Suchergebnisse für "lm104" : > 120
Art der Ansicht :
Mindestbestellmenge: 35
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
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SLM-104-01-T-S | Samtec |
 Headers & Wire Housings Through-Hole Micro Socket, 0.050" x 0.100" Pitch |
auf Bestellung 142 Stücke: Lieferzeit 14-28 Tag (e) |
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| SAA5665HL/M1/0479 | PHILIPS | QFP |
auf Bestellung 1530 Stücke: Lieferzeit 21-28 Tag (e) |
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ALS40A104KF025 | KEMET |
Description: CAP ALUM 100000UF 20% 25V SCREW Tolerance: ±20% Packaging: Bulk Package / Case: Radial, Can - Screw Terminals Size / Dimension: 2.008" Dia (51.00mm) Polarization: Polar Mounting Type: Chassis Mount Operating Temperature: -40°C ~ 105°C Applications: General Purpose Lead Spacing: 0.874" (22.20mm) ESR (Equivalent Series Resistance): 9mOhm @ 100Hz Lifetime @ Temp.: 7000 Hrs @ 105°C Height - Seated (Max): 4.213" (107.00mm) Part Status: Active Capacitance: 100000 µF Voltage - Rated: 25 V Impedance: 8 mOhms Ripple Current @ Low Frequency: 16.4 A @ 100 Hz Ripple Current @ High Frequency: 16.7 A @ 10 kHz |
auf Bestellung 9 Stücke: Lieferzeit 10-14 Tag (e) |
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ALS40A104KF025 | KEMET |
Aluminium Electrolytic Capacitors - Screw Terminal 0.1F 25VDC 20% 51 X 105mm |
auf Bestellung 80 Stücke: Lieferzeit 14-28 Tag (e) |
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CLM-104-02-F-D | Samtec |
Conn Micro Socket Strip SKT 8 POS 1mm Solder ST Top Entry SMD Bulk |
Produkt ist nicht verfügbar |
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CLM-104-02-F-D-A | Samtec Inc. |
Description: CONN RCPT 8POS 0.039 GOLD SMD Packaging: Bulk Features: Board Guide Connector Type: Receptacle Current Rating (Amps): 2.8A per Contact Mounting Type: Surface Mount Number of Positions: 8 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.039" (1.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 3.00µin (0.076µm) Contact Finish - Post: Tin Insulation Height: 0.084" (2.14mm) Row Spacing - Mating: 0.039" (1.00mm) Number of Rows: 2 |
Produkt ist nicht verfügbar |
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CLM-104-02-F-D-A | Samtec |
Conn Micro Socket Strip SKT 8 POS 1mm Solder ST SMD Layer |
Produkt ist nicht verfügbar |
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CLM-104-02-F-D-A | Samtec |
Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket, 1.00mm Pitch |
Produkt ist nicht verfügbar |
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CLM-104-02-F-D-A-TR | Samtec Inc. |
Description: CONN RCPT 8POS 0.039 GOLD SMD Packaging: Tape & Reel (TR) Features: Board Guide Connector Type: Receptacle Current Rating (Amps): 2.8A per Contact Mounting Type: Surface Mount Number of Positions: 8 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.039" (1.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 3.00µin (0.076µm) Contact Finish - Post: Tin Insulation Height: 0.084" (2.14mm) Row Spacing - Mating: 0.039" (1.00mm) Number of Rows: 2 |
Produkt ist nicht verfügbar |
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CLM-104-02-F-D-A-TR | Samtec |
Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket, 1.00mm Pitch |
Produkt ist nicht verfügbar |
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CLM-104-02-F-D-BE | Samtec Inc. |
Description: CONN RCPT 8POS 0.039 GOLD SMD Packaging: Bulk Connector Type: Receptacle, Bottom Entry Current Rating (Amps): 2.8A per Contact Mounting Type: Surface Mount Number of Positions: 8 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.039" (1.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 3.00µin (0.076µm) Contact Finish - Post: Tin Insulation Height: 0.084" (2.14mm) Row Spacing - Mating: 0.039" (1.00mm) Number of Rows: 2 |
Produkt ist nicht verfügbar |
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CLM-104-02-F-D-BE | Samtec |
Conn Micro Socket Strip SKT 8 POS 1mm Solder ST SMD Bulk |
Produkt ist nicht verfügbar |
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CLM-104-02-F-D-BE | Samtec |
Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket, 1.00mm Pitch |
Produkt ist nicht verfügbar |
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CLM-104-02-F-D-BE-A | Samtec |
Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket, 1.00mm Pitch |
Produkt ist nicht verfügbar |
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| CLM-104-02-F-D-BE-K | Samtec Inc. |
Description: LOW PROFILE DUAL-WIPE SOCKET, 1. Packaging: Tube Features: Pick and Place Connector Type: Receptacle, Bottom Entry Current Rating (Amps): 2.8A per Contact Mounting Type: Surface Mount Number of Positions: 8 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.039" (1.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 3.00µin (0.076µm) Contact Finish - Post: Tin Insulation Height: 0.084" (2.14mm) Row Spacing - Mating: 0.039" (1.00mm) Number of Rows: 2 |
Produkt ist nicht verfügbar |
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| CLM-104-02-F-D-BE-K-TR | Samtec Inc. |
Description: LOW PROFILE DUAL-WIPE SOCKET, 1. Features: Pick and Place Packaging: Tape & Reel (TR) Connector Type: Receptacle, Bottom Entry Current Rating (Amps): 2.8A per Contact Mounting Type: Surface Mount Number of Positions: 8 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.039" (1.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 3.00µin (0.076µm) Contact Finish - Post: Tin Insulation Height: 0.084" (2.14mm) Row Spacing - Mating: 0.039" (1.00mm) Number of Rows: 2 |
Produkt ist nicht verfügbar |
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CLM-104-02-F-D-BE-PA | Samtec |
Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket, 1.00mm Pitch |
Produkt ist nicht verfügbar |
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CLM-104-02-F-D-BE-PA-TR | Samtec Inc. |
Description: CONN RCPT 8POS 0.039 GOLD SMD Packaging: Tape & Reel (TR) Features: Pick and Place Connector Type: Receptacle, Bottom Entry Current Rating (Amps): 2.8A per Contact Mounting Type: Surface Mount Number of Positions: 8 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.039" (1.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 3.00µin (0.076µm) Contact Finish - Post: Tin Part Status: Active Insulation Height: 0.084" (2.14mm) Row Spacing - Mating: 0.039" (1.00mm) Number of Rows: 2 |
Produkt ist nicht verfügbar |
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CLM-104-02-F-D-BE-TR | Samtec Inc. |
Description: CONN RCPT 8POS 0.039 GOLD SMD Packaging: Tape & Reel (TR) Connector Type: Receptacle, Bottom Entry Current Rating (Amps): 2.8A per Contact Mounting Type: Surface Mount Number of Positions: 8 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.039" (1.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 3.00µin (0.076µm) Contact Finish - Post: Tin Part Status: Active Insulation Height: 0.084" (2.14mm) Row Spacing - Mating: 0.039" (1.00mm) Number of Rows: 2 |
Produkt ist nicht verfügbar |
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CLM-104-02-F-D-BE-TR | Samtec |
Conn Micro Socket Strip SKT 8 POS 1mm Solder ST SMD T/R |
Produkt ist nicht verfügbar |
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CLM-104-02-F-D-BE-TR | Samtec |
Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket, 1.00mm Pitch |
Produkt ist nicht verfügbar |
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| CLM-104-02-F-D-K | Samtec Inc. |
Description: LOW PROFILE DUAL-WIPE SOCKET, 1. Packaging: Tube Features: Pick and Place Connector Type: Receptacle Current Rating (Amps): 2.8A per Contact Mounting Type: Surface Mount Number of Positions: 8 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.039" (1.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 3.00µin (0.076µm) Contact Finish - Post: Tin Insulation Height: 0.084" (2.14mm) Row Spacing - Mating: 0.039" (1.00mm) Number of Rows: 2 |
Produkt ist nicht verfügbar |
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| CLM-104-02-F-D-K-TR | Samtec Inc. |
Description: LOW PROFILE DUAL-WIPE SOCKET, 1. Features: Pick and Place Packaging: Tape & Reel (TR) Connector Type: Receptacle Current Rating (Amps): 2.8A per Contact Mounting Type: Surface Mount Number of Positions: 8 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.039" (1.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 3.00µin (0.076µm) Contact Finish - Post: Tin Insulation Height: 0.084" (2.14mm) Row Spacing - Mating: 0.039" (1.00mm) Number of Rows: 2 |
Produkt ist nicht verfügbar |
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| CLM-104-02-F-D-K-TR | Samtec |
CLM-104-02-F-D-K-TR |
Produkt ist nicht verfügbar |
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CLM-104-02-F-D-K-TR | Samtec |
Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket, 1.00mm Pitch |
Produkt ist nicht verfügbar |
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CLM-104-02-F-D-PA | Samtec Inc. |
Description: CONN RCPT 8POS 0.039 GOLD SMD Packaging: Tray Features: Pick and Place Connector Type: Receptacle Current Rating (Amps): 2.8A per Contact Mounting Type: Surface Mount Number of Positions: 8 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.039" (1.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 3.00µin (0.076µm) Contact Finish - Post: Tin Part Status: Active Insulation Height: 0.084" (2.14mm) Row Spacing - Mating: 0.039" (1.00mm) Number of Rows: 2 |
Produkt ist nicht verfügbar |
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CLM-104-02-F-D-PA-TR | Samtec Inc. |
Description: CONN RCPT 8POS 0.039 GOLD SMD Packaging: Tape & Reel (TR) Features: Pick and Place Connector Type: Receptacle Current Rating (Amps): 2.8A per Contact Mounting Type: Surface Mount Number of Positions: 8 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.039" (1.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 3.00µin (0.076µm) Contact Finish - Post: Tin Part Status: Active Insulation Height: 0.084" (2.14mm) Row Spacing - Mating: 0.039" (1.00mm) Number of Rows: 2 |
Produkt ist nicht verfügbar |
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CLM-104-02-F-D-PA-TR | Samtec |
Conn Micro Socket Strip SKT 8 POS 1mm Solder ST SMD T/R |
Produkt ist nicht verfügbar |
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CLM-104-02-F-D-TR | Samtec Inc. |
Description: CONN RCPT 8POS 0.039 GOLD SMD Packaging: Tape & Reel (TR) Connector Type: Receptacle Current Rating (Amps): 2.8A per Contact Mounting Type: Surface Mount Number of Positions: 8 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.039" (1.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 3.00µin (0.076µm) Contact Finish - Post: Tin Part Status: Active Insulation Height: 0.084" (2.14mm) Row Spacing - Mating: 0.039" (1.00mm) Number of Rows: 2 |
Produkt ist nicht verfügbar |
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CLM-104-02-F-D-TR | Samtec |
Conn Micro Socket Strip SKT 8 POS 1mm Solder ST SMD T/R |
Produkt ist nicht verfügbar |
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CLM-104-02-FM-D | Samtec |
Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket, 1.00mm Pitch |
Produkt ist nicht verfügbar |
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CLM-104-02-FM-D-A-TR | Samtec Inc. |
Description: CONN RCPT 8POS 0.039 GOLD SMD Packaging: Tape & Reel (TR) Features: Board Guide Connector Type: Receptacle Current Rating (Amps): 2.8A per Contact Mounting Type: Surface Mount Number of Positions: 8 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.039" (1.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 3.00µin (0.076µm) Contact Finish - Post: Tin Part Status: Active Insulation Height: 0.084" (2.14mm) Row Spacing - Mating: 0.039" (1.00mm) Number of Rows: 2 |
Produkt ist nicht verfügbar |
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CLM-104-02-FM-D-A-TR | Samtec |
Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket, 1.00mm Pitch |
Produkt ist nicht verfügbar |
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CLM-104-02-FM-D-TR | Samtec Inc. |
Description: CONN RCPT 8POS 0.039 GOLD SMD Packaging: Tape & Reel (TR) Connector Type: Receptacle Current Rating (Amps): 2.8A per Contact Mounting Type: Surface Mount Number of Positions: 8 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.039" (1.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 3.00µin (0.076µm) Contact Finish - Post: Tin Part Status: Active Insulation Height: 0.084" (2.14mm) Row Spacing - Mating: 0.039" (1.00mm) Number of Rows: 2 |
Produkt ist nicht verfügbar |
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CLM-104-02-FM-D-TR | Samtec |
Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket, 1.00mm Pitch |
Produkt ist nicht verfügbar |
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CLM-104-02-FM-D-TR 1000 | Samtec |
Conn Micro Socket Strip SKT 8 POS 1mm Solder ST SMD T/R |
Produkt ist nicht verfügbar |
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CLM-104-02-G-D | Samtec |
Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket, 1.00mm Pitch |
Produkt ist nicht verfügbar |
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CLM-104-02-G-D-A | Samtec |
Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket, 1.00mm Pitch |
Produkt ist nicht verfügbar |
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CLM-104-02-G-D-BE | Samtec |
Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket, 1.00mm Pitch |
Produkt ist nicht verfügbar |
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CLM-104-02-G-D-BE-A | Samtec |
Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket, 1.00mm Pitch |
Produkt ist nicht verfügbar |
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CLM-104-02-G-D-BE-PA-TR | Samtec Inc. |
Description: CONN RCPT 8POS 0.039 GOLD SMD Packaging: Tape & Reel (TR) Features: Pick and Place Connector Type: Receptacle, Bottom Entry Current Rating (Amps): 2.8A per Contact Mounting Type: Surface Mount Number of Positions: 8 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.039" (1.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Post: Gold Part Status: Active Insulation Height: 0.084" (2.14mm) Row Spacing - Mating: 0.039" (1.00mm) Number of Rows: 2 |
Produkt ist nicht verfügbar |
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CLM-104-02-G-D-BE-PA-TR | Samtec |
Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket, 1.00mm Pitch |
Produkt ist nicht verfügbar |
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CLM-104-02-G-D-BE-TR | Samtec Inc. |
Description: CONN RCPT 8POS 0.039 GOLD SMD Packaging: Tape & Reel (TR) Connector Type: Receptacle, Bottom Entry Current Rating (Amps): 2.8A per Contact Mounting Type: Surface Mount Number of Positions: 8 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.039" (1.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Post: Gold Part Status: Active Insulation Height: 0.084" (2.14mm) Row Spacing - Mating: 0.039" (1.00mm) Number of Rows: 2 |
Produkt ist nicht verfügbar |
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CLM-104-02-G-D-BE-TR | Samtec |
Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket, 1.00mm Pitch |
Produkt ist nicht verfügbar |
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CLM-104-02-G-D-TR | Samtec Inc. |
Description: CONN RCPT 8POS 0.039 GOLD SMD Packaging: Tape & Reel (TR) Connector Type: Receptacle Current Rating (Amps): 2.8A per Contact Mounting Type: Surface Mount Number of Positions: 8 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.039" (1.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Post: Gold Part Status: Active Insulation Height: 0.084" (2.14mm) Row Spacing - Mating: 0.039" (1.00mm) Number of Rows: 2 |
Produkt ist nicht verfügbar |
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CLM-104-02-G-D-TR | Samtec |
Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket, 1.00mm Pitch |
Produkt ist nicht verfügbar |
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CLM-104-02-H-D-TR | Samtec Inc. |
Description: CONN RCPT 8POS 0.039 GOLD SMD Packaging: Tape & Reel (TR) Connector Type: Receptacle Current Rating (Amps): 2.8A per Contact Mounting Type: Surface Mount Number of Positions: 8 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.039" (1.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Post: Gold Part Status: Active Insulation Height: 0.084" (2.14mm) Row Spacing - Mating: 0.039" (1.00mm) Number of Rows: 2 |
Produkt ist nicht verfügbar |
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CLM-104-02-L-D | Samtec |
Conn Micro Socket Strip SKT 8 POS 1mm Solder ST Top Entry SMD Bulk |
Produkt ist nicht verfügbar |
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CLM-104-02-L-D-A | Samtec |
Conn Micro Socket Strip SKT 8 POS 1mm Solder ST SMD Bulk |
Produkt ist nicht verfügbar |
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CLM-104-02-L-D-A | Samtec |
Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket, 1.00mm Pitch |
Produkt ist nicht verfügbar |
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CLM-104-02-L-D-A-TR | Samtec Inc. |
Description: CONN RCPT 8POS 0.039 GOLD SMD Packaging: Tape & Reel (TR) Features: Board Guide Connector Type: Receptacle Current Rating (Amps): 2.8A per Contact Mounting Type: Surface Mount Number of Positions: 8 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.039" (1.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Post: Tin Part Status: Active Insulation Height: 0.084" (2.14mm) Row Spacing - Mating: 0.039" (1.00mm) Number of Rows: 2 |
Produkt ist nicht verfügbar |
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CLM-104-02-L-D-A-TR | Samtec |
Conn Socket Strip SKT 8 POS 1mm Solder ST SMD T/R |
Produkt ist nicht verfügbar |
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CLM-104-02-L-D-A-TR | Samtec |
Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket, 1.00mm Pitch |
Produkt ist nicht verfügbar |
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CLM-104-02-L-D-BE | Samtec |
Conn Micro Socket Strip SKT 8 POS 1mm Solder ST SMD Bulk |
Produkt ist nicht verfügbar |
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CLM-104-02-L-D-BE | Samtec |
Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket, 1.00mm Pitch |
Produkt ist nicht verfügbar |
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CLM-104-02-L-D-BE-A | Samtec |
Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket, 1.00mm Pitch |
Produkt ist nicht verfügbar |
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| CLM-104-02-L-D-BE-K-TR | Samtec Inc. |
Description: LOW PROFILE DUAL-WIPE SOCKET, 1. Features: Pick and Place Packaging: Tape & Reel (TR) Connector Type: Receptacle, Bottom Entry Current Rating (Amps): 2.8A per Contact Mounting Type: Surface Mount Number of Positions: 8 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.039" (1.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Post: Tin Insulation Height: 0.084" (2.14mm) Row Spacing - Mating: 0.039" (1.00mm) Number of Rows: 2 |
Produkt ist nicht verfügbar |
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| CLM-104-02-L-D-BE-K-TR | Samtec |
Low Profile Dual-Wipe Socket, 1.00mm Pitch |
Produkt ist nicht verfügbar |
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|
|
CLM-104-02-L-D-BE-K-TR | Samtec |
Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket, 1.00mm Pitch |
Produkt ist nicht verfügbar |
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|
CLM-104-02-L-D-BE-PA | Samtec |
Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket, 1.00mm Pitch |
Produkt ist nicht verfügbar |
| SLM-104-01-T-S |
|
Hersteller: Samtec
Headers & Wire Housings Through-Hole Micro Socket, 0.050" x 0.100" Pitch
Headers & Wire Housings Through-Hole Micro Socket, 0.050" x 0.100" Pitch
auf Bestellung 142 Stücke:
Lieferzeit 14-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 35+ | 1.5 EUR |
| 50+ | 1.16 EUR |
| 100+ | 0.94 EUR |
| 500+ | 0.8 EUR |
| 1000+ | 0.79 EUR |
| ALS40A104KF025 |
|
Hersteller: KEMET
Description: CAP ALUM 100000UF 20% 25V SCREW
Tolerance: ±20%
Packaging: Bulk
Package / Case: Radial, Can - Screw Terminals
Size / Dimension: 2.008" Dia (51.00mm)
Polarization: Polar
Mounting Type: Chassis Mount
Operating Temperature: -40°C ~ 105°C
Applications: General Purpose
Lead Spacing: 0.874" (22.20mm)
ESR (Equivalent Series Resistance): 9mOhm @ 100Hz
Lifetime @ Temp.: 7000 Hrs @ 105°C
Height - Seated (Max): 4.213" (107.00mm)
Part Status: Active
Capacitance: 100000 µF
Voltage - Rated: 25 V
Impedance: 8 mOhms
Ripple Current @ Low Frequency: 16.4 A @ 100 Hz
Ripple Current @ High Frequency: 16.7 A @ 10 kHz
Description: CAP ALUM 100000UF 20% 25V SCREW
Tolerance: ±20%
Packaging: Bulk
Package / Case: Radial, Can - Screw Terminals
Size / Dimension: 2.008" Dia (51.00mm)
Polarization: Polar
Mounting Type: Chassis Mount
Operating Temperature: -40°C ~ 105°C
Applications: General Purpose
Lead Spacing: 0.874" (22.20mm)
ESR (Equivalent Series Resistance): 9mOhm @ 100Hz
Lifetime @ Temp.: 7000 Hrs @ 105°C
Height - Seated (Max): 4.213" (107.00mm)
Part Status: Active
Capacitance: 100000 µF
Voltage - Rated: 25 V
Impedance: 8 mOhms
Ripple Current @ Low Frequency: 16.4 A @ 100 Hz
Ripple Current @ High Frequency: 16.7 A @ 10 kHz
auf Bestellung 9 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 52.54 EUR |
| ALS40A104KF025 |
|
Hersteller: KEMET
Aluminium Electrolytic Capacitors - Screw Terminal 0.1F 25VDC 20% 51 X 105mm
Aluminium Electrolytic Capacitors - Screw Terminal 0.1F 25VDC 20% 51 X 105mm
auf Bestellung 80 Stücke:
Lieferzeit 14-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 76 EUR |
| 10+ | 71.01 EUR |
| 24+ | 70.56 EUR |
| 48+ | 62.87 EUR |
| 120+ | 56 EUR |
| 264+ | 55.98 EUR |
| CLM-104-02-F-D |
|
Hersteller: Samtec
Conn Micro Socket Strip SKT 8 POS 1mm Solder ST Top Entry SMD Bulk
Conn Micro Socket Strip SKT 8 POS 1mm Solder ST Top Entry SMD Bulk
Produkt ist nicht verfügbar
| CLM-104-02-F-D-A |
|
Hersteller: Samtec Inc.
Description: CONN RCPT 8POS 0.039 GOLD SMD
Packaging: Bulk
Features: Board Guide
Connector Type: Receptacle
Current Rating (Amps): 2.8A per Contact
Mounting Type: Surface Mount
Number of Positions: 8
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.039" (1.00mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 3.00µin (0.076µm)
Contact Finish - Post: Tin
Insulation Height: 0.084" (2.14mm)
Row Spacing - Mating: 0.039" (1.00mm)
Number of Rows: 2
Description: CONN RCPT 8POS 0.039 GOLD SMD
Packaging: Bulk
Features: Board Guide
Connector Type: Receptacle
Current Rating (Amps): 2.8A per Contact
Mounting Type: Surface Mount
Number of Positions: 8
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.039" (1.00mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 3.00µin (0.076µm)
Contact Finish - Post: Tin
Insulation Height: 0.084" (2.14mm)
Row Spacing - Mating: 0.039" (1.00mm)
Number of Rows: 2
Produkt ist nicht verfügbar
| CLM-104-02-F-D-A |
|
Hersteller: Samtec
Conn Micro Socket Strip SKT 8 POS 1mm Solder ST SMD Layer
Conn Micro Socket Strip SKT 8 POS 1mm Solder ST SMD Layer
Produkt ist nicht verfügbar
| CLM-104-02-F-D-A |
|
Hersteller: Samtec
Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket, 1.00mm Pitch
Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket, 1.00mm Pitch
Produkt ist nicht verfügbar
| CLM-104-02-F-D-A-TR |
|
Hersteller: Samtec Inc.
Description: CONN RCPT 8POS 0.039 GOLD SMD
Packaging: Tape & Reel (TR)
Features: Board Guide
Connector Type: Receptacle
Current Rating (Amps): 2.8A per Contact
Mounting Type: Surface Mount
Number of Positions: 8
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.039" (1.00mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 3.00µin (0.076µm)
Contact Finish - Post: Tin
Insulation Height: 0.084" (2.14mm)
Row Spacing - Mating: 0.039" (1.00mm)
Number of Rows: 2
Description: CONN RCPT 8POS 0.039 GOLD SMD
Packaging: Tape & Reel (TR)
Features: Board Guide
Connector Type: Receptacle
Current Rating (Amps): 2.8A per Contact
Mounting Type: Surface Mount
Number of Positions: 8
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.039" (1.00mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 3.00µin (0.076µm)
Contact Finish - Post: Tin
Insulation Height: 0.084" (2.14mm)
Row Spacing - Mating: 0.039" (1.00mm)
Number of Rows: 2
Produkt ist nicht verfügbar
| CLM-104-02-F-D-A-TR |
|
Hersteller: Samtec
Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket, 1.00mm Pitch
Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket, 1.00mm Pitch
Produkt ist nicht verfügbar
| CLM-104-02-F-D-BE |
|
Hersteller: Samtec Inc.
Description: CONN RCPT 8POS 0.039 GOLD SMD
Packaging: Bulk
Connector Type: Receptacle, Bottom Entry
Current Rating (Amps): 2.8A per Contact
Mounting Type: Surface Mount
Number of Positions: 8
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.039" (1.00mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 3.00µin (0.076µm)
Contact Finish - Post: Tin
Insulation Height: 0.084" (2.14mm)
Row Spacing - Mating: 0.039" (1.00mm)
Number of Rows: 2
Description: CONN RCPT 8POS 0.039 GOLD SMD
Packaging: Bulk
Connector Type: Receptacle, Bottom Entry
Current Rating (Amps): 2.8A per Contact
Mounting Type: Surface Mount
Number of Positions: 8
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.039" (1.00mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 3.00µin (0.076µm)
Contact Finish - Post: Tin
Insulation Height: 0.084" (2.14mm)
Row Spacing - Mating: 0.039" (1.00mm)
Number of Rows: 2
Produkt ist nicht verfügbar
| CLM-104-02-F-D-BE |
|
Hersteller: Samtec
Conn Micro Socket Strip SKT 8 POS 1mm Solder ST SMD Bulk
Conn Micro Socket Strip SKT 8 POS 1mm Solder ST SMD Bulk
Produkt ist nicht verfügbar
| CLM-104-02-F-D-BE |
|
Hersteller: Samtec
Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket, 1.00mm Pitch
Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket, 1.00mm Pitch
Produkt ist nicht verfügbar
| CLM-104-02-F-D-BE-A |
|
Hersteller: Samtec
Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket, 1.00mm Pitch
Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket, 1.00mm Pitch
Produkt ist nicht verfügbar
| CLM-104-02-F-D-BE-K |
|
Hersteller: Samtec Inc.
Description: LOW PROFILE DUAL-WIPE SOCKET, 1.
Packaging: Tube
Features: Pick and Place
Connector Type: Receptacle, Bottom Entry
Current Rating (Amps): 2.8A per Contact
Mounting Type: Surface Mount
Number of Positions: 8
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.039" (1.00mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 3.00µin (0.076µm)
Contact Finish - Post: Tin
Insulation Height: 0.084" (2.14mm)
Row Spacing - Mating: 0.039" (1.00mm)
Number of Rows: 2
Description: LOW PROFILE DUAL-WIPE SOCKET, 1.
Packaging: Tube
Features: Pick and Place
Connector Type: Receptacle, Bottom Entry
Current Rating (Amps): 2.8A per Contact
Mounting Type: Surface Mount
Number of Positions: 8
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.039" (1.00mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 3.00µin (0.076µm)
Contact Finish - Post: Tin
Insulation Height: 0.084" (2.14mm)
Row Spacing - Mating: 0.039" (1.00mm)
Number of Rows: 2
Produkt ist nicht verfügbar
| CLM-104-02-F-D-BE-K-TR |
|
Hersteller: Samtec Inc.
Description: LOW PROFILE DUAL-WIPE SOCKET, 1.
Features: Pick and Place
Packaging: Tape & Reel (TR)
Connector Type: Receptacle, Bottom Entry
Current Rating (Amps): 2.8A per Contact
Mounting Type: Surface Mount
Number of Positions: 8
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.039" (1.00mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 3.00µin (0.076µm)
Contact Finish - Post: Tin
Insulation Height: 0.084" (2.14mm)
Row Spacing - Mating: 0.039" (1.00mm)
Number of Rows: 2
Description: LOW PROFILE DUAL-WIPE SOCKET, 1.
Features: Pick and Place
Packaging: Tape & Reel (TR)
Connector Type: Receptacle, Bottom Entry
Current Rating (Amps): 2.8A per Contact
Mounting Type: Surface Mount
Number of Positions: 8
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.039" (1.00mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 3.00µin (0.076µm)
Contact Finish - Post: Tin
Insulation Height: 0.084" (2.14mm)
Row Spacing - Mating: 0.039" (1.00mm)
Number of Rows: 2
Produkt ist nicht verfügbar
| CLM-104-02-F-D-BE-PA |
|
Hersteller: Samtec
Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket, 1.00mm Pitch
Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket, 1.00mm Pitch
Produkt ist nicht verfügbar
| CLM-104-02-F-D-BE-PA-TR |
|
Hersteller: Samtec Inc.
Description: CONN RCPT 8POS 0.039 GOLD SMD
Packaging: Tape & Reel (TR)
Features: Pick and Place
Connector Type: Receptacle, Bottom Entry
Current Rating (Amps): 2.8A per Contact
Mounting Type: Surface Mount
Number of Positions: 8
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.039" (1.00mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 3.00µin (0.076µm)
Contact Finish - Post: Tin
Part Status: Active
Insulation Height: 0.084" (2.14mm)
Row Spacing - Mating: 0.039" (1.00mm)
Number of Rows: 2
Description: CONN RCPT 8POS 0.039 GOLD SMD
Packaging: Tape & Reel (TR)
Features: Pick and Place
Connector Type: Receptacle, Bottom Entry
Current Rating (Amps): 2.8A per Contact
Mounting Type: Surface Mount
Number of Positions: 8
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.039" (1.00mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 3.00µin (0.076µm)
Contact Finish - Post: Tin
Part Status: Active
Insulation Height: 0.084" (2.14mm)
Row Spacing - Mating: 0.039" (1.00mm)
Number of Rows: 2
Produkt ist nicht verfügbar
| CLM-104-02-F-D-BE-TR |
|
Hersteller: Samtec Inc.
Description: CONN RCPT 8POS 0.039 GOLD SMD
Packaging: Tape & Reel (TR)
Connector Type: Receptacle, Bottom Entry
Current Rating (Amps): 2.8A per Contact
Mounting Type: Surface Mount
Number of Positions: 8
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.039" (1.00mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 3.00µin (0.076µm)
Contact Finish - Post: Tin
Part Status: Active
Insulation Height: 0.084" (2.14mm)
Row Spacing - Mating: 0.039" (1.00mm)
Number of Rows: 2
Description: CONN RCPT 8POS 0.039 GOLD SMD
Packaging: Tape & Reel (TR)
Connector Type: Receptacle, Bottom Entry
Current Rating (Amps): 2.8A per Contact
Mounting Type: Surface Mount
Number of Positions: 8
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.039" (1.00mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 3.00µin (0.076µm)
Contact Finish - Post: Tin
Part Status: Active
Insulation Height: 0.084" (2.14mm)
Row Spacing - Mating: 0.039" (1.00mm)
Number of Rows: 2
Produkt ist nicht verfügbar
| CLM-104-02-F-D-BE-TR |
|
Hersteller: Samtec
Conn Micro Socket Strip SKT 8 POS 1mm Solder ST SMD T/R
Conn Micro Socket Strip SKT 8 POS 1mm Solder ST SMD T/R
Produkt ist nicht verfügbar
| CLM-104-02-F-D-BE-TR |
|
Hersteller: Samtec
Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket, 1.00mm Pitch
Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket, 1.00mm Pitch
Produkt ist nicht verfügbar
| CLM-104-02-F-D-K |
|
Hersteller: Samtec Inc.
Description: LOW PROFILE DUAL-WIPE SOCKET, 1.
Packaging: Tube
Features: Pick and Place
Connector Type: Receptacle
Current Rating (Amps): 2.8A per Contact
Mounting Type: Surface Mount
Number of Positions: 8
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.039" (1.00mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 3.00µin (0.076µm)
Contact Finish - Post: Tin
Insulation Height: 0.084" (2.14mm)
Row Spacing - Mating: 0.039" (1.00mm)
Number of Rows: 2
Description: LOW PROFILE DUAL-WIPE SOCKET, 1.
Packaging: Tube
Features: Pick and Place
Connector Type: Receptacle
Current Rating (Amps): 2.8A per Contact
Mounting Type: Surface Mount
Number of Positions: 8
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.039" (1.00mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 3.00µin (0.076µm)
Contact Finish - Post: Tin
Insulation Height: 0.084" (2.14mm)
Row Spacing - Mating: 0.039" (1.00mm)
Number of Rows: 2
Produkt ist nicht verfügbar
| CLM-104-02-F-D-K-TR |
|
Hersteller: Samtec Inc.
Description: LOW PROFILE DUAL-WIPE SOCKET, 1.
Features: Pick and Place
Packaging: Tape & Reel (TR)
Connector Type: Receptacle
Current Rating (Amps): 2.8A per Contact
Mounting Type: Surface Mount
Number of Positions: 8
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.039" (1.00mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 3.00µin (0.076µm)
Contact Finish - Post: Tin
Insulation Height: 0.084" (2.14mm)
Row Spacing - Mating: 0.039" (1.00mm)
Number of Rows: 2
Description: LOW PROFILE DUAL-WIPE SOCKET, 1.
Features: Pick and Place
Packaging: Tape & Reel (TR)
Connector Type: Receptacle
Current Rating (Amps): 2.8A per Contact
Mounting Type: Surface Mount
Number of Positions: 8
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.039" (1.00mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 3.00µin (0.076µm)
Contact Finish - Post: Tin
Insulation Height: 0.084" (2.14mm)
Row Spacing - Mating: 0.039" (1.00mm)
Number of Rows: 2
Produkt ist nicht verfügbar
| CLM-104-02-F-D-K-TR |
|
Hersteller: Samtec
Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket, 1.00mm Pitch
Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket, 1.00mm Pitch
Produkt ist nicht verfügbar
| CLM-104-02-F-D-PA |
|
Hersteller: Samtec Inc.
Description: CONN RCPT 8POS 0.039 GOLD SMD
Packaging: Tray
Features: Pick and Place
Connector Type: Receptacle
Current Rating (Amps): 2.8A per Contact
Mounting Type: Surface Mount
Number of Positions: 8
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.039" (1.00mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 3.00µin (0.076µm)
Contact Finish - Post: Tin
Part Status: Active
Insulation Height: 0.084" (2.14mm)
Row Spacing - Mating: 0.039" (1.00mm)
Number of Rows: 2
Description: CONN RCPT 8POS 0.039 GOLD SMD
Packaging: Tray
Features: Pick and Place
Connector Type: Receptacle
Current Rating (Amps): 2.8A per Contact
Mounting Type: Surface Mount
Number of Positions: 8
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.039" (1.00mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 3.00µin (0.076µm)
Contact Finish - Post: Tin
Part Status: Active
Insulation Height: 0.084" (2.14mm)
Row Spacing - Mating: 0.039" (1.00mm)
Number of Rows: 2
Produkt ist nicht verfügbar
| CLM-104-02-F-D-PA-TR |
|
Hersteller: Samtec Inc.
Description: CONN RCPT 8POS 0.039 GOLD SMD
Packaging: Tape & Reel (TR)
Features: Pick and Place
Connector Type: Receptacle
Current Rating (Amps): 2.8A per Contact
Mounting Type: Surface Mount
Number of Positions: 8
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.039" (1.00mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 3.00µin (0.076µm)
Contact Finish - Post: Tin
Part Status: Active
Insulation Height: 0.084" (2.14mm)
Row Spacing - Mating: 0.039" (1.00mm)
Number of Rows: 2
Description: CONN RCPT 8POS 0.039 GOLD SMD
Packaging: Tape & Reel (TR)
Features: Pick and Place
Connector Type: Receptacle
Current Rating (Amps): 2.8A per Contact
Mounting Type: Surface Mount
Number of Positions: 8
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.039" (1.00mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 3.00µin (0.076µm)
Contact Finish - Post: Tin
Part Status: Active
Insulation Height: 0.084" (2.14mm)
Row Spacing - Mating: 0.039" (1.00mm)
Number of Rows: 2
Produkt ist nicht verfügbar
| CLM-104-02-F-D-PA-TR |
|
Hersteller: Samtec
Conn Micro Socket Strip SKT 8 POS 1mm Solder ST SMD T/R
Conn Micro Socket Strip SKT 8 POS 1mm Solder ST SMD T/R
Produkt ist nicht verfügbar
| CLM-104-02-F-D-TR |
|
Hersteller: Samtec Inc.
Description: CONN RCPT 8POS 0.039 GOLD SMD
Packaging: Tape & Reel (TR)
Connector Type: Receptacle
Current Rating (Amps): 2.8A per Contact
Mounting Type: Surface Mount
Number of Positions: 8
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.039" (1.00mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 3.00µin (0.076µm)
Contact Finish - Post: Tin
Part Status: Active
Insulation Height: 0.084" (2.14mm)
Row Spacing - Mating: 0.039" (1.00mm)
Number of Rows: 2
Description: CONN RCPT 8POS 0.039 GOLD SMD
Packaging: Tape & Reel (TR)
Connector Type: Receptacle
Current Rating (Amps): 2.8A per Contact
Mounting Type: Surface Mount
Number of Positions: 8
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.039" (1.00mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 3.00µin (0.076µm)
Contact Finish - Post: Tin
Part Status: Active
Insulation Height: 0.084" (2.14mm)
Row Spacing - Mating: 0.039" (1.00mm)
Number of Rows: 2
Produkt ist nicht verfügbar
| CLM-104-02-F-D-TR |
|
Hersteller: Samtec
Conn Micro Socket Strip SKT 8 POS 1mm Solder ST SMD T/R
Conn Micro Socket Strip SKT 8 POS 1mm Solder ST SMD T/R
Produkt ist nicht verfügbar
| CLM-104-02-FM-D |
|
Hersteller: Samtec
Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket, 1.00mm Pitch
Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket, 1.00mm Pitch
Produkt ist nicht verfügbar
| CLM-104-02-FM-D-A-TR |
|
Hersteller: Samtec Inc.
Description: CONN RCPT 8POS 0.039 GOLD SMD
Packaging: Tape & Reel (TR)
Features: Board Guide
Connector Type: Receptacle
Current Rating (Amps): 2.8A per Contact
Mounting Type: Surface Mount
Number of Positions: 8
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.039" (1.00mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 3.00µin (0.076µm)
Contact Finish - Post: Tin
Part Status: Active
Insulation Height: 0.084" (2.14mm)
Row Spacing - Mating: 0.039" (1.00mm)
Number of Rows: 2
Description: CONN RCPT 8POS 0.039 GOLD SMD
Packaging: Tape & Reel (TR)
Features: Board Guide
Connector Type: Receptacle
Current Rating (Amps): 2.8A per Contact
Mounting Type: Surface Mount
Number of Positions: 8
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.039" (1.00mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 3.00µin (0.076µm)
Contact Finish - Post: Tin
Part Status: Active
Insulation Height: 0.084" (2.14mm)
Row Spacing - Mating: 0.039" (1.00mm)
Number of Rows: 2
Produkt ist nicht verfügbar
| CLM-104-02-FM-D-A-TR |
|
Hersteller: Samtec
Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket, 1.00mm Pitch
Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket, 1.00mm Pitch
Produkt ist nicht verfügbar
| CLM-104-02-FM-D-TR |
|
Hersteller: Samtec Inc.
Description: CONN RCPT 8POS 0.039 GOLD SMD
Packaging: Tape & Reel (TR)
Connector Type: Receptacle
Current Rating (Amps): 2.8A per Contact
Mounting Type: Surface Mount
Number of Positions: 8
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.039" (1.00mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 3.00µin (0.076µm)
Contact Finish - Post: Tin
Part Status: Active
Insulation Height: 0.084" (2.14mm)
Row Spacing - Mating: 0.039" (1.00mm)
Number of Rows: 2
Description: CONN RCPT 8POS 0.039 GOLD SMD
Packaging: Tape & Reel (TR)
Connector Type: Receptacle
Current Rating (Amps): 2.8A per Contact
Mounting Type: Surface Mount
Number of Positions: 8
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.039" (1.00mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 3.00µin (0.076µm)
Contact Finish - Post: Tin
Part Status: Active
Insulation Height: 0.084" (2.14mm)
Row Spacing - Mating: 0.039" (1.00mm)
Number of Rows: 2
Produkt ist nicht verfügbar
| CLM-104-02-FM-D-TR |
|
Hersteller: Samtec
Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket, 1.00mm Pitch
Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket, 1.00mm Pitch
Produkt ist nicht verfügbar
| CLM-104-02-FM-D-TR 1000 |
|
Hersteller: Samtec
Conn Micro Socket Strip SKT 8 POS 1mm Solder ST SMD T/R
Conn Micro Socket Strip SKT 8 POS 1mm Solder ST SMD T/R
Produkt ist nicht verfügbar
| CLM-104-02-G-D |
|
Hersteller: Samtec
Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket, 1.00mm Pitch
Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket, 1.00mm Pitch
Produkt ist nicht verfügbar
| CLM-104-02-G-D-A |
|
Hersteller: Samtec
Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket, 1.00mm Pitch
Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket, 1.00mm Pitch
Produkt ist nicht verfügbar
| CLM-104-02-G-D-BE |
|
Hersteller: Samtec
Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket, 1.00mm Pitch
Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket, 1.00mm Pitch
Produkt ist nicht verfügbar
| CLM-104-02-G-D-BE-A |
|
Hersteller: Samtec
Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket, 1.00mm Pitch
Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket, 1.00mm Pitch
Produkt ist nicht verfügbar
| CLM-104-02-G-D-BE-PA-TR |
|
Hersteller: Samtec Inc.
Description: CONN RCPT 8POS 0.039 GOLD SMD
Packaging: Tape & Reel (TR)
Features: Pick and Place
Connector Type: Receptacle, Bottom Entry
Current Rating (Amps): 2.8A per Contact
Mounting Type: Surface Mount
Number of Positions: 8
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.039" (1.00mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Part Status: Active
Insulation Height: 0.084" (2.14mm)
Row Spacing - Mating: 0.039" (1.00mm)
Number of Rows: 2
Description: CONN RCPT 8POS 0.039 GOLD SMD
Packaging: Tape & Reel (TR)
Features: Pick and Place
Connector Type: Receptacle, Bottom Entry
Current Rating (Amps): 2.8A per Contact
Mounting Type: Surface Mount
Number of Positions: 8
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.039" (1.00mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Part Status: Active
Insulation Height: 0.084" (2.14mm)
Row Spacing - Mating: 0.039" (1.00mm)
Number of Rows: 2
Produkt ist nicht verfügbar
| CLM-104-02-G-D-BE-PA-TR |
|
Hersteller: Samtec
Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket, 1.00mm Pitch
Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket, 1.00mm Pitch
Produkt ist nicht verfügbar
| CLM-104-02-G-D-BE-TR |
|
Hersteller: Samtec Inc.
Description: CONN RCPT 8POS 0.039 GOLD SMD
Packaging: Tape & Reel (TR)
Connector Type: Receptacle, Bottom Entry
Current Rating (Amps): 2.8A per Contact
Mounting Type: Surface Mount
Number of Positions: 8
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.039" (1.00mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Part Status: Active
Insulation Height: 0.084" (2.14mm)
Row Spacing - Mating: 0.039" (1.00mm)
Number of Rows: 2
Description: CONN RCPT 8POS 0.039 GOLD SMD
Packaging: Tape & Reel (TR)
Connector Type: Receptacle, Bottom Entry
Current Rating (Amps): 2.8A per Contact
Mounting Type: Surface Mount
Number of Positions: 8
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.039" (1.00mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Part Status: Active
Insulation Height: 0.084" (2.14mm)
Row Spacing - Mating: 0.039" (1.00mm)
Number of Rows: 2
Produkt ist nicht verfügbar
| CLM-104-02-G-D-BE-TR |
|
Hersteller: Samtec
Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket, 1.00mm Pitch
Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket, 1.00mm Pitch
Produkt ist nicht verfügbar
| CLM-104-02-G-D-TR |
|
Hersteller: Samtec Inc.
Description: CONN RCPT 8POS 0.039 GOLD SMD
Packaging: Tape & Reel (TR)
Connector Type: Receptacle
Current Rating (Amps): 2.8A per Contact
Mounting Type: Surface Mount
Number of Positions: 8
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.039" (1.00mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Part Status: Active
Insulation Height: 0.084" (2.14mm)
Row Spacing - Mating: 0.039" (1.00mm)
Number of Rows: 2
Description: CONN RCPT 8POS 0.039 GOLD SMD
Packaging: Tape & Reel (TR)
Connector Type: Receptacle
Current Rating (Amps): 2.8A per Contact
Mounting Type: Surface Mount
Number of Positions: 8
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.039" (1.00mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Part Status: Active
Insulation Height: 0.084" (2.14mm)
Row Spacing - Mating: 0.039" (1.00mm)
Number of Rows: 2
Produkt ist nicht verfügbar
| CLM-104-02-G-D-TR |
|
Hersteller: Samtec
Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket, 1.00mm Pitch
Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket, 1.00mm Pitch
Produkt ist nicht verfügbar
| CLM-104-02-H-D-TR |
|
Hersteller: Samtec Inc.
Description: CONN RCPT 8POS 0.039 GOLD SMD
Packaging: Tape & Reel (TR)
Connector Type: Receptacle
Current Rating (Amps): 2.8A per Contact
Mounting Type: Surface Mount
Number of Positions: 8
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.039" (1.00mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Post: Gold
Part Status: Active
Insulation Height: 0.084" (2.14mm)
Row Spacing - Mating: 0.039" (1.00mm)
Number of Rows: 2
Description: CONN RCPT 8POS 0.039 GOLD SMD
Packaging: Tape & Reel (TR)
Connector Type: Receptacle
Current Rating (Amps): 2.8A per Contact
Mounting Type: Surface Mount
Number of Positions: 8
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.039" (1.00mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Post: Gold
Part Status: Active
Insulation Height: 0.084" (2.14mm)
Row Spacing - Mating: 0.039" (1.00mm)
Number of Rows: 2
Produkt ist nicht verfügbar
| CLM-104-02-L-D |
|
Hersteller: Samtec
Conn Micro Socket Strip SKT 8 POS 1mm Solder ST Top Entry SMD Bulk
Conn Micro Socket Strip SKT 8 POS 1mm Solder ST Top Entry SMD Bulk
Produkt ist nicht verfügbar
| CLM-104-02-L-D-A |
|
Hersteller: Samtec
Conn Micro Socket Strip SKT 8 POS 1mm Solder ST SMD Bulk
Conn Micro Socket Strip SKT 8 POS 1mm Solder ST SMD Bulk
Produkt ist nicht verfügbar
| CLM-104-02-L-D-A |
|
Hersteller: Samtec
Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket, 1.00mm Pitch
Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket, 1.00mm Pitch
Produkt ist nicht verfügbar
| CLM-104-02-L-D-A-TR |
|
Hersteller: Samtec Inc.
Description: CONN RCPT 8POS 0.039 GOLD SMD
Packaging: Tape & Reel (TR)
Features: Board Guide
Connector Type: Receptacle
Current Rating (Amps): 2.8A per Contact
Mounting Type: Surface Mount
Number of Positions: 8
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.039" (1.00mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Post: Tin
Part Status: Active
Insulation Height: 0.084" (2.14mm)
Row Spacing - Mating: 0.039" (1.00mm)
Number of Rows: 2
Description: CONN RCPT 8POS 0.039 GOLD SMD
Packaging: Tape & Reel (TR)
Features: Board Guide
Connector Type: Receptacle
Current Rating (Amps): 2.8A per Contact
Mounting Type: Surface Mount
Number of Positions: 8
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.039" (1.00mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Post: Tin
Part Status: Active
Insulation Height: 0.084" (2.14mm)
Row Spacing - Mating: 0.039" (1.00mm)
Number of Rows: 2
Produkt ist nicht verfügbar
| CLM-104-02-L-D-A-TR |
|
Hersteller: Samtec
Conn Socket Strip SKT 8 POS 1mm Solder ST SMD T/R
Conn Socket Strip SKT 8 POS 1mm Solder ST SMD T/R
Produkt ist nicht verfügbar
| CLM-104-02-L-D-A-TR |
|
Hersteller: Samtec
Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket, 1.00mm Pitch
Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket, 1.00mm Pitch
Produkt ist nicht verfügbar
| CLM-104-02-L-D-BE |
|
Hersteller: Samtec
Conn Micro Socket Strip SKT 8 POS 1mm Solder ST SMD Bulk
Conn Micro Socket Strip SKT 8 POS 1mm Solder ST SMD Bulk
Produkt ist nicht verfügbar
| CLM-104-02-L-D-BE |
|
Hersteller: Samtec
Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket, 1.00mm Pitch
Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket, 1.00mm Pitch
Produkt ist nicht verfügbar
| CLM-104-02-L-D-BE-A |
|
Hersteller: Samtec
Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket, 1.00mm Pitch
Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket, 1.00mm Pitch
Produkt ist nicht verfügbar
| CLM-104-02-L-D-BE-K-TR |
|
Hersteller: Samtec Inc.
Description: LOW PROFILE DUAL-WIPE SOCKET, 1.
Features: Pick and Place
Packaging: Tape & Reel (TR)
Connector Type: Receptacle, Bottom Entry
Current Rating (Amps): 2.8A per Contact
Mounting Type: Surface Mount
Number of Positions: 8
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.039" (1.00mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Post: Tin
Insulation Height: 0.084" (2.14mm)
Row Spacing - Mating: 0.039" (1.00mm)
Number of Rows: 2
Description: LOW PROFILE DUAL-WIPE SOCKET, 1.
Features: Pick and Place
Packaging: Tape & Reel (TR)
Connector Type: Receptacle, Bottom Entry
Current Rating (Amps): 2.8A per Contact
Mounting Type: Surface Mount
Number of Positions: 8
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.039" (1.00mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Post: Tin
Insulation Height: 0.084" (2.14mm)
Row Spacing - Mating: 0.039" (1.00mm)
Number of Rows: 2
Produkt ist nicht verfügbar
| CLM-104-02-L-D-BE-K-TR |
|
Hersteller: Samtec
Low Profile Dual-Wipe Socket, 1.00mm Pitch
Low Profile Dual-Wipe Socket, 1.00mm Pitch
Produkt ist nicht verfügbar
| CLM-104-02-L-D-BE-K-TR |
|
Hersteller: Samtec
Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket, 1.00mm Pitch
Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket, 1.00mm Pitch
Produkt ist nicht verfügbar
| CLM-104-02-L-D-BE-PA |
|
Hersteller: Samtec
Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket, 1.00mm Pitch
Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket, 1.00mm Pitch
Produkt ist nicht verfügbar