 EUR |
| 100+ | 39.44 EUR |
| 216-3340-19-0602J |
![]() |
Hersteller: 3M Electronic Solutions Division
IC & Component Sockets RECPT FOR DIP SOCKET 16 Contact Qty.
IC & Component Sockets RECPT FOR DIP SOCKET 16 Contact Qty.
auf Bestellung 35 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 59.83 EUR |
| 10+ | 48.64 EUR |
| 20+ | 45.58 EUR |
| 50+ | 45.49 EUR |
| 100+ | 43.98 EUR |
| 200+ | 43.19 EUR |
| 218-3341-00-0602J |
![]() |
Hersteller: 3M
Description: CONN IC DIP SOCKET ZIF 18POS GLD
Packaging: Tray
Features: Closed Frame
Mounting Type: Connector
Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Press-Fit
Housing Material: Polysulfone (PSU), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Description: CONN IC DIP SOCKET ZIF 18POS GLD
Packaging: Tray
Features: Closed Frame
Mounting Type: Connector
Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Press-Fit
Housing Material: Polysulfone (PSU), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 8 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 51.42 EUR |
| 224-1275-00-0602J |
![]() |
Hersteller: 3M
Description: CONN IC DIP SOCKET ZIF 24POS GLD
Packaging: Tube
Features: Closed Frame
Mounting Type: Connector
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Press-Fit
Housing Material: Polysulfone (PSU), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Description: CONN IC DIP SOCKET ZIF 24POS GLD
Packaging: Tube
Features: Closed Frame
Mounting Type: Connector
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Press-Fit
Housing Material: Polysulfone (PSU), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 393 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 54.23 EUR |
| 10+ | 46.08 EUR |
| 30+ | 42.65 EUR |
| 50+ | 41.14 EUR |
| 100+ | 39.17 EUR |
| 250+ | 36.72 EUR |
| 224-5248-00-0602J |
![]() |
Hersteller: 3M
Description: CONN IC DIP SOCKET ZIF 24POS GLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Connector
Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Press-Fit
Housing Material: Polysulfone (PSU), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Description: CONN IC DIP SOCKET ZIF 24POS GLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Connector
Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Press-Fit
Housing Material: Polysulfone (PSU), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 63 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 68.32 EUR |
| 10+ | 58.07 EUR |
| 30+ | 53.74 EUR |
| 50+ | 51.84 EUR |
| 228-1277-19-0602J |
![]() |
Hersteller: 3M Electronic Solutions Division
IC & Component Sockets RECPT FOR DIP SOCKET 28 Contact Qty.
IC & Component Sockets RECPT FOR DIP SOCKET 28 Contact Qty.
auf Bestellung 39 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 51.62 EUR |
| 228-1277-39-0602J |
![]() |
Hersteller: 3M Electronic Solutions Division
IC & Component Sockets RECPT FOR DIP SOCKET 28 Contact Qty.
IC & Component Sockets RECPT FOR DIP SOCKET 28 Contact Qty.
auf Bestellung 10 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 72.91 EUR |
| 10+ | 61.95 EUR |
| 20+ | 59.38 EUR |
| 50+ | 58.18 EUR |
| 100+ | 56.6 EUR |
| 200+ | 54.62 EUR |
| 228-1290-00-0602J |
![]() |
Hersteller: 3M
Description: CONN IC DIP SOCKET ZIF 28POS GLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Connector
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Press-Fit
Housing Material: Polysulfone (PSU), Glass Filled
Pitch - Mating: 0.070" (1.78mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Description: CONN IC DIP SOCKET ZIF 28POS GLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Connector
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Press-Fit
Housing Material: Polysulfone (PSU), Glass Filled
Pitch - Mating: 0.070" (1.78mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 5 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 57.49 EUR |
| 228-1290-00-0602J |
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Hersteller: 3M Electronic Solutions Division
IC & Component Sockets 0.070" DIP SOCKET 28 Contact Qty.
IC & Component Sockets 0.070" DIP SOCKET 28 Contact Qty.
auf Bestellung 42 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 51.5 EUR |
| 10+ | 44.48 EUR |
| 20+ | 39.27 EUR |
| 228-4817-00-0602J |
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Hersteller: 3M
Description: CONN IC DIP SOCKET ZIF 28POS GLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Connector
Type: DIP, ZIF (ZIP), 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Press-Fit
Housing Material: Polysulfone (PSU), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Description: CONN IC DIP SOCKET ZIF 28POS GLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Connector
Type: DIP, ZIF (ZIP), 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Press-Fit
Housing Material: Polysulfone (PSU), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 28 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 62.17 EUR |
| 10+ | 52.82 EUR |
| 228-4817-09-0602J |
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Hersteller: 3M Electronic Solutions Division
IC & Component Sockets RECPT FOR DIP SOCKET 28 Contact Qty.
IC & Component Sockets RECPT FOR DIP SOCKET 28 Contact Qty.
auf Bestellung 5 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 56.07 EUR |
| 10+ | 46.71 EUR |
| 20+ | 43.23 EUR |
| 50+ | 41.7 EUR |
| 100+ | 39.69 EUR |
| 200+ | 37.22 EUR |
| 232-1285-00-0602J |
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Hersteller: 3M
Description: CONN IC DIP SOCKET ZIF 32POS GLD
Packaging: Tube
Features: Closed Frame
Mounting Type: Connector
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Press-Fit
Housing Material: Polysulfone (PSU), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Description: CONN IC DIP SOCKET ZIF 32POS GLD
Packaging: Tube
Features: Closed Frame
Mounting Type: Connector
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Press-Fit
Housing Material: Polysulfone (PSU), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 3 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 54.75 EUR |
| 232-1287-00-0602J |
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Hersteller: 3M
Description: CONN IC DIP SOCKET ZIF 32POS GLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Connector
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Press-Fit
Housing Material: Polysulfone (PSU), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Description: CONN IC DIP SOCKET ZIF 32POS GLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Connector
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Press-Fit
Housing Material: Polysulfone (PSU), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 4 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 82.42 EUR |
| 232-1291-00-0602J |
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Hersteller: 3M Electronic Solutions Division
IC & Component Sockets 0.070" DIP SOCKET 32 Contact Qty.
IC & Component Sockets 0.070" DIP SOCKET 32 Contact Qty.
auf Bestellung 12 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 72.73 EUR |
| 10+ | 61.81 EUR |
| 20+ | 56.91 EUR |
| 50+ | 55.73 EUR |
| 100+ | 54.62 EUR |
| 200+ | 53.32 EUR |
| 24-3551-11 |
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Hersteller: Aries Electronics
IC & Component Sockets DIP TEST SCKT GOLD 24 PINS
IC & Component Sockets DIP TEST SCKT GOLD 24 PINS
auf Bestellung 47 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 86.94 EUR |
| 10+ | 65.76 EUR |
| 24-3553-10 |
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Hersteller: Aries Electronics
IC & Component Sockets DIP TEST SCKT TIN 24 PINS
IC & Component Sockets DIP TEST SCKT TIN 24 PINS
auf Bestellung 32 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 31.63 EUR |
| 10+ | 27.39 EUR |
| 20+ | 25.97 EUR |
| 50+ | 25.6 EUR |
| 100+ | 22.57 EUR |
| 200+ | 21.07 EUR |
| 500+ | 20.63 EUR |
| 24-3554-10 |
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Hersteller: Aries Electronics
IC & Component Sockets DIP TEST SCKT TIN 24 PINS
IC & Component Sockets DIP TEST SCKT TIN 24 PINS
auf Bestellung 12 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 31.61 EUR |
| 10+ | 27.39 EUR |
| 20+ | 25.97 EUR |
| 50+ | 25.6 EUR |
| 100+ | 22.57 EUR |
| 200+ | 21.07 EUR |
| 500+ | 20.63 EUR |
| 24-526-10 |
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Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 24POS TIN
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP)
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Description: CONN IC DIP SOCKET ZIF 24POS TIN
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP)
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 82 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 23.54 EUR |
| 17+ | 19.27 EUR |
| 34+ | 18.34 EUR |
| 51+ | 17.83 EUR |
| 24-526-11 |
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Hersteller: Aries Electronics
IC & Component Sockets Zero-Insertion-Force Socket
IC & Component Sockets Zero-Insertion-Force Socket
auf Bestellung 15 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 44.59 EUR |
| 10+ | 37.89 EUR |
| 17+ | 34.81 EUR |
| 51+ | 33.9 EUR |
| 102+ | 31.04 EUR |
| 255+ | 30.5 EUR |
| 510+ | 30.23 EUR |
| 24-6553-10 |
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Hersteller: Aries Electronics
IC & Component Sockets DIP TEST SCKT TIN 24 PINS
IC & Component Sockets DIP TEST SCKT TIN 24 PINS
auf Bestellung 33 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 31.63 EUR |
| 10+ | 27.39 EUR |
| 20+ | 25.97 EUR |
| 50+ | 25.6 EUR |
| 100+ | 22.57 EUR |
| 200+ | 21.07 EUR |
| 500+ | 20.63 EUR |
| 24-6554-10 |
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Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 24POS TIN
Packaging: Tube
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Description: CONN IC DIP SOCKET ZIF 24POS TIN
Packaging: Tube
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 42 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 26.64 EUR |
| 10+ | 22.65 EUR |
| 30+ | 20.96 EUR |
| 24-6554-11 |
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Hersteller: Aries Electronics
IC & Component Sockets 24 PIN W/HANDLE
IC & Component Sockets 24 PIN W/HANDLE
auf Bestellung 43 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 65.76 EUR |
| 24-6554-11 |
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Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 24POS GLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Material - Post: Beryllium Copper
Part Status: Active
Description: CONN IC DIP SOCKET ZIF 24POS GLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 137 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 81.35 EUR |
| 10+ | 69.14 EUR |
| 30+ | 63.99 EUR |
| 50+ | 61.73 EUR |
| 100+ | 58.79 EUR |
| 24-6554-18 |
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Hersteller: Aries Electronics
IC & Component Sockets FORCE DIP TEST SCKT HIGH TEMP 24 PINS
IC & Component Sockets FORCE DIP TEST SCKT HIGH TEMP 24 PINS
auf Bestellung 16 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 227.74 EUR |
| 10+ | 193.6 EUR |
| 20+ | 174.53 EUR |
| 50+ | 172.12 EUR |
| 100+ | 168.35 EUR |
| 24-6572-11 |
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Hersteller: Aries Electronics
IC & Component Sockets QUICK RELEASE 24 PIN GOLD
IC & Component Sockets QUICK RELEASE 24 PIN GOLD
auf Bestellung 19 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 63.05 EUR |
| 12+ | 53.6 EUR |
| 24+ | 49.55 EUR |
| 60+ | 48.3 EUR |
| 108+ | 45.99 EUR |
| 252+ | 44.72 EUR |
| 504+ | 44.23 EUR |
| 240-1280-00-0602J |
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Hersteller: 3M
Description: CONN IC DIP SOCKET ZIF 40POS GLD
Packaging: Tube
Features: Closed Frame
Mounting Type: Connector
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Press-Fit
Housing Material: Polysulfone (PSU), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Description: CONN IC DIP SOCKET ZIF 40POS GLD
Packaging: Tube
Features: Closed Frame
Mounting Type: Connector
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Press-Fit
Housing Material: Polysulfone (PSU), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 77 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 64.51 EUR |
| 10+ | 54.84 EUR |
| 30+ | 50.74 EUR |
| 50+ | 48.94 EUR |
| 240-1288-00-0602J |
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Hersteller: 3M
Description: CONN IC DIP SOCKET ZIF 40POS GLD
Packaging: Tube
Features: Closed Frame
Mounting Type: Connector
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Press-Fit
Housing Material: Polysulfone (PSU), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Description: CONN IC DIP SOCKET ZIF 40POS GLD
Packaging: Tube
Features: Closed Frame
Mounting Type: Connector
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Press-Fit
Housing Material: Polysulfone (PSU), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 102 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 93.58 EUR |
| 10+ | 79.54 EUR |
| 30+ | 73.6 EUR |
| 50+ | 71 EUR |
| 100+ | 67.62 EUR |
| 240-1288-00-0602J |
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Hersteller: 3M Electronic Solutions Division
IC & Component Sockets 0.100" DIP SOCKET 40 Contact Qty.
IC & Component Sockets 0.100" DIP SOCKET 40 Contact Qty.
auf Bestellung 29 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 87.44 EUR |
| 10+ | 75.86 EUR |
| 20+ | 70.03 EUR |
| 50+ | 69.53 EUR |
| 100+ | 67.04 EUR |
| 200+ | 66.89 EUR |
| 240-3639-00-0602J |
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Hersteller: 3M
Description: CONN IC DIP SOCKET ZIF 40POS GLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Connector
Type: DIP, ZIF (ZIP), 1.0" (25.40mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Press-Fit
Housing Material: Polysulfone (PSU), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Description: CONN IC DIP SOCKET ZIF 40POS GLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Connector
Type: DIP, ZIF (ZIP), 1.0" (25.40mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Press-Fit
Housing Material: Polysulfone (PSU), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 16 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 86.42 EUR |
| 10+ | 73.43 EUR |
| 240-3639-19-0602J |
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Hersteller: 3M Electronic Solutions Division
IC & Component Sockets RECPT FOR DIP SOCKET 40 Contact Qty.
IC & Component Sockets RECPT FOR DIP SOCKET 40 Contact Qty.
auf Bestellung 13 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 84.87 EUR |
| 10+ | 72.11 EUR |
| 20+ | 68.72 EUR |
| 50+ | 67.32 EUR |
| 100+ | 65.81 EUR |
| 200+ | 63.58 EUR |
| 242-1281-00-0602J |
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Hersteller: 3M
Description: CONN IC DIP SOCKET ZIF 42POS GLD
Packaging: Tube
Features: Closed Frame
Mounting Type: Connector
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 42 (2 x 21)
Termination: Press-Fit
Housing Material: Polysulfone (PSU), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Description: CONN IC DIP SOCKET ZIF 42POS GLD
Packaging: Tube
Features: Closed Frame
Mounting Type: Connector
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 42 (2 x 21)
Termination: Press-Fit
Housing Material: Polysulfone (PSU), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 59.39 EUR |
| 242-1281-09-0602J |
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Hersteller: 3M Electronic Solutions Division
IC & Component Sockets RECPT FOR DIP SOCKET 42 Contact Qty.
IC & Component Sockets RECPT FOR DIP SOCKET 42 Contact Qty.
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 43.07 EUR |
| 10+ | 31.94 EUR |
| 20+ | 29.65 EUR |
| 50+ | 29.13 EUR |
| 100+ | 28.02 EUR |
| 242-1289-00-0602J |
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Hersteller: 3M
Description: CONN IC DIP SOCKET ZIF 42POS GLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Connector
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 42 (2 x 21)
Termination: Press-Fit
Housing Material: Polysulfone (PSU), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Description: CONN IC DIP SOCKET ZIF 42POS GLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Connector
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 42 (2 x 21)
Termination: Press-Fit
Housing Material: Polysulfone (PSU), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 3 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 94.22 EUR |
| 242-1293-00-0602J |
![]() |
Hersteller: 3M
Description: CONN IC DIP SOCKET ZIF 42POS GLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Connector
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 42 (2 x 21)
Termination: Press-Fit
Housing Material: Polysulfone (PSU), Glass Filled
Pitch - Mating: 0.070" (1.78mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Description: CONN IC DIP SOCKET ZIF 42POS GLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Connector
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 42 (2 x 21)
Termination: Press-Fit
Housing Material: Polysulfone (PSU), Glass Filled
Pitch - Mating: 0.070" (1.78mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 27 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 71.69 EUR |
| 10+ | 60.92 EUR |
| 242-1293-09-0602J |
![]() |
Hersteller: 3M Electronic Solutions Division
IC & Component Sockets RECPT FOR DIP SOCKET 42 Contact Qty.
IC & Component Sockets RECPT FOR DIP SOCKET 42 Contact Qty.
auf Bestellung 11 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 57.7 EUR |
| 10+ | 49.03 EUR |
| 20+ | 43.35 EUR |
| 50+ | 42.03 EUR |
| 100+ | 40.92 EUR |
| 200+ | 39.69 EUR |
| 500+ | 39.21 EUR |
| 248-1282-00-0602J |
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Hersteller: 3M
Description: CONN IC DIP SOCKET ZIF 48POS GLD
Packaging: Tube
Features: Closed Frame
Mounting Type: Connector
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 48 (2 x 24)
Termination: Press-Fit
Housing Material: Polysulfone (PSU), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Description: CONN IC DIP SOCKET ZIF 48POS GLD
Packaging: Tube
Features: Closed Frame
Mounting Type: Connector
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 48 (2 x 24)
Termination: Press-Fit
Housing Material: Polysulfone (PSU), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 521 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 77.16 EUR |
| 10+ | 65.58 EUR |
| 25+ | 61.48 EUR |
| 50+ | 58.55 EUR |
| 100+ | 55.75 EUR |
| 250+ | 52.26 EUR |
| 248-1282-29-0602J |
![]() |
Hersteller: 3M Electronic Solutions Division
IC & Component Sockets RECPT FOR DIP SOCKET 48 Contact Qty.
IC & Component Sockets RECPT FOR DIP SOCKET 48 Contact Qty.
auf Bestellung 27 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 62.23 EUR |
| 10+ | 59.5 EUR |
| 20+ | 55.53 EUR |
| 100+ | 54.62 EUR |
| 200+ | 53.82 EUR |
| 251-5949-02-0602 |
![]() |
Hersteller: 3M Electronic Solutions Division
IC & Component Sockets ZIP STRIP SCKT AXIAL LEAD
IC & Component Sockets ZIP STRIP SCKT AXIAL LEAD
auf Bestellung 7 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 195.85 EUR |
| 10+ | 195.17 EUR |
| 20+ | 174.09 EUR |
| 264-4493-09-0602J |
![]() |
Hersteller: 3M Electronic Solutions Division
IC & Component Sockets RECPT FOR DIP SOCKET 64 Contact Qty.
IC & Component Sockets RECPT FOR DIP SOCKET 64 Contact Qty.
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 100.32 EUR |
| 10+ | 85.26 EUR |
| 20+ | 82.98 EUR |
| 50+ | 80.82 EUR |
| 100+ | 78.4 EUR |
| 200+ | 78.08 EUR |
| 28-3551-11 |
![]() |
Hersteller: Aries Electronics
IC & Component Sockets DIP TEST SCKT GOLD 28 PINS
IC & Component Sockets DIP TEST SCKT GOLD 28 PINS
auf Bestellung 57 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 99.38 EUR |
| 9+ | 71.32 EUR |
| 28-3553-10* |
![]() |
Hersteller: Aries Electronics
IC & Component Sockets
IC & Component Sockets
auf Bestellung 30 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 36.08 EUR |
| 9+ | 31.29 EUR |
| 27+ | 29.65 EUR |
| 54+ | 29.21 EUR |
| 108+ | 25.8 EUR |
| 252+ | 24.06 EUR |
| 504+ | 23.54 EUR |
| 28-3554-10 |
![]() |
Hersteller: Aries Electronics
IC & Component Sockets DIP TEST SCKT TIN 28 PINS
IC & Component Sockets DIP TEST SCKT TIN 28 PINS
auf Bestellung 20 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 36.08 EUR |
| 9+ | 31.29 EUR |
| 27+ | 29.65 EUR |
| 54+ | 29.21 EUR |
| 108+ | 25.8 EUR |
| 252+ | 24.06 EUR |
| 504+ | 23.54 EUR |
| 28-3554-16 |
![]() |
Hersteller: Aries Electronics
IC & Component Sockets DIP TEST SCKT NICKEL 28 PINS
IC & Component Sockets DIP TEST SCKT NICKEL 28 PINS
auf Bestellung 7 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 120.4 EUR |
| 9+ | 96.43 EUR |
| 27+ | 94.72 EUR |
| 54+ | 92.46 EUR |
| 108+ | 90.11 EUR |
| 252+ | 89.76 EUR |
| 28-526-10 |
![]() |
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 28POS TIN
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP)
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Description: CONN IC DIP SOCKET ZIF 28POS TIN
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP)
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 33 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 23.79 EUR |
| 15+ | 19.65 EUR |
| 30+ | 18.72 EUR |
| 28-526-11 |
![]() |
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 28POS GLD
Features: Closed Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP)
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Description: CONN IC DIP SOCKET ZIF 28POS GLD
Features: Closed Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP)
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 22 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 47.31 EUR |
| 15+ | 39.08 EUR |
| 28-6551-10* |
![]() |
Hersteller: Aries Electronics
IC & Component Sockets
IC & Component Sockets
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 36.08 EUR |
| 9+ | 31.29 EUR |
| 27+ | 29.65 EUR |
| 54+ | 29.21 EUR |
| 108+ | 25.8 EUR |
| 252+ | 24.06 EUR |
| 504+ | 23.54 EUR |
| 28-6552-10* |
![]() |
Hersteller: Aries Electronics
IC & Component Sockets
IC & Component Sockets
auf Bestellung 36 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 36.08 EUR |
| 9+ | 31.29 EUR |
| 27+ | 29.65 EUR |
| 54+ | 29.21 EUR |
| 108+ | 25.8 EUR |
| 252+ | 24.06 EUR |
| 504+ | 23.54 EUR |
| 28-6553-10* |
![]() |
Hersteller: Aries Electronics
IC & Component Sockets
IC & Component Sockets
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 36.08 EUR |
| 9+ | 31.29 EUR |
| 27+ | 29.65 EUR |
| 54+ | 29.21 EUR |
| 108+ | 25.8 EUR |
| 252+ | 24.06 EUR |
| 504+ | 23.54 EUR |
| 28-6554-10 |
![]() |
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 28POS TIN
Packaging: Tube
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Description: CONN IC DIP SOCKET ZIF 28POS TIN
Packaging: Tube
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 201 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 31.71 EUR |
| 18+ | 25.85 EUR |
| 27+ | 25.12 EUR |
| 54+ | 23.92 EUR |
| 108+ | 22.78 EUR |
| 28-6554-11 |
![]() |
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 28POS GLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Material - Post: Beryllium Copper
Part Status: Active
Description: CONN IC DIP SOCKET ZIF 28POS GLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 66 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 87.57 EUR |
| 18+ | 71.4 EUR |
| 27+ | 69.38 EUR |
| 54+ | 66.07 EUR |
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