Suchergebnisse für "DIP ZIF" : > 60
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Mindestbestellmenge: 2
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Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
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Adapter SO8/DIP für Programmierung (ZIF SO8/DIP8 150mil) Produktcode: 58316
zu Favoriten hinzufügen
Lieblingsprodukt
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Steckverbinder, Reihenklemmen > IC-Nullkraftsockel-Testsockel Опис: Перехідник SO8/DIP К-сть контактів: 8 Група: Перехідник |
auf Bestellung 16 Stück: Lieferzeit 21-28 Tag (e)erwartet 20 Stück: 20 Stück - erwartet 15.08.2025 |
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ZIF 214-3345 Панель с нулевым усилием 14pin Produktcode: 158778
zu Favoriten hinzufügen
Lieblingsprodukt
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TEXTDOL |
Steckverbinder, Reihenklemmen > IC-Nullkraftsockel-Testsockel Опис: Панель з нульовим зусиллям 14pin К-сть контактів: 14 Група: DIP з нульовим зусиллям |
auf Bestellung 33 Stück: Lieferzeit 21-28 Tag (e) |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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ZIF 218-3341 Platte steckwiderstandsfrei 18pin Produktcode: 45747
zu Favoriten hinzufügen
Lieblingsprodukt
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TEXTDOL |
Steckverbinder, Reihenklemmen > IC-Nullkraftsockel-Testsockel Опис: Platte steckwiderstandsfrei 18pin К-сть контактів: 18 Група: DIP з нульовим зусиллям |
auf Bestellung 3 Stück: Lieferzeit 21-28 Tag (e) |
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ZIF 220-3341 Platte steckwiderstandsfrei 20pin Produktcode: 45191
zu Favoriten hinzufügen
Lieblingsprodukt
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3M |
Steckverbinder, Reihenklemmen > IC-Nullkraftsockel-Testsockel Опис: Platte steckwiderstandsfrei 20pin К-сть контактів: 20 Група: DIP з нульовим зусиллям |
auf Bestellung 11 Stück: Lieferzeit 21-28 Tag (e) |
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ZIF 228-3341 Platte steckwiderstandsfrei 28pin schmal 0,3" Produktcode: 86705
zu Favoriten hinzufügen
Lieblingsprodukt
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TEXTDOL |
Steckverbinder, Reihenklemmen > IC-Nullkraftsockel-Testsockel Опис: Platte steckwiderstandsfrei 28pin schmal 0,3" К-сть контактів: 28 Група: DIP з нульовим зусиллям |
Produkt ist nicht verfügbar
erwartet:
30 Stück
30 Stück - erwartet 28.07.2025
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ZIF 232-3345 Platte steckwiderstandsfrei 32pin Produktcode: 60247
zu Favoriten hinzufügen
Lieblingsprodukt
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TEXTDOL |
Steckverbinder, Reihenklemmen > IC-Nullkraftsockel-Testsockel Опис: Platte steckwiderstandsfrei 32pin К-сть контактів: 32 Група: DIP з нульовим зусиллям |
auf Bestellung 21 Stück: Lieferzeit 21-28 Tag (e) |
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ZIF 240-3345 Platte steckwiderstandsfrei 40pin Produktcode: 54221
zu Favoriten hinzufügen
Lieblingsprodukt
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TEXTDOL |
Steckverbinder, Reihenklemmen > IC-Nullkraftsockel-Testsockel Опис: Platte steckwiderstandsfrei 40pin К-сть контактів: 40 Група: DIP з нульовим зусиллям |
auf Bestellung 7 Stück: Lieferzeit 21-28 Tag (e) |
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Панель с нулевым усилием 16pin (216-3341) Produktcode: 158779
zu Favoriten hinzufügen
Lieblingsprodukt
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TEXTDOL |
Steckverbinder, Reihenklemmen > IC-Nullkraftsockel-Testsockel Опис: Панель з нульовим зусиллям 16pin К-сть контактів: 16 Група: DIP з нульовим зусиллям |
Produkt ist nicht verfügbar
erwartet:
40 Stück
40 Stück - erwartet 28.07.2025
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Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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1-84984-6 | TE Connectivity |
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auf Bestellung 5070 Stücke: Lieferzeit 10-14 Tag (e) |
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214-3339-00-0602J | 3M |
![]() Packaging: Tube Features: Closed Frame Mounting Type: Connector Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 14 (2 x 7) Termination: Press-Fit Housing Material: Polysulfone (PSU), Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 30.0µin (0.76µm) Contact Material - Post: Beryllium Copper Part Status: Active |
auf Bestellung 13 Stücke: Lieferzeit 10-14 Tag (e) |
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216-3340-00-0602J | 3M |
![]() Packaging: Tube Features: Closed Frame Mounting Type: Connector Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 16 (2 x 8) Termination: Press-Fit Housing Material: Polysulfone (PSU), Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 30.0µin (0.76µm) Contact Material - Post: Beryllium Copper Part Status: Active |
auf Bestellung 632 Stücke: Lieferzeit 10-14 Tag (e) |
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216-3340-09-0602J | 3M Electronic Solutions Division |
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auf Bestellung 46 Stücke: Lieferzeit 10-14 Tag (e) |
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218-3341-00-0602J | 3M Electronic Solutions Division |
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auf Bestellung 48 Stücke: Lieferzeit 10-14 Tag (e) |
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218-3341-00-0602J | 3M |
![]() Packaging: Tray Features: Closed Frame Mounting Type: Connector Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 18 (2 x 9) Termination: Press-Fit Housing Material: Polysulfone (PSU), Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 30.0µin (0.76µm) Contact Material - Post: Beryllium Copper Part Status: Active |
auf Bestellung 52 Stücke: Lieferzeit 10-14 Tag (e) |
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220-3342-00-0602J | 3M |
![]() Packaging: Tube Features: Closed Frame Mounting Type: Connector Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 20 (2 x 10) Termination: Press-Fit Housing Material: Polysulfone (PSU), Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 30.0µin (0.76µm) Contact Material - Post: Beryllium Copper Part Status: Active |
auf Bestellung 421 Stücke: Lieferzeit 10-14 Tag (e) |
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220-3342-19-0602J | 3M Electronic Solutions Division |
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auf Bestellung 28 Stücke: Lieferzeit 10-14 Tag (e) |
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222-3343-00-0602J | 3M |
![]() Features: Closed Frame Packaging: Tube Mounting Type: Connector Type: DIP, ZIF (ZIP), 0.4" (10.16mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 22 (2 x 11) Termination: Press-Fit Housing Material: Polysulfone (PSU), Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 30.0µin (0.76µm) Contact Material - Post: Beryllium Copper Part Status: Active |
auf Bestellung 8 Stücke: Lieferzeit 10-14 Tag (e) |
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224-1275-00-0602J | 3M |
![]() Features: Closed Frame Packaging: Tube Mounting Type: Connector Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 24 (2 x 12) Termination: Press-Fit Housing Material: Polysulfone (PSU), Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 30.0µin (0.76µm) Contact Material - Post: Beryllium Copper Part Status: Active |
auf Bestellung 309 Stücke: Lieferzeit 10-14 Tag (e) |
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224-1286-00-0602J | 3M |
![]() Features: Closed Frame Packaging: Tube Mounting Type: Connector Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 24 (2 x 12) Termination: Press-Fit Housing Material: Polysulfone (PSU), Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 30.0µin (0.76µm) Contact Material - Post: Beryllium Copper Part Status: Active |
auf Bestellung 74 Stücke: Lieferzeit 10-14 Tag (e) |
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224-5248-00-0602J | 3M |
![]() Packaging: Bulk Features: Closed Frame Mounting Type: Connector Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 24 (2 x 12) Termination: Press-Fit Housing Material: Polysulfone (PSU), Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 30.0µin (0.76µm) Contact Material - Post: Beryllium Copper Part Status: Active |
auf Bestellung 73 Stücke: Lieferzeit 10-14 Tag (e) |
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228-1277-00-0602J | 3M |
![]() Features: Closed Frame Packaging: Tube Mounting Type: Connector Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 28 (2 x 14) Termination: Press-Fit Housing Material: Polysulfone (PSU), Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 30.0µin (0.76µm) Contact Material - Post: Beryllium Copper Part Status: Active |
auf Bestellung 7 Stücke: Lieferzeit 10-14 Tag (e) |
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228-1277-19-0602J | 3M Electronic Solutions Division |
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auf Bestellung 40 Stücke: Lieferzeit 10-14 Tag (e) |
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228-1277-39-0602J | 3M Electronic Solutions Division |
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auf Bestellung 23 Stücke: Lieferzeit 10-14 Tag (e) |
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228-1290-00-0602J | 3M |
![]() Packaging: Bulk Features: Closed Frame Mounting Type: Connector Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 28 (2 x 14) Termination: Press-Fit Housing Material: Polysulfone (PSU), Glass Filled Pitch - Mating: 0.070" (1.78mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 30.0µin (0.76µm) Contact Material - Post: Beryllium Copper Part Status: Active |
auf Bestellung 19 Stücke: Lieferzeit 10-14 Tag (e) |
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228-1371-00-0602J | 3M |
![]() Features: Closed Frame Packaging: Tray Mounting Type: Connector Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 28 (2 x 14) Termination: Press-Fit Housing Material: Polysulfone (PSU), Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 30.0µin (0.76µm) Contact Material - Post: Beryllium Copper Part Status: Active |
auf Bestellung 11 Stücke: Lieferzeit 10-14 Tag (e) |
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228-4817-00-0602J | 3M |
![]() Packaging: Bulk Features: Closed Frame Mounting Type: Connector Type: DIP, ZIF (ZIP), 0.4" (10.16mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 28 (2 x 14) Termination: Press-Fit Housing Material: Polysulfone (PSU), Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 30.0µin (0.76µm) Contact Material - Post: Beryllium Copper Part Status: Active |
auf Bestellung 13 Stücke: Lieferzeit 10-14 Tag (e) |
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228-4817-09-0602J | 3M Electronic Solutions Division |
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auf Bestellung 7 Stücke: Lieferzeit 10-14 Tag (e) |
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232-1285-00-0602J | 3M |
![]() Features: Closed Frame Packaging: Tube Mounting Type: Connector Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 32 (2 x 16) Termination: Press-Fit Housing Material: Polysulfone (PSU), Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 30.0µin (0.76µm) Contact Material - Post: Beryllium Copper Part Status: Active |
auf Bestellung 21 Stücke: Lieferzeit 10-14 Tag (e) |
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232-1291-00-0602J | 3M Electronic Solutions Division |
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auf Bestellung 18 Stücke: Lieferzeit 10-14 Tag (e) |
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24-3551-11 | Aries Electronics |
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auf Bestellung 19 Stücke: Lieferzeit 10-14 Tag (e) |
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24-3553-10 | Aries Electronics |
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auf Bestellung 47 Stücke: Lieferzeit 10-14 Tag (e) |
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24-3554-10 | Aries Electronics |
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auf Bestellung 1 Stücke: Lieferzeit 10-14 Tag (e) |
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24-526-10 | Aries Electronics |
![]() Features: Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, ZIF (ZIP) Operating Temperature: -55°C ~ 105°C Number of Positions or Pins (Grid): 24 (2 x 12) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Beryllium Copper Part Status: Active |
auf Bestellung 48 Stücke: Lieferzeit 10-14 Tag (e) |
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24-526-11 | Aries Electronics |
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auf Bestellung 33 Stücke: Lieferzeit 10-14 Tag (e) |
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24-6554-10 | Aries Electronics |
![]() Packaging: Tube Features: Closed Frame Mounting Type: Through Hole Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 24 (2 x 12) Termination: Solder Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 200.0µin (5.08µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Beryllium Copper Part Status: Active |
auf Bestellung 119 Stücke: Lieferzeit 10-14 Tag (e) |
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24-6554-11 | Aries Electronics |
![]() Packaging: Bulk Features: Closed Frame Mounting Type: Through Hole Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 24 (2 x 12) Termination: Solder Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Material - Post: Beryllium Copper Part Status: Active |
auf Bestellung 78 Stücke: Lieferzeit 10-14 Tag (e) |
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24-6554-16 | Aries Electronics |
![]() Packaging: Bulk Features: Closed Frame Mounting Type: Through Hole Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 24 (2 x 12) Termination: Solder Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Nickel Boron Contact Finish Thickness - Mating: 50.0µin (1.27µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Nickel Boron Contact Finish Thickness - Post: 50.0µin (1.27µm) Contact Material - Post: Beryllium Copper Part Status: Active |
auf Bestellung 73 Stücke: Lieferzeit 10-14 Tag (e) |
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24-6572-11 | Aries Electronics |
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auf Bestellung 26 Stücke: Lieferzeit 10-14 Tag (e) |
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240-1280-00-0602J | 3M |
![]() Features: Closed Frame Packaging: Tube Mounting Type: Connector Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 40 (2 x 20) Termination: Press-Fit Housing Material: Polysulfone (PSU), Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 30.0µin (0.76µm) Contact Material - Post: Beryllium Copper Part Status: Active |
auf Bestellung 177 Stücke: Lieferzeit 10-14 Tag (e) |
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240-1280-19-0602J | 3M Electronic Solutions Division |
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auf Bestellung 23 Stücke: Lieferzeit 10-14 Tag (e) |
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240-1280-39-0602J | 3M Electronic Solutions Division |
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auf Bestellung 50 Stücke: Lieferzeit 10-14 Tag (e) |
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240-1288-00-0602J | 3M |
![]() Features: Closed Frame Packaging: Tube Mounting Type: Connector Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 40 (2 x 20) Termination: Press-Fit Housing Material: Polysulfone (PSU), Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 30.0µin (0.76µm) Contact Material - Post: Beryllium Copper Part Status: Active |
auf Bestellung 3 Stücke: Lieferzeit 10-14 Tag (e) |
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240-3639-00-0602J | 3M |
![]() Packaging: Bulk Features: Closed Frame Mounting Type: Connector Type: DIP, ZIF (ZIP), 1.0" (25.40mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 40 (2 x 20) Termination: Press-Fit Housing Material: Polysulfone (PSU), Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 30.0µin (0.76µm) Contact Material - Post: Beryllium Copper Part Status: Active |
auf Bestellung 15 Stücke: Lieferzeit 10-14 Tag (e) |
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240-3639-19-0602J | 3M Electronic Solutions Division |
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auf Bestellung 14 Stücke: Lieferzeit 10-14 Tag (e) |
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242-1281-09-0602J | 3M Electronic Solutions Division |
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auf Bestellung 2 Stücke: Lieferzeit 10-14 Tag (e) |
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242-1289-00-0602J | 3M |
![]() Packaging: Bulk Features: Closed Frame Mounting Type: Connector Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 42 (2 x 21) Termination: Press-Fit Housing Material: Polysulfone (PSU), Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 30.0µin (0.76µm) Contact Material - Post: Beryllium Copper Part Status: Active |
auf Bestellung 11 Stücke: Lieferzeit 10-14 Tag (e) |
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242-1293-00-0602J | 3M |
![]() Packaging: Bulk Features: Closed Frame Mounting Type: Connector Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 42 (2 x 21) Termination: Press-Fit Housing Material: Polysulfone (PSU), Glass Filled Pitch - Mating: 0.070" (1.78mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 30.0µin (0.76µm) Contact Material - Post: Beryllium Copper Part Status: Active |
auf Bestellung 5 Stücke: Lieferzeit 10-14 Tag (e) |
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242-1293-09-0602J | 3M Electronic Solutions Division |
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auf Bestellung 13 Stücke: Lieferzeit 10-14 Tag (e) |
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|
248-1282-00-0602J | 3M |
![]() Packaging: Tube Features: Closed Frame Mounting Type: Connector Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 48 (2 x 24) Termination: Press-Fit Housing Material: Polysulfone (PSU), Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 30.0µin (0.76µm) Contact Material - Post: Beryllium Copper Part Status: Active |
auf Bestellung 372 Stücke: Lieferzeit 10-14 Tag (e) |
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256-1292-00-0602J | 3M |
![]() Packaging: Bulk Features: Closed Frame Mounting Type: Connector Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 56 (2 x 28) Termination: Press-Fit Housing Material: Polysulfone (PSU), Glass Filled Pitch - Mating: 0.070" (1.78mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 30.0µin (0.76µm) Contact Material - Post: Beryllium Copper Part Status: Active |
auf Bestellung 11 Stücke: Lieferzeit 10-14 Tag (e) |
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264-1300-00-0602J | 3M |
![]() Packaging: Tube Features: Closed Frame Mounting Type: Connector Type: DIP, ZIF (ZIP), 0.9" (22.86mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 64 (2 x 32) Termination: Press-Fit Housing Material: Polysulfone (PSU), Glass Filled Pitch - Mating: 0.070" (1.78mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.070" (1.78mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 30.0µin (0.76µm) Contact Material - Post: Beryllium Copper Part Status: Active |
auf Bestellung 167 Stücke: Lieferzeit 10-14 Tag (e) |
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264-1300-00-0602J | 3M Electronic Solutions Division |
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auf Bestellung 30 Stücke: Lieferzeit 10-14 Tag (e) |
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264-1300-29-0602J | 3M Electronic Solutions Division |
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auf Bestellung 7 Stücke: Lieferzeit 10-14 Tag (e) |
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264-4493-00-0602J | 3M |
![]() Features: Closed Frame Packaging: Tube Mounting Type: Connector Type: DIP, ZIF (ZIP), 0.9" (22.86mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 64 (2 x 32) Termination: Press-Fit Housing Material: Polysulfone (PSU), Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 30.0µin (0.76µm) Contact Material - Post: Beryllium Copper Part Status: Active |
auf Bestellung 25 Stücke: Lieferzeit 10-14 Tag (e) |
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28-3553-10* | Aries Electronics |
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auf Bestellung 69 Stücke: Lieferzeit 10-14 Tag (e) |
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28-3554-11 | Aries Electronics |
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auf Bestellung 7 Stücke: Lieferzeit 10-14 Tag (e) |
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28-3554-16 | Aries Electronics |
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auf Bestellung 7 Stücke: Lieferzeit 10-14 Tag (e) |
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28-516-11 | Aries Electronics |
![]() Packaging: Bulk Features: Closed Frame Mounting Type: Through Hole Type: DIP, ZIF (ZIP) Number of Positions or Pins (Grid): 28 (2 x 14) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Beryllium Copper Part Status: Active |
auf Bestellung 26 Stücke: Lieferzeit 10-14 Tag (e) |
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28-526-10 | Aries Electronics |
![]() Features: Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, ZIF (ZIP) Operating Temperature: -55°C ~ 105°C Number of Positions or Pins (Grid): 28 (2 x 14) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Beryllium Copper Part Status: Active |
auf Bestellung 269 Stücke: Lieferzeit 10-14 Tag (e) |
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28-526-11 | Aries Electronics |
![]() Packaging: Bulk Features: Closed Frame Mounting Type: Through Hole Type: DIP, ZIF (ZIP) Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 28 (2 x 14) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Beryllium Copper Part Status: Active |
auf Bestellung 5 Stücke: Lieferzeit 10-14 Tag (e) |
|
Adapter SO8/DIP für Programmierung (ZIF SO8/DIP8 150mil) Produktcode: 58316
zu Favoriten hinzufügen
Lieblingsprodukt
|
Steckverbinder, Reihenklemmen > IC-Nullkraftsockel-Testsockel
Опис: Перехідник SO8/DIP
К-сть контактів: 8
Група: Перехідник
Опис: Перехідник SO8/DIP
К-сть контактів: 8
Група: Перехідник
auf Bestellung 16 Stück:
Lieferzeit 21-28 Tag (e)erwartet 20 Stück:
20 Stück - erwartet 15.08.2025Anzahl | Preis |
---|---|
1+ | 3.6 EUR |
ZIF 214-3345 Панель с нулевым усилием 14pin Produktcode: 158778
zu Favoriten hinzufügen
Lieblingsprodukt
|
Hersteller: TEXTDOL
Steckverbinder, Reihenklemmen > IC-Nullkraftsockel-Testsockel
Опис: Панель з нульовим зусиллям 14pin
К-сть контактів: 14
Група: DIP з нульовим зусиллям
Steckverbinder, Reihenklemmen > IC-Nullkraftsockel-Testsockel
Опис: Панель з нульовим зусиллям 14pin
К-сть контактів: 14
Група: DIP з нульовим зусиллям
auf Bestellung 33 Stück:
Lieferzeit 21-28 Tag (e)Im Einkaufswagen Stück im Wert von UAH
ZIF 218-3341 Platte steckwiderstandsfrei 18pin Produktcode: 45747
zu Favoriten hinzufügen
Lieblingsprodukt
|
Hersteller: TEXTDOL
Steckverbinder, Reihenklemmen > IC-Nullkraftsockel-Testsockel
Опис: Platte steckwiderstandsfrei 18pin
К-сть контактів: 18
Група: DIP з нульовим зусиллям
Steckverbinder, Reihenklemmen > IC-Nullkraftsockel-Testsockel
Опис: Platte steckwiderstandsfrei 18pin
К-сть контактів: 18
Група: DIP з нульовим зусиллям
auf Bestellung 3 Stück:
Lieferzeit 21-28 Tag (e)Anzahl | Preis |
---|---|
1+ | 3.36 EUR |
ZIF 220-3341 Platte steckwiderstandsfrei 20pin Produktcode: 45191
zu Favoriten hinzufügen
Lieblingsprodukt
|
Hersteller: 3M
Steckverbinder, Reihenklemmen > IC-Nullkraftsockel-Testsockel
Опис: Platte steckwiderstandsfrei 20pin
К-сть контактів: 20
Група: DIP з нульовим зусиллям
Steckverbinder, Reihenklemmen > IC-Nullkraftsockel-Testsockel
Опис: Platte steckwiderstandsfrei 20pin
К-сть контактів: 20
Група: DIP з нульовим зусиллям
auf Bestellung 11 Stück:
Lieferzeit 21-28 Tag (e)Anzahl | Preis |
---|---|
1+ | 2.76 EUR |
ZIF 228-3341 Platte steckwiderstandsfrei 28pin schmal 0,3" Produktcode: 86705
zu Favoriten hinzufügen
Lieblingsprodukt
|
Hersteller: TEXTDOL
Steckverbinder, Reihenklemmen > IC-Nullkraftsockel-Testsockel
Опис: Platte steckwiderstandsfrei 28pin schmal 0,3"
К-сть контактів: 28
Група: DIP з нульовим зусиллям
Steckverbinder, Reihenklemmen > IC-Nullkraftsockel-Testsockel
Опис: Platte steckwiderstandsfrei 28pin schmal 0,3"
К-сть контактів: 28
Група: DIP з нульовим зусиллям
Produkt ist nicht verfügbar
erwartet:
30 Stück
30 Stück - erwartet 28.07.2025
Anzahl | Preis |
---|---|
1+ | 2 EUR |
ZIF 232-3345 Platte steckwiderstandsfrei 32pin Produktcode: 60247
zu Favoriten hinzufügen
Lieblingsprodukt
|
Hersteller: TEXTDOL
Steckverbinder, Reihenklemmen > IC-Nullkraftsockel-Testsockel
Опис: Platte steckwiderstandsfrei 32pin
К-сть контактів: 32
Група: DIP з нульовим зусиллям
Steckverbinder, Reihenklemmen > IC-Nullkraftsockel-Testsockel
Опис: Platte steckwiderstandsfrei 32pin
К-сть контактів: 32
Група: DIP з нульовим зусиллям
auf Bestellung 21 Stück:
Lieferzeit 21-28 Tag (e)Anzahl | Preis |
---|---|
1+ | 3.76 EUR |
ZIF 240-3345 Platte steckwiderstandsfrei 40pin Produktcode: 54221
zu Favoriten hinzufügen
Lieblingsprodukt
|
Hersteller: TEXTDOL
Steckverbinder, Reihenklemmen > IC-Nullkraftsockel-Testsockel
Опис: Platte steckwiderstandsfrei 40pin
К-сть контактів: 40
Група: DIP з нульовим зусиллям
Steckverbinder, Reihenklemmen > IC-Nullkraftsockel-Testsockel
Опис: Platte steckwiderstandsfrei 40pin
К-сть контактів: 40
Група: DIP з нульовим зусиллям
auf Bestellung 7 Stück:
Lieferzeit 21-28 Tag (e)Anzahl | Preis |
---|---|
1+ | 3 EUR |
Панель с нулевым усилием 16pin (216-3341) Produktcode: 158779
zu Favoriten hinzufügen
Lieblingsprodukt
|
Hersteller: TEXTDOL
Steckverbinder, Reihenklemmen > IC-Nullkraftsockel-Testsockel
Опис: Панель з нульовим зусиллям 16pin
К-сть контактів: 16
Група: DIP з нульовим зусиллям
Steckverbinder, Reihenklemmen > IC-Nullkraftsockel-Testsockel
Опис: Панель з нульовим зусиллям 16pin
К-сть контактів: 16
Група: DIP з нульовим зусиллям
Produkt ist nicht verfügbar
erwartet:
40 Stück
40 Stück - erwartet 28.07.2025
1-84984-6 |
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Hersteller: TE Connectivity
FFC & FPC Connectors 1mm DIP V ASSY 16P
FFC & FPC Connectors 1mm DIP V ASSY 16P
auf Bestellung 5070 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
3+ | 1.03 EUR |
52+ | 1.02 EUR |
104+ | 0.86 EUR |
260+ | 0.81 EUR |
520+ | 0.77 EUR |
1014+ | 0.73 EUR |
214-3339-00-0602J |
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Hersteller: 3M
Description: CONN IC DIP SOCKET ZIF 14POS GLD
Packaging: Tube
Features: Closed Frame
Mounting Type: Connector
Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Press-Fit
Housing Material: Polysulfone (PSU), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Description: CONN IC DIP SOCKET ZIF 14POS GLD
Packaging: Tube
Features: Closed Frame
Mounting Type: Connector
Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Press-Fit
Housing Material: Polysulfone (PSU), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 13 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 36.27 EUR |
10+ | 30.84 EUR |
216-3340-00-0602J |
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Hersteller: 3M
Description: CONN IC DIP SOCKET ZIF 16POS GLD
Packaging: Tube
Features: Closed Frame
Mounting Type: Connector
Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Press-Fit
Housing Material: Polysulfone (PSU), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Description: CONN IC DIP SOCKET ZIF 16POS GLD
Packaging: Tube
Features: Closed Frame
Mounting Type: Connector
Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Press-Fit
Housing Material: Polysulfone (PSU), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 632 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 38.86 EUR |
10+ | 33.03 EUR |
30+ | 30.57 EUR |
50+ | 29.49 EUR |
100+ | 28.08 EUR |
250+ | 26.32 EUR |
500+ | 25.07 EUR |
216-3340-09-0602J |
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Hersteller: 3M Electronic Solutions Division
IC & Component Sockets RECPT FOR DIP SOCKET 16 Contact Qty.
IC & Component Sockets RECPT FOR DIP SOCKET 16 Contact Qty.
auf Bestellung 46 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 41.43 EUR |
10+ | 27.67 EUR |
218-3341-00-0602J |
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Hersteller: 3M Electronic Solutions Division
IC & Component Sockets 0.100" DIP SOCKET 18 Contact Qty.
IC & Component Sockets 0.100" DIP SOCKET 18 Contact Qty.
auf Bestellung 48 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 41.82 EUR |
10+ | 27.95 EUR |
20+ | 27.93 EUR |
218-3341-00-0602J |
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Hersteller: 3M
Description: CONN IC DIP SOCKET ZIF 18POS GLD
Packaging: Tray
Features: Closed Frame
Mounting Type: Connector
Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Press-Fit
Housing Material: Polysulfone (PSU), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Description: CONN IC DIP SOCKET ZIF 18POS GLD
Packaging: Tray
Features: Closed Frame
Mounting Type: Connector
Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Press-Fit
Housing Material: Polysulfone (PSU), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 52 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 39.93 EUR |
10+ | 33.94 EUR |
30+ | 31.41 EUR |
50+ | 30.3 EUR |
220-3342-00-0602J |
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Hersteller: 3M
Description: CONN IC DIP SOCKET ZIF 20POS GLD
Packaging: Tube
Features: Closed Frame
Mounting Type: Connector
Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Press-Fit
Housing Material: Polysulfone (PSU), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Description: CONN IC DIP SOCKET ZIF 20POS GLD
Packaging: Tube
Features: Closed Frame
Mounting Type: Connector
Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Press-Fit
Housing Material: Polysulfone (PSU), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 421 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 38.4 EUR |
10+ | 32.63 EUR |
30+ | 30.2 EUR |
50+ | 29.13 EUR |
100+ | 27.74 EUR |
250+ | 26 EUR |
220-3342-19-0602J |
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Hersteller: 3M Electronic Solutions Division
IC & Component Sockets RECPT FOR DIP SOCKET 20 Contact Qty.
IC & Component Sockets RECPT FOR DIP SOCKET 20 Contact Qty.
auf Bestellung 28 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 43.26 EUR |
10+ | 39.71 EUR |
222-3343-00-0602J |
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Hersteller: 3M
Description: CONN IC DIP SOCKET ZIF 22POS GLD
Features: Closed Frame
Packaging: Tube
Mounting Type: Connector
Type: DIP, ZIF (ZIP), 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 22 (2 x 11)
Termination: Press-Fit
Housing Material: Polysulfone (PSU), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Description: CONN IC DIP SOCKET ZIF 22POS GLD
Features: Closed Frame
Packaging: Tube
Mounting Type: Connector
Type: DIP, ZIF (ZIP), 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 22 (2 x 11)
Termination: Press-Fit
Housing Material: Polysulfone (PSU), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 8 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 43.44 EUR |
224-1275-00-0602J |
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Hersteller: 3M
Description: CONN IC DIP SOCKET ZIF 24POS GLD
Features: Closed Frame
Packaging: Tube
Mounting Type: Connector
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Press-Fit
Housing Material: Polysulfone (PSU), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Description: CONN IC DIP SOCKET ZIF 24POS GLD
Features: Closed Frame
Packaging: Tube
Mounting Type: Connector
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Press-Fit
Housing Material: Polysulfone (PSU), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 309 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 38.76 EUR |
10+ | 32.93 EUR |
30+ | 30.48 EUR |
50+ | 29.4 EUR |
100+ | 28 EUR |
250+ | 26.24 EUR |
224-1286-00-0602J |
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Hersteller: 3M
Description: CONN IC DIP SOCKET ZIF 24POS GLD
Features: Closed Frame
Packaging: Tube
Mounting Type: Connector
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Press-Fit
Housing Material: Polysulfone (PSU), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Description: CONN IC DIP SOCKET ZIF 24POS GLD
Features: Closed Frame
Packaging: Tube
Mounting Type: Connector
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Press-Fit
Housing Material: Polysulfone (PSU), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 74 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 50.3 EUR |
10+ | 42.75 EUR |
30+ | 39.56 EUR |
50+ | 38.16 EUR |
224-5248-00-0602J |
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Hersteller: 3M
Description: CONN IC DIP SOCKET ZIF 24POS GLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Connector
Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Press-Fit
Housing Material: Polysulfone (PSU), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Description: CONN IC DIP SOCKET ZIF 24POS GLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Connector
Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Press-Fit
Housing Material: Polysulfone (PSU), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 73 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 51.39 EUR |
10+ | 43.68 EUR |
30+ | 40.43 EUR |
50+ | 39 EUR |
228-1277-00-0602J |
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Hersteller: 3M
Description: CONN IC DIP SOCKET ZIF 28POS GLD
Features: Closed Frame
Packaging: Tube
Mounting Type: Connector
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Press-Fit
Housing Material: Polysulfone (PSU), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Description: CONN IC DIP SOCKET ZIF 28POS GLD
Features: Closed Frame
Packaging: Tube
Mounting Type: Connector
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Press-Fit
Housing Material: Polysulfone (PSU), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 7 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 43.72 EUR |
228-1277-19-0602J |
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Hersteller: 3M Electronic Solutions Division
IC & Component Sockets RECPT FOR DIP SOCKET 28 Contact Qty.
IC & Component Sockets RECPT FOR DIP SOCKET 28 Contact Qty.
auf Bestellung 40 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 42.84 EUR |
228-1277-39-0602J |
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Hersteller: 3M Electronic Solutions Division
IC & Component Sockets RECPT FOR DIP SOCKET 28 Contact Qty.
IC & Component Sockets RECPT FOR DIP SOCKET 28 Contact Qty.
auf Bestellung 23 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 60.93 EUR |
10+ | 51.78 EUR |
30+ | 42.33 EUR |
50+ | 41.69 EUR |
228-1290-00-0602J |
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Hersteller: 3M
Description: CONN IC DIP SOCKET ZIF 28POS GLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Connector
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Press-Fit
Housing Material: Polysulfone (PSU), Glass Filled
Pitch - Mating: 0.070" (1.78mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Description: CONN IC DIP SOCKET ZIF 28POS GLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Connector
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Press-Fit
Housing Material: Polysulfone (PSU), Glass Filled
Pitch - Mating: 0.070" (1.78mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 19 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 45.95 EUR |
10+ | 39.05 EUR |
228-1371-00-0602J |
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Hersteller: 3M
Description: CONN IC DIP SOCKET ZIF 28POS GLD
Features: Closed Frame
Packaging: Tray
Mounting Type: Connector
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Press-Fit
Housing Material: Polysulfone (PSU), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Description: CONN IC DIP SOCKET ZIF 28POS GLD
Features: Closed Frame
Packaging: Tray
Mounting Type: Connector
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Press-Fit
Housing Material: Polysulfone (PSU), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 11 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 60.44 EUR |
10+ | 51.37 EUR |
228-4817-00-0602J |
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Hersteller: 3M
Description: CONN IC DIP SOCKET ZIF 28POS GLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Connector
Type: DIP, ZIF (ZIP), 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Press-Fit
Housing Material: Polysulfone (PSU), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Description: CONN IC DIP SOCKET ZIF 28POS GLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Connector
Type: DIP, ZIF (ZIP), 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Press-Fit
Housing Material: Polysulfone (PSU), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 13 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 49.67 EUR |
10+ | 42.21 EUR |
228-4817-09-0602J |
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Hersteller: 3M Electronic Solutions Division
IC & Component Sockets RECPT FOR DIP SOCKET 28 Contact Qty.
IC & Component Sockets RECPT FOR DIP SOCKET 28 Contact Qty.
auf Bestellung 7 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 46.75 EUR |
10+ | 32.84 EUR |
20+ | 30.89 EUR |
232-1285-00-0602J |
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Hersteller: 3M
Description: CONN IC DIP SOCKET ZIF 32POS GLD
Features: Closed Frame
Packaging: Tube
Mounting Type: Connector
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Press-Fit
Housing Material: Polysulfone (PSU), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Description: CONN IC DIP SOCKET ZIF 32POS GLD
Features: Closed Frame
Packaging: Tube
Mounting Type: Connector
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Press-Fit
Housing Material: Polysulfone (PSU), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 21 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 43.75 EUR |
10+ | 37.19 EUR |
232-1291-00-0602J |
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Hersteller: 3M Electronic Solutions Division
IC & Component Sockets 0.070" DIP SOCKET 32 Contact Qty.
IC & Component Sockets 0.070" DIP SOCKET 32 Contact Qty.
auf Bestellung 18 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 59.77 EUR |
10+ | 51.96 EUR |
30+ | 42.87 EUR |
50+ | 42.2 EUR |
100+ | 41.5 EUR |
250+ | 41.27 EUR |
24-3551-11 |
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Hersteller: Aries Electronics
IC & Component Sockets DIP TEST SCKT GOLD 24 PINS
IC & Component Sockets DIP TEST SCKT GOLD 24 PINS
auf Bestellung 19 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 32.89 EUR |
10+ | 27.95 EUR |
20+ | 26.21 EUR |
50+ | 24.24 EUR |
100+ | 23.21 EUR |
200+ | 22.48 EUR |
500+ | 22.09 EUR |
24-3553-10 |
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Hersteller: Aries Electronics
IC & Component Sockets DIP TEST SCKT TIN 24 PINS
IC & Component Sockets DIP TEST SCKT TIN 24 PINS
auf Bestellung 47 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 21.49 EUR |
10+ | 18.27 EUR |
20+ | 17.99 EUR |
50+ | 16.81 EUR |
100+ | 14.01 EUR |
200+ | 13.6 EUR |
500+ | 13.16 EUR |
24-3554-10 |
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Hersteller: Aries Electronics
IC & Component Sockets DIP TEST SCKT TIN 24 PINS
IC & Component Sockets DIP TEST SCKT TIN 24 PINS
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 21.12 EUR |
10+ | 17.2 EUR |
20+ | 16.6 EUR |
50+ | 14.01 EUR |
200+ | 13.53 EUR |
500+ | 13.08 EUR |
1000+ | 12.58 EUR |
24-526-10 |
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Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 24POS TIN
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP)
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Description: CONN IC DIP SOCKET ZIF 24POS TIN
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP)
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 48 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
2+ | 16.79 EUR |
17+ | 13.74 EUR |
34+ | 13.09 EUR |
24-526-11 |
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Hersteller: Aries Electronics
IC & Component Sockets Zero-Insertion-Force Socket
IC & Component Sockets Zero-Insertion-Force Socket
auf Bestellung 33 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 30.84 EUR |
10+ | 26.73 EUR |
17+ | 25.33 EUR |
51+ | 21.38 EUR |
102+ | 20.75 EUR |
255+ | 19.99 EUR |
510+ | 19.69 EUR |
24-6554-10 |
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Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 24POS TIN
Packaging: Tube
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Description: CONN IC DIP SOCKET ZIF 24POS TIN
Packaging: Tube
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 119 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
2+ | 16.74 EUR |
10+ | 14.23 EUR |
30+ | 13.17 EUR |
50+ | 12.7 EUR |
100+ | 12.1 EUR |
24-6554-11 |
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Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 24POS GLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Material - Post: Beryllium Copper
Part Status: Active
Description: CONN IC DIP SOCKET ZIF 24POS GLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 78 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 27.88 EUR |
10+ | 23.69 EUR |
30+ | 21.92 EUR |
50+ | 21.15 EUR |
24-6554-16 |
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Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 24POS
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Nickel Boron
Contact Finish Thickness - Mating: 50.0µin (1.27µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Nickel Boron
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Description: CONN IC DIP SOCKET ZIF 24POS
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Nickel Boron
Contact Finish Thickness - Mating: 50.0µin (1.27µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Nickel Boron
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 73 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 78.34 EUR |
10+ | 66.58 EUR |
30+ | 61.62 EUR |
50+ | 59.44 EUR |
24-6572-11 |
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Hersteller: Aries Electronics
IC & Component Sockets QUICK RELEASE 24 PIN GOLD
IC & Component Sockets QUICK RELEASE 24 PIN GOLD
auf Bestellung 26 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 41.71 EUR |
12+ | 31.28 EUR |
24+ | 31.26 EUR |
60+ | 30.98 EUR |
108+ | 29.09 EUR |
252+ | 28.28 EUR |
504+ | 27.84 EUR |
240-1280-00-0602J |
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Hersteller: 3M
Description: CONN IC DIP SOCKET ZIF 40POS GLD
Features: Closed Frame
Packaging: Tube
Mounting Type: Connector
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Press-Fit
Housing Material: Polysulfone (PSU), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Description: CONN IC DIP SOCKET ZIF 40POS GLD
Features: Closed Frame
Packaging: Tube
Mounting Type: Connector
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Press-Fit
Housing Material: Polysulfone (PSU), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 177 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 48.86 EUR |
10+ | 41.52 EUR |
30+ | 38.42 EUR |
50+ | 37.06 EUR |
100+ | 35.3 EUR |
240-1280-19-0602J |
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Hersteller: 3M Electronic Solutions Division
IC & Component Sockets RECPT FOR DIP SOCKET 40 Contact Qty.
IC & Component Sockets RECPT FOR DIP SOCKET 40 Contact Qty.
auf Bestellung 23 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 76.67 EUR |
10+ | 65.14 EUR |
30+ | 59.49 EUR |
50+ | 57.11 EUR |
100+ | 54.33 EUR |
250+ | 54.23 EUR |
240-1280-39-0602J |
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Hersteller: 3M Electronic Solutions Division
IC & Component Sockets RECPT FOR DIP SOCKET 40 Contact Qty.
IC & Component Sockets RECPT FOR DIP SOCKET 40 Contact Qty.
auf Bestellung 50 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 59.03 EUR |
10+ | 50.74 EUR |
25+ | 48.56 EUR |
50+ | 46.97 EUR |
100+ | 40.32 EUR |
240-1288-00-0602J |
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Hersteller: 3M
Description: CONN IC DIP SOCKET ZIF 40POS GLD
Features: Closed Frame
Packaging: Tube
Mounting Type: Connector
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Press-Fit
Housing Material: Polysulfone (PSU), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Description: CONN IC DIP SOCKET ZIF 40POS GLD
Features: Closed Frame
Packaging: Tube
Mounting Type: Connector
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Press-Fit
Housing Material: Polysulfone (PSU), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 3 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 74.78 EUR |
240-3639-00-0602J |
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Hersteller: 3M
Description: CONN IC DIP SOCKET ZIF 40POS GLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Connector
Type: DIP, ZIF (ZIP), 1.0" (25.40mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Press-Fit
Housing Material: Polysulfone (PSU), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Description: CONN IC DIP SOCKET ZIF 40POS GLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Connector
Type: DIP, ZIF (ZIP), 1.0" (25.40mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Press-Fit
Housing Material: Polysulfone (PSU), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 15 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 69.06 EUR |
10+ | 58.69 EUR |
240-3639-19-0602J |
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Hersteller: 3M Electronic Solutions Division
IC & Component Sockets RECPT FOR DIP SOCKET 40 Contact Qty.
IC & Component Sockets RECPT FOR DIP SOCKET 40 Contact Qty.
auf Bestellung 14 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 70.17 EUR |
10+ | 61 EUR |
30+ | 49.81 EUR |
50+ | 49.05 EUR |
100+ | 48.49 EUR |
242-1281-09-0602J |
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Hersteller: 3M Electronic Solutions Division
IC & Component Sockets RECPT FOR DIP SOCKET 42 Contact Qty.
IC & Component Sockets RECPT FOR DIP SOCKET 42 Contact Qty.
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 37.88 EUR |
10+ | 28.09 EUR |
20+ | 26.07 EUR |
50+ | 25.61 EUR |
100+ | 24.64 EUR |
242-1289-00-0602J |
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Hersteller: 3M
Description: CONN IC DIP SOCKET ZIF 42POS GLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Connector
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 42 (2 x 21)
Termination: Press-Fit
Housing Material: Polysulfone (PSU), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Description: CONN IC DIP SOCKET ZIF 42POS GLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Connector
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 42 (2 x 21)
Termination: Press-Fit
Housing Material: Polysulfone (PSU), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 11 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 75.31 EUR |
10+ | 64.01 EUR |
242-1293-00-0602J |
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Hersteller: 3M
Description: CONN IC DIP SOCKET ZIF 42POS GLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Connector
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 42 (2 x 21)
Termination: Press-Fit
Housing Material: Polysulfone (PSU), Glass Filled
Pitch - Mating: 0.070" (1.78mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Description: CONN IC DIP SOCKET ZIF 42POS GLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Connector
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 42 (2 x 21)
Termination: Press-Fit
Housing Material: Polysulfone (PSU), Glass Filled
Pitch - Mating: 0.070" (1.78mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 5 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 57.27 EUR |
242-1293-09-0602J |
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Hersteller: 3M Electronic Solutions Division
IC & Component Sockets RECPT FOR DIP SOCKET 42 Contact Qty.
IC & Component Sockets RECPT FOR DIP SOCKET 42 Contact Qty.
auf Bestellung 13 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 46.39 EUR |
10+ | 39.41 EUR |
20+ | 38.42 EUR |
50+ | 32.44 EUR |
100+ | 31.93 EUR |
200+ | 31.5 EUR |
500+ | 31.31 EUR |
248-1282-00-0602J |
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Hersteller: 3M
Description: CONN IC DIP SOCKET ZIF 48POS GLD
Packaging: Tube
Features: Closed Frame
Mounting Type: Connector
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 48 (2 x 24)
Termination: Press-Fit
Housing Material: Polysulfone (PSU), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Description: CONN IC DIP SOCKET ZIF 48POS GLD
Packaging: Tube
Features: Closed Frame
Mounting Type: Connector
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 48 (2 x 24)
Termination: Press-Fit
Housing Material: Polysulfone (PSU), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 372 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 60.26 EUR |
10+ | 51.23 EUR |
25+ | 48.02 EUR |
50+ | 45.73 EUR |
100+ | 43.55 EUR |
250+ | 40.83 EUR |
256-1292-00-0602J |
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Hersteller: 3M
Description: CONN IC DIP SOCKET ZIF 56POS GLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Connector
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 56 (2 x 28)
Termination: Press-Fit
Housing Material: Polysulfone (PSU), Glass Filled
Pitch - Mating: 0.070" (1.78mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Description: CONN IC DIP SOCKET ZIF 56POS GLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Connector
Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 56 (2 x 28)
Termination: Press-Fit
Housing Material: Polysulfone (PSU), Glass Filled
Pitch - Mating: 0.070" (1.78mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 11 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 76.58 EUR |
10+ | 65.1 EUR |
264-1300-00-0602J |
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Hersteller: 3M
Description: CONN IC DIP SOCKET ZIF 64POS GLD
Packaging: Tube
Features: Closed Frame
Mounting Type: Connector
Type: DIP, ZIF (ZIP), 0.9" (22.86mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 64 (2 x 32)
Termination: Press-Fit
Housing Material: Polysulfone (PSU), Glass Filled
Pitch - Mating: 0.070" (1.78mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.070" (1.78mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Description: CONN IC DIP SOCKET ZIF 64POS GLD
Packaging: Tube
Features: Closed Frame
Mounting Type: Connector
Type: DIP, ZIF (ZIP), 0.9" (22.86mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 64 (2 x 32)
Termination: Press-Fit
Housing Material: Polysulfone (PSU), Glass Filled
Pitch - Mating: 0.070" (1.78mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.070" (1.78mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 167 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 73.11 EUR |
10+ | 62.14 EUR |
30+ | 57.51 EUR |
50+ | 55.47 EUR |
100+ | 52.83 EUR |
264-1300-00-0602J |
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Hersteller: 3M Electronic Solutions Division
IC & Component Sockets 0.070" DIP SOCKET 64 Contact Qty.
IC & Component Sockets 0.070" DIP SOCKET 64 Contact Qty.
auf Bestellung 30 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 58.54 EUR |
10+ | 54.16 EUR |
264-1300-29-0602J |
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Hersteller: 3M Electronic Solutions Division
IC & Component Sockets RECPT FOR DIP SOCKET 64 Contact Qty.
IC & Component Sockets RECPT FOR DIP SOCKET 64 Contact Qty.
auf Bestellung 7 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 69.85 EUR |
10+ | 47.8 EUR |
264-4493-00-0602J |
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Hersteller: 3M
Description: CONN IC DIP SOCKET ZIF 64POS GLD
Features: Closed Frame
Packaging: Tube
Mounting Type: Connector
Type: DIP, ZIF (ZIP), 0.9" (22.86mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 64 (2 x 32)
Termination: Press-Fit
Housing Material: Polysulfone (PSU), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Description: CONN IC DIP SOCKET ZIF 64POS GLD
Features: Closed Frame
Packaging: Tube
Mounting Type: Connector
Type: DIP, ZIF (ZIP), 0.9" (22.86mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 64 (2 x 32)
Termination: Press-Fit
Housing Material: Polysulfone (PSU), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 25 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 96.8 EUR |
10+ | 82.28 EUR |
25+ | 77.13 EUR |
28-3553-10* |
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Hersteller: Aries Electronics
IC & Component Sockets
IC & Component Sockets
auf Bestellung 69 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 24.11 EUR |
9+ | 19.64 EUR |
27+ | 15.96 EUR |
252+ | 15.52 EUR |
504+ | 15.01 EUR |
1008+ | 14.48 EUR |
28-3554-11 |
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Hersteller: Aries Electronics
IC & Component Sockets DIP TEST SCKT GOLD 28 PINS
IC & Component Sockets DIP TEST SCKT GOLD 28 PINS
auf Bestellung 7 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 35.69 EUR |
9+ | 28.88 EUR |
27+ | 26.36 EUR |
108+ | 24.92 EUR |
252+ | 24.31 EUR |
504+ | 23.95 EUR |
28-3554-16 |
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Hersteller: Aries Electronics
IC & Component Sockets DIP TEST SCKT NICKEL 28 PINS
IC & Component Sockets DIP TEST SCKT NICKEL 28 PINS
auf Bestellung 7 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 87.24 EUR |
9+ | 72.69 EUR |
27+ | 72.48 EUR |
54+ | 70.73 EUR |
108+ | 66.3 EUR |
252+ | 66.05 EUR |
28-516-11 |
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Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 28POS GLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP)
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Description: CONN IC DIP SOCKET ZIF 28POS GLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP)
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 26 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 22.65 EUR |
13+ | 18.9 EUR |
26+ | 18 EUR |
28-526-10 |
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Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 28POS TIN
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP)
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Description: CONN IC DIP SOCKET ZIF 28POS TIN
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP)
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 269 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
2+ | 16.53 EUR |
15+ | 13.65 EUR |
30+ | 13 EUR |
60+ | 12.38 EUR |
105+ | 11.9 EUR |
255+ | 11.18 EUR |
28-526-11 |
![]() |
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET ZIF 28POS GLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP)
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Description: CONN IC DIP SOCKET ZIF 28POS GLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, ZIF (ZIP)
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 5 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 30.32 EUR |
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