Suchergebnisse für "DIP ZIF" : > 60

Wählen Sie Seite:   1 2  Nächste Seite >> ]
Art der Ansicht :
Foto Bezeichnung Hersteller Beschreibung Verfügbarkeit
Preis
Adapter SO8/DIP für Programmierung (ZIF SO8/DIP8 150mil)
+1
Adapter SO8/DIP für Programmierung (ZIF SO8/DIP8 150mil)
Produktcode: 58316
zu Favoriten hinzufügen Lieblingsprodukt

Steckverbinder, Reihenklemmen > IC-Nullkraftsockel-Testsockel
Опис: Перехідник SO8/DIP
К-сть контактів: 8
Група: Перехідник
auf Bestellung 16 Stück:
Lieferzeit 21-28 Tag (e)
erwartet 20 Stück:
20 Stück - erwartet 15.08.2025
1+3.6 EUR
Im Einkaufswagen  Stück im Wert von  UAH
ZIF 214-3345 Панель с нулевым усилием 14pin ZIF 214-3345 Панель с нулевым усилием 14pin
Produktcode: 158778
zu Favoriten hinzufügen Lieblingsprodukt

TEXTDOL Steckverbinder, Reihenklemmen > IC-Nullkraftsockel-Testsockel
Опис: Панель з нульовим зусиллям 14pin
К-сть контактів: 14
Група: DIP з нульовим зусиллям
auf Bestellung 33 Stück:
Lieferzeit 21-28 Tag (e)
Im Einkaufswagen  Stück im Wert von  UAH
ZIF 218-3341 Platte steckwiderstandsfrei 18pin ZIF 218-3341 Platte steckwiderstandsfrei 18pin
Produktcode: 45747
zu Favoriten hinzufügen Lieblingsprodukt

TEXTDOL Steckverbinder, Reihenklemmen > IC-Nullkraftsockel-Testsockel
Опис: Platte steckwiderstandsfrei 18pin
К-сть контактів: 18
Група: DIP з нульовим зусиллям
auf Bestellung 3 Stück:
Lieferzeit 21-28 Tag (e)
1+3.36 EUR
Im Einkaufswagen  Stück im Wert von  UAH
ZIF 220-3341 Platte steckwiderstandsfrei 20pin
+1
ZIF 220-3341 Platte steckwiderstandsfrei 20pin
Produktcode: 45191
zu Favoriten hinzufügen Lieblingsprodukt

3M Steckverbinder, Reihenklemmen > IC-Nullkraftsockel-Testsockel
Опис: Platte steckwiderstandsfrei 20pin
К-сть контактів: 20
Група: DIP з нульовим зусиллям
auf Bestellung 11 Stück:
Lieferzeit 21-28 Tag (e)
1+2.76 EUR
Im Einkaufswagen  Stück im Wert von  UAH
ZIF 228-3341 Platte steckwiderstandsfrei 28pin schmal 0,3" ZIF 228-3341 Platte steckwiderstandsfrei 28pin schmal 0,3"
Produktcode: 86705
zu Favoriten hinzufügen Lieblingsprodukt

TEXTDOL Steckverbinder, Reihenklemmen > IC-Nullkraftsockel-Testsockel
Опис: Platte steckwiderstandsfrei 28pin schmal 0,3"
К-сть контактів: 28
Група: DIP з нульовим зусиллям
Produkt ist nicht verfügbar
erwartet: 30 Stück
30 Stück - erwartet 28.07.2025
1+2 EUR
Im Einkaufswagen  Stück im Wert von  UAH
ZIF 232-3345 Platte steckwiderstandsfrei 32pin
+1
ZIF 232-3345 Platte steckwiderstandsfrei 32pin
Produktcode: 60247
zu Favoriten hinzufügen Lieblingsprodukt

TEXTDOL Steckverbinder, Reihenklemmen > IC-Nullkraftsockel-Testsockel
Опис: Platte steckwiderstandsfrei 32pin
К-сть контактів: 32
Група: DIP з нульовим зусиллям
auf Bestellung 21 Stück:
Lieferzeit 21-28 Tag (e)
1+3.76 EUR
Im Einkaufswagen  Stück im Wert von  UAH
ZIF 240-3345 Platte steckwiderstandsfrei 40pin ZIF 240-3345 Platte steckwiderstandsfrei 40pin
Produktcode: 54221
zu Favoriten hinzufügen Lieblingsprodukt

TEXTDOL Steckverbinder, Reihenklemmen > IC-Nullkraftsockel-Testsockel
Опис: Platte steckwiderstandsfrei 40pin
К-сть контактів: 40
Група: DIP з нульовим зусиллям
auf Bestellung 7 Stück:
Lieferzeit 21-28 Tag (e)
1+3 EUR
Im Einkaufswagen  Stück im Wert von  UAH
Панель с нулевым усилием 16pin (216-3341) Панель с нулевым усилием 16pin (216-3341)
Produktcode: 158779
zu Favoriten hinzufügen Lieblingsprodukt

TEXTDOL Steckverbinder, Reihenklemmen > IC-Nullkraftsockel-Testsockel
Опис: Панель з нульовим зусиллям 16pin
К-сть контактів: 16
Група: DIP з нульовим зусиллям
Produkt ist nicht verfügbar
erwartet: 40 Stück
40 Stück - erwartet 28.07.2025
Im Einkaufswagen  Stück im Wert von  UAH
1-84984-6 1-84984-6 TE Connectivity ENG_CD_84984_E3-2068777.pdf FFC & FPC Connectors 1mm DIP V ASSY 16P
auf Bestellung 5070 Stücke:
Lieferzeit 10-14 Tag (e)
3+1.03 EUR
52+1.02 EUR
104+0.86 EUR
260+0.81 EUR
520+0.77 EUR
1014+0.73 EUR
Mindestbestellmenge: 3
Im Einkaufswagen  Stück im Wert von  UAH
214-3339-00-0602J 214-3339-00-0602J 3M 3mtm-dip-sockets-100-2-54-mm-ts0365.pdf Description: CONN IC DIP SOCKET ZIF 14POS GLD
Packaging: Tube
Features: Closed Frame
Mounting Type: Connector
Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Press-Fit
Housing Material: Polysulfone (PSU), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 13 Stücke:
Lieferzeit 10-14 Tag (e)
1+36.27 EUR
10+30.84 EUR
Im Einkaufswagen  Stück im Wert von  UAH
216-3340-00-0602J 216-3340-00-0602J 3M 3mtm-dip-sockets-100-2-54-mm-ts0365.pdf Description: CONN IC DIP SOCKET ZIF 16POS GLD
Packaging: Tube
Features: Closed Frame
Mounting Type: Connector
Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Press-Fit
Housing Material: Polysulfone (PSU), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 632 Stücke:
Lieferzeit 10-14 Tag (e)
1+38.86 EUR
10+33.03 EUR
30+30.57 EUR
50+29.49 EUR
100+28.08 EUR
250+26.32 EUR
500+25.07 EUR
Im Einkaufswagen  Stück im Wert von  UAH
216-3340-09-0602J 216-3340-09-0602J 3M Electronic Solutions Division d61ab5ff64f47a182b213d85c15f8e132aa4989a-2951603.pdf IC & Component Sockets RECPT FOR DIP SOCKET 16 Contact Qty.
auf Bestellung 46 Stücke:
Lieferzeit 10-14 Tag (e)
1+41.43 EUR
10+27.67 EUR
Im Einkaufswagen  Stück im Wert von  UAH
218-3341-00-0602J 218-3341-00-0602J 3M Electronic Solutions Division 2cd3aad061e88fa5fffa81fd9cf1f5c3f8dc8ac1-2951973.pdf IC & Component Sockets 0.100" DIP SOCKET 18 Contact Qty.
auf Bestellung 48 Stücke:
Lieferzeit 10-14 Tag (e)
1+41.82 EUR
10+27.95 EUR
20+27.93 EUR
Im Einkaufswagen  Stück im Wert von  UAH
218-3341-00-0602J 218-3341-00-0602J 3M 3mtm-dip-sockets-100-2-54-mm-ts0365.pdf Description: CONN IC DIP SOCKET ZIF 18POS GLD
Packaging: Tray
Features: Closed Frame
Mounting Type: Connector
Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Press-Fit
Housing Material: Polysulfone (PSU), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 52 Stücke:
Lieferzeit 10-14 Tag (e)
1+39.93 EUR
10+33.94 EUR
30+31.41 EUR
50+30.3 EUR
Im Einkaufswagen  Stück im Wert von  UAH
220-3342-00-0602J 220-3342-00-0602J 3M 3mtm-dip-sockets-100-2-54-mm-ts0365.pdf Description: CONN IC DIP SOCKET ZIF 20POS GLD
Packaging: Tube
Features: Closed Frame
Mounting Type: Connector
Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Press-Fit
Housing Material: Polysulfone (PSU), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 421 Stücke:
Lieferzeit 10-14 Tag (e)
1+38.4 EUR
10+32.63 EUR
30+30.2 EUR
50+29.13 EUR
100+27.74 EUR
250+26 EUR
Im Einkaufswagen  Stück im Wert von  UAH
220-3342-19-0602J 220-3342-19-0602J 3M Electronic Solutions Division ab4dda27d7e6130f0ae001e9e4913b91affc513b-2951372.pdf IC & Component Sockets RECPT FOR DIP SOCKET 20 Contact Qty.
auf Bestellung 28 Stücke:
Lieferzeit 10-14 Tag (e)
1+43.26 EUR
10+39.71 EUR
Im Einkaufswagen  Stück im Wert von  UAH
222-3343-00-0602J 222-3343-00-0602J 3M 3mtm-dip-sockets-100-2-54-mm-ts0365.pdf Description: CONN IC DIP SOCKET ZIF 22POS GLD
Features: Closed Frame
Packaging: Tube
Mounting Type: Connector
Type: DIP, ZIF (ZIP), 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 22 (2 x 11)
Termination: Press-Fit
Housing Material: Polysulfone (PSU), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 8 Stücke:
Lieferzeit 10-14 Tag (e)
1+43.44 EUR
Im Einkaufswagen  Stück im Wert von  UAH
224-1275-00-0602J 224-1275-00-0602J 3M 3mtm-dip-sockets-100-2-54-mm-ts0365.pdf Description: CONN IC DIP SOCKET ZIF 24POS GLD
Features: Closed Frame
Packaging: Tube
Mounting Type: Connector
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Press-Fit
Housing Material: Polysulfone (PSU), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 309 Stücke:
Lieferzeit 10-14 Tag (e)
1+38.76 EUR
10+32.93 EUR
30+30.48 EUR
50+29.4 EUR
100+28 EUR
250+26.24 EUR
Im Einkaufswagen  Stück im Wert von  UAH
224-1286-00-0602J 224-1286-00-0602J 3M 3mtm-textooltm-universal-zip-dip-socket-ts0392.pdf Description: CONN IC DIP SOCKET ZIF 24POS GLD
Features: Closed Frame
Packaging: Tube
Mounting Type: Connector
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Press-Fit
Housing Material: Polysulfone (PSU), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 74 Stücke:
Lieferzeit 10-14 Tag (e)
1+50.3 EUR
10+42.75 EUR
30+39.56 EUR
50+38.16 EUR
Im Einkaufswagen  Stück im Wert von  UAH
224-5248-00-0602J 224-5248-00-0602J 3M 3mtm-dip-sockets-100-2-54-mm-ts0365.pdf Description: CONN IC DIP SOCKET ZIF 24POS GLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Connector
Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Press-Fit
Housing Material: Polysulfone (PSU), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 73 Stücke:
Lieferzeit 10-14 Tag (e)
1+51.39 EUR
10+43.68 EUR
30+40.43 EUR
50+39 EUR
Im Einkaufswagen  Stück im Wert von  UAH
228-1277-00-0602J 228-1277-00-0602J 3M 3mtm-textooltm-universal-zip-dip-socket-ts0392.pdf Description: CONN IC DIP SOCKET ZIF 28POS GLD
Features: Closed Frame
Packaging: Tube
Mounting Type: Connector
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Press-Fit
Housing Material: Polysulfone (PSU), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 7 Stücke:
Lieferzeit 10-14 Tag (e)
1+43.72 EUR
Im Einkaufswagen  Stück im Wert von  UAH
228-1277-19-0602J 228-1277-19-0602J 3M Electronic Solutions Division 3m_10152024_228_1277_19_0602J.pdf IC & Component Sockets RECPT FOR DIP SOCKET 28 Contact Qty.
auf Bestellung 40 Stücke:
Lieferzeit 10-14 Tag (e)
1+42.84 EUR
Im Einkaufswagen  Stück im Wert von  UAH
228-1277-39-0602J 228-1277-39-0602J 3M Electronic Solutions Division ab4dda27d7e6130f0ae001e9e4913b91affc513b-2951372.pdf IC & Component Sockets RECPT FOR DIP SOCKET 28 Contact Qty.
auf Bestellung 23 Stücke:
Lieferzeit 10-14 Tag (e)
1+60.93 EUR
10+51.78 EUR
30+42.33 EUR
50+41.69 EUR
Im Einkaufswagen  Stück im Wert von  UAH
228-1290-00-0602J 228-1290-00-0602J 3M 3mtm-textooltm-shrink-zi-dip-test-and-burn-in-socket-ts0366.pdf Description: CONN IC DIP SOCKET ZIF 28POS GLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Connector
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Press-Fit
Housing Material: Polysulfone (PSU), Glass Filled
Pitch - Mating: 0.070" (1.78mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 19 Stücke:
Lieferzeit 10-14 Tag (e)
1+45.95 EUR
10+39.05 EUR
Im Einkaufswagen  Stück im Wert von  UAH
228-1371-00-0602J 228-1371-00-0602J 3M 3mtm-textooltm-universal-zip-dip-socket-ts0392.pdf Description: CONN IC DIP SOCKET ZIF 28POS GLD
Features: Closed Frame
Packaging: Tray
Mounting Type: Connector
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Press-Fit
Housing Material: Polysulfone (PSU), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 11 Stücke:
Lieferzeit 10-14 Tag (e)
1+60.44 EUR
10+51.37 EUR
Im Einkaufswagen  Stück im Wert von  UAH
228-4817-00-0602J 228-4817-00-0602J 3M 3mtm-dip-sockets-100-2-54-mm-ts0365.pdf Description: CONN IC DIP SOCKET ZIF 28POS GLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Connector
Type: DIP, ZIF (ZIP), 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Press-Fit
Housing Material: Polysulfone (PSU), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 13 Stücke:
Lieferzeit 10-14 Tag (e)
1+49.67 EUR
10+42.21 EUR
Im Einkaufswagen  Stück im Wert von  UAH
228-4817-09-0602J 228-4817-09-0602J 3M Electronic Solutions Division receptacles-for-dip-sockets-ts0454.pdf IC & Component Sockets RECPT FOR DIP SOCKET 28 Contact Qty.
auf Bestellung 7 Stücke:
Lieferzeit 10-14 Tag (e)
1+46.75 EUR
10+32.84 EUR
20+30.89 EUR
Im Einkaufswagen  Stück im Wert von  UAH
232-1285-00-0602J 232-1285-00-0602J 3M 3mtm-dip-sockets-100-2-54-mm-ts0365.pdf Description: CONN IC DIP SOCKET ZIF 32POS GLD
Features: Closed Frame
Packaging: Tube
Mounting Type: Connector
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Press-Fit
Housing Material: Polysulfone (PSU), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 21 Stücke:
Lieferzeit 10-14 Tag (e)
1+43.75 EUR
10+37.19 EUR
Im Einkaufswagen  Stück im Wert von  UAH
232-1291-00-0602J 232-1291-00-0602J 3M Electronic Solutions Division 93c6a02de097ff45a645274b6aaf168b2fe2ae02-2951616.pdf IC & Component Sockets 0.070" DIP SOCKET 32 Contact Qty.
auf Bestellung 18 Stücke:
Lieferzeit 10-14 Tag (e)
1+59.77 EUR
10+51.96 EUR
30+42.87 EUR
50+42.2 EUR
100+41.5 EUR
250+41.27 EUR
Im Einkaufswagen  Stück im Wert von  UAH
24-3551-11 24-3551-11 Aries Electronics 10001-universal-dip-zif-test-socket-337360.pdf IC & Component Sockets DIP TEST SCKT GOLD 24 PINS
auf Bestellung 19 Stücke:
Lieferzeit 10-14 Tag (e)
1+32.89 EUR
10+27.95 EUR
20+26.21 EUR
50+24.24 EUR
100+23.21 EUR
200+22.48 EUR
500+22.09 EUR
Im Einkaufswagen  Stück im Wert von  UAH
24-3553-10 24-3553-10 Aries Electronics 10001-universal-dip-zif-test-socket-337360.pdf IC & Component Sockets DIP TEST SCKT TIN 24 PINS
auf Bestellung 47 Stücke:
Lieferzeit 10-14 Tag (e)
1+21.49 EUR
10+18.27 EUR
20+17.99 EUR
50+16.81 EUR
100+14.01 EUR
200+13.6 EUR
500+13.16 EUR
Im Einkaufswagen  Stück im Wert von  UAH
24-3554-10 24-3554-10 Aries Electronics 10001-universal-dip-zif-test-socket-337360.pdf IC & Component Sockets DIP TEST SCKT TIN 24 PINS
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)
1+21.12 EUR
10+17.2 EUR
20+16.6 EUR
50+14.01 EUR
200+13.53 EUR
500+13.08 EUR
1000+12.58 EUR
Im Einkaufswagen  Stück im Wert von  UAH
24-526-10 24-526-10 Aries Electronics 10018-low-profile-zif-test-socket.pdf Description: CONN IC DIP SOCKET ZIF 24POS TIN
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP)
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 48 Stücke:
Lieferzeit 10-14 Tag (e)
2+16.79 EUR
17+13.74 EUR
34+13.09 EUR
Mindestbestellmenge: 2
Im Einkaufswagen  Stück im Wert von  UAH
24-526-11 24-526-11 Aries Electronics 10018-low-profile-zif-test-socket-337209.pdf IC & Component Sockets Zero-Insertion-Force Socket
auf Bestellung 33 Stücke:
Lieferzeit 10-14 Tag (e)
1+30.84 EUR
10+26.73 EUR
17+25.33 EUR
51+21.38 EUR
102+20.75 EUR
255+19.99 EUR
510+19.69 EUR
Im Einkaufswagen  Stück im Wert von  UAH
24-6554-10 24-6554-10 Aries Electronics 10001-universal-dip-zif-test-socket.pdf Description: CONN IC DIP SOCKET ZIF 24POS TIN
Packaging: Tube
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 119 Stücke:
Lieferzeit 10-14 Tag (e)
2+16.74 EUR
10+14.23 EUR
30+13.17 EUR
50+12.7 EUR
100+12.1 EUR
Mindestbestellmenge: 2
Im Einkaufswagen  Stück im Wert von  UAH
24-6554-11 24-6554-11 Aries Electronics 10001-universal-dip-zif-test-socket.pdf Description: CONN IC DIP SOCKET ZIF 24POS GLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 78 Stücke:
Lieferzeit 10-14 Tag (e)
1+27.88 EUR
10+23.69 EUR
30+21.92 EUR
50+21.15 EUR
Im Einkaufswagen  Stück im Wert von  UAH
24-6554-16 24-6554-16 Aries Electronics 10001-universal-dip-zif-test-socket.pdf Description: CONN IC DIP SOCKET ZIF 24POS
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Nickel Boron
Contact Finish Thickness - Mating: 50.0µin (1.27µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Nickel Boron
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 73 Stücke:
Lieferzeit 10-14 Tag (e)
1+78.34 EUR
10+66.58 EUR
30+61.62 EUR
50+59.44 EUR
Im Einkaufswagen  Stück im Wert von  UAH
24-6572-11 24-6572-11 Aries Electronics 10019-universal-zif-test-and-burn-in-socket-336489.pdf IC & Component Sockets QUICK RELEASE 24 PIN GOLD
auf Bestellung 26 Stücke:
Lieferzeit 10-14 Tag (e)
1+41.71 EUR
12+31.28 EUR
24+31.26 EUR
60+30.98 EUR
108+29.09 EUR
252+28.28 EUR
504+27.84 EUR
Im Einkaufswagen  Stück im Wert von  UAH
240-1280-00-0602J 240-1280-00-0602J 3M 24645-ESD_TS-0362.indd.pdf Description: CONN IC DIP SOCKET ZIF 40POS GLD
Features: Closed Frame
Packaging: Tube
Mounting Type: Connector
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Press-Fit
Housing Material: Polysulfone (PSU), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 177 Stücke:
Lieferzeit 10-14 Tag (e)
1+48.86 EUR
10+41.52 EUR
30+38.42 EUR
50+37.06 EUR
100+35.3 EUR
Im Einkaufswagen  Stück im Wert von  UAH
240-1280-19-0602J 240-1280-19-0602J 3M Electronic Solutions Division ab4dda27d7e6130f0ae001e9e4913b91affc513b-2951372.pdf IC & Component Sockets RECPT FOR DIP SOCKET 40 Contact Qty.
auf Bestellung 23 Stücke:
Lieferzeit 10-14 Tag (e)
1+76.67 EUR
10+65.14 EUR
30+59.49 EUR
50+57.11 EUR
100+54.33 EUR
250+54.23 EUR
Im Einkaufswagen  Stück im Wert von  UAH
240-1280-39-0602J 240-1280-39-0602J 3M Electronic Solutions Division ab4dda27d7e6130f0ae001e9e4913b91affc513b-2951372.pdf IC & Component Sockets RECPT FOR DIP SOCKET 40 Contact Qty.
auf Bestellung 50 Stücke:
Lieferzeit 10-14 Tag (e)
1+59.03 EUR
10+50.74 EUR
25+48.56 EUR
50+46.97 EUR
100+40.32 EUR
Im Einkaufswagen  Stück im Wert von  UAH
240-1288-00-0602J 240-1288-00-0602J 3M 3mtm-textooltm-universal-zip-dip-socket-ts0392.pdf Description: CONN IC DIP SOCKET ZIF 40POS GLD
Features: Closed Frame
Packaging: Tube
Mounting Type: Connector
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Press-Fit
Housing Material: Polysulfone (PSU), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 3 Stücke:
Lieferzeit 10-14 Tag (e)
1+74.78 EUR
Im Einkaufswagen  Stück im Wert von  UAH
240-3639-00-0602J 240-3639-00-0602J 3M 3mtm-dip-sockets-100-2-54-mm-ts0365.pdf Description: CONN IC DIP SOCKET ZIF 40POS GLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Connector
Type: DIP, ZIF (ZIP), 1.0" (25.40mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Press-Fit
Housing Material: Polysulfone (PSU), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 15 Stücke:
Lieferzeit 10-14 Tag (e)
1+69.06 EUR
10+58.69 EUR
Im Einkaufswagen  Stück im Wert von  UAH
240-3639-19-0602J 240-3639-19-0602J 3M Electronic Solutions Division d61ab5ff64f47a182b213d85c15f8e132aa4989a-2951603.pdf IC & Component Sockets RECPT FOR DIP SOCKET 40 Contact Qty.
auf Bestellung 14 Stücke:
Lieferzeit 10-14 Tag (e)
1+70.17 EUR
10+61 EUR
30+49.81 EUR
50+49.05 EUR
100+48.49 EUR
Im Einkaufswagen  Stück im Wert von  UAH
242-1281-09-0602J 242-1281-09-0602J 3M Electronic Solutions Division ts0454-253904.pdf IC & Component Sockets RECPT FOR DIP SOCKET 42 Contact Qty.
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)
1+37.88 EUR
10+28.09 EUR
20+26.07 EUR
50+25.61 EUR
100+24.64 EUR
Im Einkaufswagen  Stück im Wert von  UAH
242-1289-00-0602J 242-1289-00-0602J 3M 3mtm-textooltm-universal-zip-dip-socket-ts0392.pdf Description: CONN IC DIP SOCKET ZIF 42POS GLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Connector
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 42 (2 x 21)
Termination: Press-Fit
Housing Material: Polysulfone (PSU), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 11 Stücke:
Lieferzeit 10-14 Tag (e)
1+75.31 EUR
10+64.01 EUR
Im Einkaufswagen  Stück im Wert von  UAH
242-1293-00-0602J 242-1293-00-0602J 3M 3mtm-textooltm-shrink-zi-dip-test-and-burn-in-socket-ts0366.pdf Description: CONN IC DIP SOCKET ZIF 42POS GLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Connector
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 42 (2 x 21)
Termination: Press-Fit
Housing Material: Polysulfone (PSU), Glass Filled
Pitch - Mating: 0.070" (1.78mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 5 Stücke:
Lieferzeit 10-14 Tag (e)
1+57.27 EUR
Im Einkaufswagen  Stück im Wert von  UAH
242-1293-09-0602J 242-1293-09-0602J 3M Electronic Solutions Division ts0454-253904.pdf IC & Component Sockets RECPT FOR DIP SOCKET 42 Contact Qty.
auf Bestellung 13 Stücke:
Lieferzeit 10-14 Tag (e)
1+46.39 EUR
10+39.41 EUR
20+38.42 EUR
50+32.44 EUR
100+31.93 EUR
200+31.5 EUR
500+31.31 EUR
Im Einkaufswagen  Stück im Wert von  UAH
248-1282-00-0602J 248-1282-00-0602J 3M 3mtm-dip-sockets-100-2-54-mm-ts0365.pdf Description: CONN IC DIP SOCKET ZIF 48POS GLD
Packaging: Tube
Features: Closed Frame
Mounting Type: Connector
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 48 (2 x 24)
Termination: Press-Fit
Housing Material: Polysulfone (PSU), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 372 Stücke:
Lieferzeit 10-14 Tag (e)
1+60.26 EUR
10+51.23 EUR
25+48.02 EUR
50+45.73 EUR
100+43.55 EUR
250+40.83 EUR
Im Einkaufswagen  Stück im Wert von  UAH
256-1292-00-0602J 256-1292-00-0602J 3M 3mtm-textooltm-shrink-zi-dip-test-and-burn-in-socket-ts0366.pdf Description: CONN IC DIP SOCKET ZIF 56POS GLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Connector
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 56 (2 x 28)
Termination: Press-Fit
Housing Material: Polysulfone (PSU), Glass Filled
Pitch - Mating: 0.070" (1.78mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 11 Stücke:
Lieferzeit 10-14 Tag (e)
1+76.58 EUR
10+65.1 EUR
Im Einkaufswagen  Stück im Wert von  UAH
264-1300-00-0602J 264-1300-00-0602J 3M 3mtm-textooltm-shrink-zi-dip-test-and-burn-in-socket-ts0366.pdf Description: CONN IC DIP SOCKET ZIF 64POS GLD
Packaging: Tube
Features: Closed Frame
Mounting Type: Connector
Type: DIP, ZIF (ZIP), 0.9" (22.86mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 64 (2 x 32)
Termination: Press-Fit
Housing Material: Polysulfone (PSU), Glass Filled
Pitch - Mating: 0.070" (1.78mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.070" (1.78mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 167 Stücke:
Lieferzeit 10-14 Tag (e)
1+73.11 EUR
10+62.14 EUR
30+57.51 EUR
50+55.47 EUR
100+52.83 EUR
Im Einkaufswagen  Stück im Wert von  UAH
264-1300-00-0602J 264-1300-00-0602J 3M Electronic Solutions Division 93c6a02de097ff45a645274b6aaf168b2fe2ae02-2951616.pdf IC & Component Sockets 0.070" DIP SOCKET 64 Contact Qty.
auf Bestellung 30 Stücke:
Lieferzeit 10-14 Tag (e)
1+58.54 EUR
10+54.16 EUR
Im Einkaufswagen  Stück im Wert von  UAH
264-1300-29-0602J 264-1300-29-0602J 3M Electronic Solutions Division ts0454-253904.pdf IC & Component Sockets RECPT FOR DIP SOCKET 64 Contact Qty.
auf Bestellung 7 Stücke:
Lieferzeit 10-14 Tag (e)
1+69.85 EUR
10+47.8 EUR
Im Einkaufswagen  Stück im Wert von  UAH
264-4493-00-0602J 264-4493-00-0602J 3M 3mtm-dip-sockets-100-2-54-mm-ts0365.pdf Description: CONN IC DIP SOCKET ZIF 64POS GLD
Features: Closed Frame
Packaging: Tube
Mounting Type: Connector
Type: DIP, ZIF (ZIP), 0.9" (22.86mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 64 (2 x 32)
Termination: Press-Fit
Housing Material: Polysulfone (PSU), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 25 Stücke:
Lieferzeit 10-14 Tag (e)
1+96.8 EUR
10+82.28 EUR
25+77.13 EUR
Im Einkaufswagen  Stück im Wert von  UAH
28-3553-10* 28-3553-10* Aries Electronics 10001-universal-dip-zif-test-socket-337360.pdf IC & Component Sockets
auf Bestellung 69 Stücke:
Lieferzeit 10-14 Tag (e)
1+24.11 EUR
9+19.64 EUR
27+15.96 EUR
252+15.52 EUR
504+15.01 EUR
1008+14.48 EUR
Im Einkaufswagen  Stück im Wert von  UAH
28-3554-11 28-3554-11 Aries Electronics 10001-universal-dip-zif-test-socket-337360.pdf IC & Component Sockets DIP TEST SCKT GOLD 28 PINS
auf Bestellung 7 Stücke:
Lieferzeit 10-14 Tag (e)
1+35.69 EUR
9+28.88 EUR
27+26.36 EUR
108+24.92 EUR
252+24.31 EUR
504+23.95 EUR
Im Einkaufswagen  Stück im Wert von  UAH
28-3554-16 28-3554-16 Aries Electronics 10001-universal-dip-zif-test-socket-337360.pdf IC & Component Sockets DIP TEST SCKT NICKEL 28 PINS
auf Bestellung 7 Stücke:
Lieferzeit 10-14 Tag (e)
1+87.24 EUR
9+72.69 EUR
27+72.48 EUR
54+70.73 EUR
108+66.3 EUR
252+66.05 EUR
Im Einkaufswagen  Stück im Wert von  UAH
28-516-11 28-516-11 Aries Electronics 516.pdf Description: CONN IC DIP SOCKET ZIF 28POS GLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP)
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 26 Stücke:
Lieferzeit 10-14 Tag (e)
1+22.65 EUR
13+18.9 EUR
26+18 EUR
Im Einkaufswagen  Stück im Wert von  UAH
28-526-10 28-526-10 Aries Electronics 10018-low-profile-zif-test-socket.pdf Description: CONN IC DIP SOCKET ZIF 28POS TIN
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP)
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 269 Stücke:
Lieferzeit 10-14 Tag (e)
2+16.53 EUR
15+13.65 EUR
30+13 EUR
60+12.38 EUR
105+11.9 EUR
255+11.18 EUR
Mindestbestellmenge: 2
Im Einkaufswagen  Stück im Wert von  UAH
28-526-11 28-526-11 Aries Electronics 10018-low-profile-zif-test-socket.pdf Description: CONN IC DIP SOCKET ZIF 28POS GLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP)
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 5 Stücke:
Lieferzeit 10-14 Tag (e)
1+30.32 EUR
Im Einkaufswagen  Stück im Wert von  UAH
Adapter SO8/DIP für Programmierung (ZIF SO8/DIP8 150mil)
Produktcode: 58316
zu Favoriten hinzufügen Lieblingsprodukt

Steckverbinder, Reihenklemmen > IC-Nullkraftsockel-Testsockel
Опис: Перехідник SO8/DIP
К-сть контактів: 8
Група: Перехідник
auf Bestellung 16 Stück:
Lieferzeit 21-28 Tag (e)
erwartet 20 Stück:
20 Stück - erwartet 15.08.2025
Anzahl Preis
1+3.6 EUR
Im Einkaufswagen  Stück im Wert von  UAH
ZIF 214-3345 Панель с нулевым усилием 14pin
Produktcode: 158778
zu Favoriten hinzufügen Lieblingsprodukt

ZIF 214-3345 Панель с нулевым усилием 14pin
Hersteller: TEXTDOL
Steckverbinder, Reihenklemmen > IC-Nullkraftsockel-Testsockel
Опис: Панель з нульовим зусиллям 14pin
К-сть контактів: 14
Група: DIP з нульовим зусиллям
auf Bestellung 33 Stück:
Lieferzeit 21-28 Tag (e)
Im Einkaufswagen  Stück im Wert von  UAH
ZIF 218-3341 Platte steckwiderstandsfrei 18pin
Produktcode: 45747
zu Favoriten hinzufügen Lieblingsprodukt

ZIF 218-3341 Platte steckwiderstandsfrei 18pin
Hersteller: TEXTDOL
Steckverbinder, Reihenklemmen > IC-Nullkraftsockel-Testsockel
Опис: Platte steckwiderstandsfrei 18pin
К-сть контактів: 18
Група: DIP з нульовим зусиллям
auf Bestellung 3 Stück:
Lieferzeit 21-28 Tag (e)
Anzahl Preis
1+3.36 EUR
Im Einkaufswagen  Stück im Wert von  UAH
ZIF 220-3341 Platte steckwiderstandsfrei 20pin
Produktcode: 45191
zu Favoriten hinzufügen Lieblingsprodukt

Hersteller: 3M
Steckverbinder, Reihenklemmen > IC-Nullkraftsockel-Testsockel
Опис: Platte steckwiderstandsfrei 20pin
К-сть контактів: 20
Група: DIP з нульовим зусиллям
auf Bestellung 11 Stück:
Lieferzeit 21-28 Tag (e)
Anzahl Preis
1+2.76 EUR
Im Einkaufswagen  Stück im Wert von  UAH
ZIF 228-3341 Platte steckwiderstandsfrei 28pin schmal 0,3"
Produktcode: 86705
zu Favoriten hinzufügen Lieblingsprodukt

ZIF 228-3341 Platte steckwiderstandsfrei 28pin schmal 0,3"
Hersteller: TEXTDOL
Steckverbinder, Reihenklemmen > IC-Nullkraftsockel-Testsockel
Опис: Platte steckwiderstandsfrei 28pin schmal 0,3"
К-сть контактів: 28
Група: DIP з нульовим зусиллям
Produkt ist nicht verfügbar
erwartet: 30 Stück
30 Stück - erwartet 28.07.2025
Anzahl Preis
1+2 EUR
Im Einkaufswagen  Stück im Wert von  UAH
ZIF 232-3345 Platte steckwiderstandsfrei 32pin
Produktcode: 60247
zu Favoriten hinzufügen Lieblingsprodukt

Hersteller: TEXTDOL
Steckverbinder, Reihenklemmen > IC-Nullkraftsockel-Testsockel
Опис: Platte steckwiderstandsfrei 32pin
К-сть контактів: 32
Група: DIP з нульовим зусиллям
auf Bestellung 21 Stück:
Lieferzeit 21-28 Tag (e)
Anzahl Preis
1+3.76 EUR
Im Einkaufswagen  Stück im Wert von  UAH
ZIF 240-3345 Platte steckwiderstandsfrei 40pin
Produktcode: 54221
zu Favoriten hinzufügen Lieblingsprodukt

ZIF 240-3345 Platte steckwiderstandsfrei 40pin
Hersteller: TEXTDOL
Steckverbinder, Reihenklemmen > IC-Nullkraftsockel-Testsockel
Опис: Platte steckwiderstandsfrei 40pin
К-сть контактів: 40
Група: DIP з нульовим зусиллям
auf Bestellung 7 Stück:
Lieferzeit 21-28 Tag (e)
Anzahl Preis
1+3 EUR
Im Einkaufswagen  Stück im Wert von  UAH
Панель с нулевым усилием 16pin (216-3341)
Produktcode: 158779
zu Favoriten hinzufügen Lieblingsprodukt

Панель с нулевым усилием 16pin (216-3341)
Hersteller: TEXTDOL
Steckverbinder, Reihenklemmen > IC-Nullkraftsockel-Testsockel
Опис: Панель з нульовим зусиллям 16pin
К-сть контактів: 16
Група: DIP з нульовим зусиллям
Produkt ist nicht verfügbar
erwartet: 40 Stück
40 Stück - erwartet 28.07.2025
Im Einkaufswagen  Stück im Wert von  UAH
1-84984-6 ENG_CD_84984_E3-2068777.pdf
1-84984-6
Hersteller: TE Connectivity
FFC & FPC Connectors 1mm DIP V ASSY 16P
auf Bestellung 5070 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+1.03 EUR
52+1.02 EUR
104+0.86 EUR
260+0.81 EUR
520+0.77 EUR
1014+0.73 EUR
Mindestbestellmenge: 3
Im Einkaufswagen  Stück im Wert von  UAH
214-3339-00-0602J 3mtm-dip-sockets-100-2-54-mm-ts0365.pdf
214-3339-00-0602J
Hersteller: 3M
Description: CONN IC DIP SOCKET ZIF 14POS GLD
Packaging: Tube
Features: Closed Frame
Mounting Type: Connector
Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Press-Fit
Housing Material: Polysulfone (PSU), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 13 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+36.27 EUR
10+30.84 EUR
Im Einkaufswagen  Stück im Wert von  UAH
216-3340-00-0602J 3mtm-dip-sockets-100-2-54-mm-ts0365.pdf
216-3340-00-0602J
Hersteller: 3M
Description: CONN IC DIP SOCKET ZIF 16POS GLD
Packaging: Tube
Features: Closed Frame
Mounting Type: Connector
Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Press-Fit
Housing Material: Polysulfone (PSU), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 632 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+38.86 EUR
10+33.03 EUR
30+30.57 EUR
50+29.49 EUR
100+28.08 EUR
250+26.32 EUR
500+25.07 EUR
Im Einkaufswagen  Stück im Wert von  UAH
216-3340-09-0602J d61ab5ff64f47a182b213d85c15f8e132aa4989a-2951603.pdf
216-3340-09-0602J
Hersteller: 3M Electronic Solutions Division
IC & Component Sockets RECPT FOR DIP SOCKET 16 Contact Qty.
auf Bestellung 46 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+41.43 EUR
10+27.67 EUR
Im Einkaufswagen  Stück im Wert von  UAH
218-3341-00-0602J 2cd3aad061e88fa5fffa81fd9cf1f5c3f8dc8ac1-2951973.pdf
218-3341-00-0602J
Hersteller: 3M Electronic Solutions Division
IC & Component Sockets 0.100" DIP SOCKET 18 Contact Qty.
auf Bestellung 48 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+41.82 EUR
10+27.95 EUR
20+27.93 EUR
Im Einkaufswagen  Stück im Wert von  UAH
218-3341-00-0602J 3mtm-dip-sockets-100-2-54-mm-ts0365.pdf
218-3341-00-0602J
Hersteller: 3M
Description: CONN IC DIP SOCKET ZIF 18POS GLD
Packaging: Tray
Features: Closed Frame
Mounting Type: Connector
Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Press-Fit
Housing Material: Polysulfone (PSU), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 52 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+39.93 EUR
10+33.94 EUR
30+31.41 EUR
50+30.3 EUR
Im Einkaufswagen  Stück im Wert von  UAH
220-3342-00-0602J 3mtm-dip-sockets-100-2-54-mm-ts0365.pdf
220-3342-00-0602J
Hersteller: 3M
Description: CONN IC DIP SOCKET ZIF 20POS GLD
Packaging: Tube
Features: Closed Frame
Mounting Type: Connector
Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Press-Fit
Housing Material: Polysulfone (PSU), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 421 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+38.4 EUR
10+32.63 EUR
30+30.2 EUR
50+29.13 EUR
100+27.74 EUR
250+26 EUR
Im Einkaufswagen  Stück im Wert von  UAH
220-3342-19-0602J ab4dda27d7e6130f0ae001e9e4913b91affc513b-2951372.pdf
220-3342-19-0602J
Hersteller: 3M Electronic Solutions Division
IC & Component Sockets RECPT FOR DIP SOCKET 20 Contact Qty.
auf Bestellung 28 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+43.26 EUR
10+39.71 EUR
Im Einkaufswagen  Stück im Wert von  UAH
222-3343-00-0602J 3mtm-dip-sockets-100-2-54-mm-ts0365.pdf
222-3343-00-0602J
Hersteller: 3M
Description: CONN IC DIP SOCKET ZIF 22POS GLD
Features: Closed Frame
Packaging: Tube
Mounting Type: Connector
Type: DIP, ZIF (ZIP), 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 22 (2 x 11)
Termination: Press-Fit
Housing Material: Polysulfone (PSU), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 8 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+43.44 EUR
Im Einkaufswagen  Stück im Wert von  UAH
224-1275-00-0602J 3mtm-dip-sockets-100-2-54-mm-ts0365.pdf
224-1275-00-0602J
Hersteller: 3M
Description: CONN IC DIP SOCKET ZIF 24POS GLD
Features: Closed Frame
Packaging: Tube
Mounting Type: Connector
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Press-Fit
Housing Material: Polysulfone (PSU), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 309 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+38.76 EUR
10+32.93 EUR
30+30.48 EUR
50+29.4 EUR
100+28 EUR
250+26.24 EUR
Im Einkaufswagen  Stück im Wert von  UAH
224-1286-00-0602J 3mtm-textooltm-universal-zip-dip-socket-ts0392.pdf
224-1286-00-0602J
Hersteller: 3M
Description: CONN IC DIP SOCKET ZIF 24POS GLD
Features: Closed Frame
Packaging: Tube
Mounting Type: Connector
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Press-Fit
Housing Material: Polysulfone (PSU), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 74 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+50.3 EUR
10+42.75 EUR
30+39.56 EUR
50+38.16 EUR
Im Einkaufswagen  Stück im Wert von  UAH
224-5248-00-0602J 3mtm-dip-sockets-100-2-54-mm-ts0365.pdf
224-5248-00-0602J
Hersteller: 3M
Description: CONN IC DIP SOCKET ZIF 24POS GLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Connector
Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Press-Fit
Housing Material: Polysulfone (PSU), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 73 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+51.39 EUR
10+43.68 EUR
30+40.43 EUR
50+39 EUR
Im Einkaufswagen  Stück im Wert von  UAH
228-1277-00-0602J 3mtm-textooltm-universal-zip-dip-socket-ts0392.pdf
228-1277-00-0602J
Hersteller: 3M
Description: CONN IC DIP SOCKET ZIF 28POS GLD
Features: Closed Frame
Packaging: Tube
Mounting Type: Connector
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Press-Fit
Housing Material: Polysulfone (PSU), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 7 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+43.72 EUR
Im Einkaufswagen  Stück im Wert von  UAH
228-1277-19-0602J 3m_10152024_228_1277_19_0602J.pdf
228-1277-19-0602J
Hersteller: 3M Electronic Solutions Division
IC & Component Sockets RECPT FOR DIP SOCKET 28 Contact Qty.
auf Bestellung 40 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+42.84 EUR
Im Einkaufswagen  Stück im Wert von  UAH
228-1277-39-0602J ab4dda27d7e6130f0ae001e9e4913b91affc513b-2951372.pdf
228-1277-39-0602J
Hersteller: 3M Electronic Solutions Division
IC & Component Sockets RECPT FOR DIP SOCKET 28 Contact Qty.
auf Bestellung 23 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+60.93 EUR
10+51.78 EUR
30+42.33 EUR
50+41.69 EUR
Im Einkaufswagen  Stück im Wert von  UAH
228-1290-00-0602J 3mtm-textooltm-shrink-zi-dip-test-and-burn-in-socket-ts0366.pdf
228-1290-00-0602J
Hersteller: 3M
Description: CONN IC DIP SOCKET ZIF 28POS GLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Connector
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Press-Fit
Housing Material: Polysulfone (PSU), Glass Filled
Pitch - Mating: 0.070" (1.78mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 19 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+45.95 EUR
10+39.05 EUR
Im Einkaufswagen  Stück im Wert von  UAH
228-1371-00-0602J 3mtm-textooltm-universal-zip-dip-socket-ts0392.pdf
228-1371-00-0602J
Hersteller: 3M
Description: CONN IC DIP SOCKET ZIF 28POS GLD
Features: Closed Frame
Packaging: Tray
Mounting Type: Connector
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Press-Fit
Housing Material: Polysulfone (PSU), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 11 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+60.44 EUR
10+51.37 EUR
Im Einkaufswagen  Stück im Wert von  UAH
228-4817-00-0602J 3mtm-dip-sockets-100-2-54-mm-ts0365.pdf
228-4817-00-0602J
Hersteller: 3M
Description: CONN IC DIP SOCKET ZIF 28POS GLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Connector
Type: DIP, ZIF (ZIP), 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Press-Fit
Housing Material: Polysulfone (PSU), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 13 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+49.67 EUR
10+42.21 EUR
Im Einkaufswagen  Stück im Wert von  UAH
228-4817-09-0602J receptacles-for-dip-sockets-ts0454.pdf
228-4817-09-0602J
Hersteller: 3M Electronic Solutions Division
IC & Component Sockets RECPT FOR DIP SOCKET 28 Contact Qty.
auf Bestellung 7 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+46.75 EUR
10+32.84 EUR
20+30.89 EUR
Im Einkaufswagen  Stück im Wert von  UAH
232-1285-00-0602J 3mtm-dip-sockets-100-2-54-mm-ts0365.pdf
232-1285-00-0602J
Hersteller: 3M
Description: CONN IC DIP SOCKET ZIF 32POS GLD
Features: Closed Frame
Packaging: Tube
Mounting Type: Connector
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Press-Fit
Housing Material: Polysulfone (PSU), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 21 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+43.75 EUR
10+37.19 EUR
Im Einkaufswagen  Stück im Wert von  UAH
232-1291-00-0602J 93c6a02de097ff45a645274b6aaf168b2fe2ae02-2951616.pdf
232-1291-00-0602J
Hersteller: 3M Electronic Solutions Division
IC & Component Sockets 0.070" DIP SOCKET 32 Contact Qty.
auf Bestellung 18 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+59.77 EUR
10+51.96 EUR
30+42.87 EUR
50+42.2 EUR
100+41.5 EUR
250+41.27 EUR
Im Einkaufswagen  Stück im Wert von  UAH
24-3551-11 10001-universal-dip-zif-test-socket-337360.pdf
24-3551-11
Hersteller: Aries Electronics
IC & Component Sockets DIP TEST SCKT GOLD 24 PINS
auf Bestellung 19 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+32.89 EUR
10+27.95 EUR
20+26.21 EUR
50+24.24 EUR
100+23.21 EUR
200+22.48 EUR
500+22.09 EUR
Im Einkaufswagen  Stück im Wert von  UAH
24-3553-10 10001-universal-dip-zif-test-socket-337360.pdf
24-3553-10
Hersteller: Aries Electronics
IC & Component Sockets DIP TEST SCKT TIN 24 PINS
auf Bestellung 47 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+21.49 EUR
10+18.27 EUR
20+17.99 EUR
50+16.81 EUR
100+14.01 EUR
200+13.6 EUR
500+13.16 EUR
Im Einkaufswagen  Stück im Wert von  UAH
24-3554-10 10001-universal-dip-zif-test-socket-337360.pdf
24-3554-10
Hersteller: Aries Electronics
IC & Component Sockets DIP TEST SCKT TIN 24 PINS
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+21.12 EUR
10+17.2 EUR
20+16.6 EUR
50+14.01 EUR
200+13.53 EUR
500+13.08 EUR
1000+12.58 EUR
Im Einkaufswagen  Stück im Wert von  UAH
24-526-10 10018-low-profile-zif-test-socket.pdf
24-526-10
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 24POS TIN
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP)
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 48 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+16.79 EUR
17+13.74 EUR
34+13.09 EUR
Mindestbestellmenge: 2
Im Einkaufswagen  Stück im Wert von  UAH
24-526-11 10018-low-profile-zif-test-socket-337209.pdf
24-526-11
Hersteller: Aries Electronics
IC & Component Sockets Zero-Insertion-Force Socket
auf Bestellung 33 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+30.84 EUR
10+26.73 EUR
17+25.33 EUR
51+21.38 EUR
102+20.75 EUR
255+19.99 EUR
510+19.69 EUR
Im Einkaufswagen  Stück im Wert von  UAH
24-6554-10 10001-universal-dip-zif-test-socket.pdf
24-6554-10
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 24POS TIN
Packaging: Tube
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 119 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+16.74 EUR
10+14.23 EUR
30+13.17 EUR
50+12.7 EUR
100+12.1 EUR
Mindestbestellmenge: 2
Im Einkaufswagen  Stück im Wert von  UAH
24-6554-11 10001-universal-dip-zif-test-socket.pdf
24-6554-11
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 24POS GLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 78 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+27.88 EUR
10+23.69 EUR
30+21.92 EUR
50+21.15 EUR
Im Einkaufswagen  Stück im Wert von  UAH
24-6554-16 10001-universal-dip-zif-test-socket.pdf
24-6554-16
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 24POS
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Nickel Boron
Contact Finish Thickness - Mating: 50.0µin (1.27µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Nickel Boron
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 73 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+78.34 EUR
10+66.58 EUR
30+61.62 EUR
50+59.44 EUR
Im Einkaufswagen  Stück im Wert von  UAH
24-6572-11 10019-universal-zif-test-and-burn-in-socket-336489.pdf
24-6572-11
Hersteller: Aries Electronics
IC & Component Sockets QUICK RELEASE 24 PIN GOLD
auf Bestellung 26 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+41.71 EUR
12+31.28 EUR
24+31.26 EUR
60+30.98 EUR
108+29.09 EUR
252+28.28 EUR
504+27.84 EUR
Im Einkaufswagen  Stück im Wert von  UAH
240-1280-00-0602J 24645-ESD_TS-0362.indd.pdf
240-1280-00-0602J
Hersteller: 3M
Description: CONN IC DIP SOCKET ZIF 40POS GLD
Features: Closed Frame
Packaging: Tube
Mounting Type: Connector
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Press-Fit
Housing Material: Polysulfone (PSU), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 177 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+48.86 EUR
10+41.52 EUR
30+38.42 EUR
50+37.06 EUR
100+35.3 EUR
Im Einkaufswagen  Stück im Wert von  UAH
240-1280-19-0602J ab4dda27d7e6130f0ae001e9e4913b91affc513b-2951372.pdf
240-1280-19-0602J
Hersteller: 3M Electronic Solutions Division
IC & Component Sockets RECPT FOR DIP SOCKET 40 Contact Qty.
auf Bestellung 23 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+76.67 EUR
10+65.14 EUR
30+59.49 EUR
50+57.11 EUR
100+54.33 EUR
250+54.23 EUR
Im Einkaufswagen  Stück im Wert von  UAH
240-1280-39-0602J ab4dda27d7e6130f0ae001e9e4913b91affc513b-2951372.pdf
240-1280-39-0602J
Hersteller: 3M Electronic Solutions Division
IC & Component Sockets RECPT FOR DIP SOCKET 40 Contact Qty.
auf Bestellung 50 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+59.03 EUR
10+50.74 EUR
25+48.56 EUR
50+46.97 EUR
100+40.32 EUR
Im Einkaufswagen  Stück im Wert von  UAH
240-1288-00-0602J 3mtm-textooltm-universal-zip-dip-socket-ts0392.pdf
240-1288-00-0602J
Hersteller: 3M
Description: CONN IC DIP SOCKET ZIF 40POS GLD
Features: Closed Frame
Packaging: Tube
Mounting Type: Connector
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Press-Fit
Housing Material: Polysulfone (PSU), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 3 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+74.78 EUR
Im Einkaufswagen  Stück im Wert von  UAH
240-3639-00-0602J 3mtm-dip-sockets-100-2-54-mm-ts0365.pdf
240-3639-00-0602J
Hersteller: 3M
Description: CONN IC DIP SOCKET ZIF 40POS GLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Connector
Type: DIP, ZIF (ZIP), 1.0" (25.40mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Press-Fit
Housing Material: Polysulfone (PSU), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 15 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+69.06 EUR
10+58.69 EUR
Im Einkaufswagen  Stück im Wert von  UAH
240-3639-19-0602J d61ab5ff64f47a182b213d85c15f8e132aa4989a-2951603.pdf
240-3639-19-0602J
Hersteller: 3M Electronic Solutions Division
IC & Component Sockets RECPT FOR DIP SOCKET 40 Contact Qty.
auf Bestellung 14 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+70.17 EUR
10+61 EUR
30+49.81 EUR
50+49.05 EUR
100+48.49 EUR
Im Einkaufswagen  Stück im Wert von  UAH
242-1281-09-0602J ts0454-253904.pdf
242-1281-09-0602J
Hersteller: 3M Electronic Solutions Division
IC & Component Sockets RECPT FOR DIP SOCKET 42 Contact Qty.
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+37.88 EUR
10+28.09 EUR
20+26.07 EUR
50+25.61 EUR
100+24.64 EUR
Im Einkaufswagen  Stück im Wert von  UAH
242-1289-00-0602J 3mtm-textooltm-universal-zip-dip-socket-ts0392.pdf
242-1289-00-0602J
Hersteller: 3M
Description: CONN IC DIP SOCKET ZIF 42POS GLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Connector
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 42 (2 x 21)
Termination: Press-Fit
Housing Material: Polysulfone (PSU), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 11 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+75.31 EUR
10+64.01 EUR
Im Einkaufswagen  Stück im Wert von  UAH
242-1293-00-0602J 3mtm-textooltm-shrink-zi-dip-test-and-burn-in-socket-ts0366.pdf
242-1293-00-0602J
Hersteller: 3M
Description: CONN IC DIP SOCKET ZIF 42POS GLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Connector
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 42 (2 x 21)
Termination: Press-Fit
Housing Material: Polysulfone (PSU), Glass Filled
Pitch - Mating: 0.070" (1.78mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 5 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+57.27 EUR
Im Einkaufswagen  Stück im Wert von  UAH
242-1293-09-0602J ts0454-253904.pdf
242-1293-09-0602J
Hersteller: 3M Electronic Solutions Division
IC & Component Sockets RECPT FOR DIP SOCKET 42 Contact Qty.
auf Bestellung 13 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+46.39 EUR
10+39.41 EUR
20+38.42 EUR
50+32.44 EUR
100+31.93 EUR
200+31.5 EUR
500+31.31 EUR
Im Einkaufswagen  Stück im Wert von  UAH
248-1282-00-0602J 3mtm-dip-sockets-100-2-54-mm-ts0365.pdf
248-1282-00-0602J
Hersteller: 3M
Description: CONN IC DIP SOCKET ZIF 48POS GLD
Packaging: Tube
Features: Closed Frame
Mounting Type: Connector
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 48 (2 x 24)
Termination: Press-Fit
Housing Material: Polysulfone (PSU), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 372 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+60.26 EUR
10+51.23 EUR
25+48.02 EUR
50+45.73 EUR
100+43.55 EUR
250+40.83 EUR
Im Einkaufswagen  Stück im Wert von  UAH
256-1292-00-0602J 3mtm-textooltm-shrink-zi-dip-test-and-burn-in-socket-ts0366.pdf
256-1292-00-0602J
Hersteller: 3M
Description: CONN IC DIP SOCKET ZIF 56POS GLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Connector
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 56 (2 x 28)
Termination: Press-Fit
Housing Material: Polysulfone (PSU), Glass Filled
Pitch - Mating: 0.070" (1.78mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 11 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+76.58 EUR
10+65.1 EUR
Im Einkaufswagen  Stück im Wert von  UAH
264-1300-00-0602J 3mtm-textooltm-shrink-zi-dip-test-and-burn-in-socket-ts0366.pdf
264-1300-00-0602J
Hersteller: 3M
Description: CONN IC DIP SOCKET ZIF 64POS GLD
Packaging: Tube
Features: Closed Frame
Mounting Type: Connector
Type: DIP, ZIF (ZIP), 0.9" (22.86mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 64 (2 x 32)
Termination: Press-Fit
Housing Material: Polysulfone (PSU), Glass Filled
Pitch - Mating: 0.070" (1.78mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.070" (1.78mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 167 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+73.11 EUR
10+62.14 EUR
30+57.51 EUR
50+55.47 EUR
100+52.83 EUR
Im Einkaufswagen  Stück im Wert von  UAH
264-1300-00-0602J 93c6a02de097ff45a645274b6aaf168b2fe2ae02-2951616.pdf
264-1300-00-0602J
Hersteller: 3M Electronic Solutions Division
IC & Component Sockets 0.070" DIP SOCKET 64 Contact Qty.
auf Bestellung 30 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+58.54 EUR
10+54.16 EUR
Im Einkaufswagen  Stück im Wert von  UAH
264-1300-29-0602J ts0454-253904.pdf
264-1300-29-0602J
Hersteller: 3M Electronic Solutions Division
IC & Component Sockets RECPT FOR DIP SOCKET 64 Contact Qty.
auf Bestellung 7 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+69.85 EUR
10+47.8 EUR
Im Einkaufswagen  Stück im Wert von  UAH
264-4493-00-0602J 3mtm-dip-sockets-100-2-54-mm-ts0365.pdf
264-4493-00-0602J
Hersteller: 3M
Description: CONN IC DIP SOCKET ZIF 64POS GLD
Features: Closed Frame
Packaging: Tube
Mounting Type: Connector
Type: DIP, ZIF (ZIP), 0.9" (22.86mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 64 (2 x 32)
Termination: Press-Fit
Housing Material: Polysulfone (PSU), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 25 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+96.8 EUR
10+82.28 EUR
25+77.13 EUR
Im Einkaufswagen  Stück im Wert von  UAH
28-3553-10* 10001-universal-dip-zif-test-socket-337360.pdf
28-3553-10*
Hersteller: Aries Electronics
IC & Component Sockets
auf Bestellung 69 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+24.11 EUR
9+19.64 EUR
27+15.96 EUR
252+15.52 EUR
504+15.01 EUR
1008+14.48 EUR
Im Einkaufswagen  Stück im Wert von  UAH
28-3554-11 10001-universal-dip-zif-test-socket-337360.pdf
28-3554-11
Hersteller: Aries Electronics
IC & Component Sockets DIP TEST SCKT GOLD 28 PINS
auf Bestellung 7 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+35.69 EUR
9+28.88 EUR
27+26.36 EUR
108+24.92 EUR
252+24.31 EUR
504+23.95 EUR
Im Einkaufswagen  Stück im Wert von  UAH
28-3554-16 10001-universal-dip-zif-test-socket-337360.pdf
28-3554-16
Hersteller: Aries Electronics
IC & Component Sockets DIP TEST SCKT NICKEL 28 PINS
auf Bestellung 7 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+87.24 EUR
9+72.69 EUR
27+72.48 EUR
54+70.73 EUR
108+66.3 EUR
252+66.05 EUR
Im Einkaufswagen  Stück im Wert von  UAH
28-516-11 516.pdf
28-516-11
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 28POS GLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP)
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 26 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+22.65 EUR
13+18.9 EUR
26+18 EUR
Im Einkaufswagen  Stück im Wert von  UAH
28-526-10 10018-low-profile-zif-test-socket.pdf
28-526-10
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 28POS TIN
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP)
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 269 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+16.53 EUR
15+13.65 EUR
30+13 EUR
60+12.38 EUR
105+11.9 EUR
255+11.18 EUR
Mindestbestellmenge: 2
Im Einkaufswagen  Stück im Wert von  UAH
28-526-11 10018-low-profile-zif-test-socket.pdf
28-526-11
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 28POS GLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP)
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 5 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+30.32 EUR
Im Einkaufswagen  Stück im Wert von  UAH
Wählen Sie Seite:   1 2  Nächste Seite >> ]