Produkte > SILICON LABS > Alle Produkte des Herstellers SILICON LABS (42684) > Seite 352 nach 712
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RS9116W-DB00-CC0-B2B | Silicon Labs |
Description: RF TXRX MOD BLUETOOTH WIFISMDPackaging: Tray Package / Case: 173-LFLGA Module Sensitivity: -104dBm Mounting Type: Surface Mount Frequency: 2.4GHz, 5GHz Memory Size: 4MB Flash, 512kB ROM, 384kB SRAM Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 3V ~ 3.63V Power - Output: 18dBm Data Rate: 54Mbps Protocol: 802.11a/b/g/n, Bluetooth v5.0, GLONASS, GPS, GSM, LTE, WCDMA Current - Receiving: 10.2mA ~ 135mA Current - Transmitting: 8.9mA ~ 313mA Antenna Type: Antenna Not Included Utilized IC / Part: RS9116 Modulation: CCK, DSSS, OFDM RF Family/Standard: Bluetooth, WiFi Serial Interfaces: I2C, I2S, PCM, SDIO, SPI, UART, USB |
Produkt ist nicht verfügbar |
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RS9116W-DB00-CC0-B2A | Silicon Labs |
Description: RF TXRX MOD BLUETOOTH WIFISMDPackaging: Tray Package / Case: 173-LFLGA Module Sensitivity: -104dBm Mounting Type: Surface Mount Frequency: 2.4GHz, 5GHz Memory Size: 4MB Flash, 512kB ROM, 384kB SRAM Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 3V ~ 3.63V Power - Output: 18dBm Data Rate: 54Mbps Protocol: 802.11a/b/g/n, Bluetooth v5.0, GLONASS, GPS, GSM, LTE, WCDMA Current - Receiving: 10.2mA ~ 135mA Current - Transmitting: 8.9mA ~ 313mA Antenna Type: Antenna Not Included Utilized IC / Part: RS9116 Modulation: CCK, DSSS, OFDM RF Family/Standard: Bluetooth, WiFi Serial Interfaces: I2C, I2S, PCM, SDIO, SPI, UART, USB |
Produkt ist nicht verfügbar |
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Si7201-B-83-IV | Silicon Labs |
Description: MAGNETIC SWITCH OMNIPOL SOT23-3Packaging: Strip Package / Case: TO-236-3, SC-59, SOT-23-3 Output Type: Push-Pull Polarization: North Pole, South Pole Mounting Type: Surface Mount Function: Omnipolar Switch Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 1.71V ~ 5.5V Technology: Hall Effect Sensing Range: ±3.7mT Trip, ±1.4mT Release Current - Supply (Max): 56.7µA (Typ) Supplier Device Package: SOT-23-3 Test Condition: -40°C ~ 125°C |
auf Bestellung 215 Stücke: Lieferzeit 10-14 Tag (e) |
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TS1002IM8T | Silicon Labs |
Description: IC OPAMP GP 2 CIRCUIT 8MSOPPackaging: Tape & Reel (TR) Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) Output Type: Rail-to-Rail Mounting Type: Surface Mount Amplifier Type: General Purpose Operating Temperature: -40°C ~ 85°C Current - Supply: 1.2µA (x2 Channels) Slew Rate: 0.0015V/µs Gain Bandwidth Product: 4 kHz Current - Input Bias: 25 pA Voltage - Input Offset: 500 µV Supplier Device Package: 8-MSOP Number of Circuits: 2 Current - Output / Channel: 1.5 mA Voltage - Supply Span (Min): 0.65 V Voltage - Supply Span (Max): 2.5 V |
Produkt ist nicht verfügbar |
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BGM260PB22VNA2 | Silicon Labs |
Description: MODULE 2.4G 26GPIO Packaging: Strip |
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MGM260PB22VNA5 | Silicon Labs |
Description: MODULE 2.4G 26GPIO Packaging: Strip |
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EFR32BG26B410F3200IM48-B | Silicon Labs |
Description: BG26 3200K FLASH 512K RAM QFN48Packaging: Tape & Reel (TR) Package / Case: 48-QFN Sensitivity: -105.9dBm Mounting Type: Surface Mount Memory Size: 3.125MB Flash, 512kB SRAM Type: TxRx + MCU Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1.71V ~ 3.8V Power - Output: 10dBm Protocol: Bluetooth v5.3 Current - Receiving: 5.4mA Data Rate (Max): 2Mbps Current - Transmitting: 5.9mA ~ 152.7mA Supplier Device Package: 48-QFN (6x6) GPIO: 32 Modulation: 2FSK, 2GFSK, DSSS, GMSK, MSK, O-QPSK RF Family/Standard: 802.15.4, Bluetooth Serial Interfaces: ADC, GPIO, I2C, I2S, IrDA, JTAG, PWM, SPI, UART, USART |
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EFM32PG26B500F3200IM68-B | Silicon Labs |
Description: PG26 3200K FLASH 512K RAM QFN68Packaging: Tray Package / Case: 68-VFQFN Exposed Pad Mounting Type: Surface Mount Speed: 80MHz Program Memory Size: 3.125MB (3.125M x 8) RAM Size: 512K x 8 Operating Temperature: -40°C ~ 125°C Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M33F Data Converters: A/D 4x16b; D/A 2x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.8V Connectivity: I2C, IrDA, SmartCard, SPI, UART/USART Peripherals: Crypto - AES, DMA, I2S, Keypad, LCD, POR. PWM, SHA, Temp Sensor, TRNG, WDT Supplier Device Package: 68-QFN (8x8) Number of I/O: 48 |
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EFM32PG26B500F3200IL136-B | Silicon Labs |
Description: PG26 3200K FLASH 512K RAM BGA136Packaging: Tray Package / Case: 136-VFBGA Mounting Type: Surface Mount Speed: 80MHz Program Memory Size: 3.125MB (3.125M x 8) RAM Size: 512K x 8 Operating Temperature: -40°C ~ 125°C Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M33F Data Converters: A/D 4x16b; D/A 2x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.8V Connectivity: I2C, IrDA, SmartCard, SPI, UART/USART Peripherals: Crypto - AES, DMA, I2S, Keypad, LCD, POR. PWM, SHA, Temp Sensor, TRNG, WDT Supplier Device Package: 136-BGA (7x7) Number of I/O: 64 |
auf Bestellung 434 Stücke: Lieferzeit 10-14 Tag (e) |
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EFR32BG26B510F3200IM48-B | Silicon Labs |
Description: BG26 3200K FLASH 512K RAM QFN48Packaging: Tape & Reel (TR) Package / Case: 48-QFN Sensitivity: -105.9dBm Mounting Type: Surface Mount Memory Size: 3.125MB Flash, 512kB RAM Type: TxRx + MCU Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1.71V ~ 3.8V Power - Output: 10dBm Protocol: Bluetooth v5.3 Current - Receiving: 5.4mA Data Rate (Max): 2Mbps Current - Transmitting: 5.9mA ~ 152.7mA Supplier Device Package: 48-QFN (6x6) GPIO: 28 Modulation: 2FSK, 2GFSK, DSSS, GMSK, MSK, O-QPSK RF Family/Standard: 802.15.4, Bluetooth Serial Interfaces: ADC, GPIO, I2C, I2S, IrDA, JTAG, PWM, SPI, UART, USART |
auf Bestellung 490 Stücke: Lieferzeit 10-14 Tag (e) |
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EFR32BG26B420F3200IM48-B | Silicon Labs |
Description: BG26 3200K FLASH 512K RAM QFN48Packaging: Tray Package / Case: 48-QFN Sensitivity: -105.9dBm Mounting Type: Surface Mount Memory Size: 3.125MB Flash, 512kB SRAM Type: TxRx + MCU Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1.71V ~ 3.8V Power - Output: 19.5dBm Protocol: Bluetooth v5.3 Current - Receiving: 5.4mA Data Rate (Max): 2Mbps Current - Transmitting: 5.9mA ~ 152.7mA Supplier Device Package: 48-QFN (6x6) GPIO: 32 Modulation: 2FSK, 2GFSK, DSSS, GMSK, MSK, O-QPSK RF Family/Standard: 802.15.4, Bluetooth Serial Interfaces: ADC, GPIO, I2C, I2S, IrDA, JTAG, PWM, SPI, UART, USART |
auf Bestellung 490 Stücke: Lieferzeit 10-14 Tag (e) |
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EFR32BG26B510F3200IM68-B | Silicon Labs |
Description: BG26 3200K FLASH 512K RAM QFN68Packaging: Tray Package / Case: 68-QFN Sensitivity: -105.9dBm Mounting Type: Surface Mount Memory Size: 3.125MB Flash, 512kB RAM Type: TxRx + MCU Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1.71V ~ 3.8V Power - Output: 10dBm Protocol: Bluetooth v5.3 Current - Receiving: 5.4mA Data Rate (Max): 2Mbps Current - Transmitting: 5.9mA ~ 152.7mA Supplier Device Package: 68-QFN (8x8) GPIO: 45 Modulation: 2FSK, 2GFSK, DSSS, GMSK, MSK, O-QPSK RF Family/Standard: 802.15.4, Bluetooth Serial Interfaces: ADC, GPIO, I2C, I2S, IrDA, JTAG, PWM, SPI, UART, USART |
auf Bestellung 220 Stücke: Lieferzeit 10-14 Tag (e) |
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EFR32BG26B510F3200IL136-B | Silicon Labs |
Description: BG26 3200K FLASH 512K RAM BGA136Packaging: Tray Package / Case: 136-BGA Sensitivity: -105.9dBm Mounting Type: Surface Mount Memory Size: 3.125MB Flash, 512kB RAM Type: TxRx + MCU Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1.71V ~ 3.8V Power - Output: 10dBm Protocol: Bluetooth v5.3 Current - Receiving: 5.4mA Data Rate (Max): 2Mbps Current - Transmitting: 5.9mA ~ 152.7mA Supplier Device Package: 136-BGA (7x7) GPIO: 64 Modulation: 2FSK, 2GFSK, DSSS, GMSK, MSK, O-QPSK RF Family/Standard: 802.15.4, Bluetooth Serial Interfaces: ADC, GPIO, I2C, I2S, IrDA, JTAG, PWM, SPI, UART, USART |
auf Bestellung 453 Stücke: Lieferzeit 10-14 Tag (e) |
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EFR32MG26B410F3200IM48-B | Silicon Labs |
Description: MG26 3200K FLASH 512K RAM QFN48Packaging: Tray Package / Case: 48-QFN Sensitivity: -105.9dBm Mounting Type: Surface Mount Memory Size: 3.125MB Flash, 512kB RAM Type: TxRx + MCU Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1.71V ~ 3.8V Power - Output: 10dBm Protocol: Bluetooth v5.3, Zigbee® Current - Receiving: 5.4mA ~ 6.2mA Data Rate (Max): 2Mbps Current - Transmitting: 5.9mA ~ 152.7mA Supplier Device Package: 48-QFN (6x6) GPIO: 32 Modulation: 2FSK, 2GFSK, DSSS, GMSK, MSK, O-QPSK RF Family/Standard: 802.15.4, Bluetooth Serial Interfaces: ADC, GPIO, I2C, I2S, IrDA, JTAG, PWM, SPI, UART, USART |
auf Bestellung 486 Stücke: Lieferzeit 10-14 Tag (e) |
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EFR32MG26B410F3200IM68-B | Silicon Labs |
Description: MG26 3200K FLASH 512K RAM QFN68Packaging: Tray Package / Case: 68-VFQFN Exposed Pad Sensitivity: -105.9dBm Mounting Type: Surface Mount Memory Size: 3.125MB Flash, 512kB RAM Type: TxRx + MCU Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1.71V ~ 3.8V Power - Output: 10dBm Protocol: Bluetooth v5.3, Zigbee® Current - Receiving: 5.4mA ~ 6.2mA Data Rate (Max): 2Mbps Current - Transmitting: 5.9mA ~ 152.7mA Supplier Device Package: 68-QFN (8x8) GPIO: 49 Modulation: 2FSK, 2GFSK, DSSS, GMSK, MSK, O-QPSK RF Family/Standard: 802.15.4, Bluetooth Serial Interfaces: ADC, GPIO, I2C, I2S, IrDA, JTAG, PWM, SPI, UART, USART |
auf Bestellung 520 Stücke: Lieferzeit 10-14 Tag (e) |
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EFR32MG26B510F3200IM48-B | Silicon Labs |
Description: MG26 3200K FLASH 512K RAM QFN48Packaging: Tray Package / Case: 48-VFQFN Exposed Pad Sensitivity: -105.9dBm Mounting Type: Surface Mount Memory Size: 3.125MB Flash, 512kB RAM Type: TxRx + MCU Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1.71V ~ 3.8V Power - Output: 10dBm Protocol: Bluetooth v5.3, Zigbee® Current - Receiving: 5.4mA ~ 6.2mA Data Rate (Max): 2Mbps Current - Transmitting: 5.9mA ~ 152.7mA Supplier Device Package: 48-QFN (6x6) GPIO: 28 Modulation: 2FSK, 2GFSK, DSSS, GMSK, MSK, O-QPSK RF Family/Standard: 802.15.4, Bluetooth Serial Interfaces: ADC, GPIO, I2C, I2S, IrDA, JTAG, PWM, SPI, UART, USART |
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EFR32MG26B420F3200IM48-B | Silicon Labs |
Description: MG26 3200K FLASH 512K RAM QFN48Packaging: Tray Package / Case: 48-QFN Sensitivity: -105.9dBm Mounting Type: Surface Mount Memory Size: 3.125MB Flash, 512kB RAM Type: TxRx + MCU Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1.71V ~ 3.8V Power - Output: 19.5dBm Protocol: Bluetooth v5.3, Zigbee® Current - Receiving: 5.4mA ~ 6.2mA Data Rate (Max): 2Mbps Current - Transmitting: 5.9mA ~ 152.7mA Supplier Device Package: 48-QFN (6x6) GPIO: 32 Modulation: 2FSK, 2GFSK, DSSS, GMSK, MSK, O-QPSK RF Family/Standard: 802.15.4, Bluetooth Serial Interfaces: ADC, GPIO, I2C, I2S, IrDA, JTAG, PWM, SPI, UART, USART |
auf Bestellung 490 Stücke: Lieferzeit 10-14 Tag (e) |
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EFR32MG26B510F3200IM68-B | Silicon Labs |
Description: MG26 3200K FLASH 512K RAM QFN68Packaging: Tray Package / Case: 68-QFN Sensitivity: -105.9dBm Mounting Type: Surface Mount Memory Size: 3.125MB Flash, 512kB RAM Type: TxRx + MCU Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1.71V ~ 3.8V Power - Output: 10dBm Protocol: Bluetooth v5.3, Zigbee® Current - Receiving: 5.4mA ~ 6.2mA Data Rate (Max): 2Mbps Current - Transmitting: 5.9mA ~ 152.7mA Supplier Device Package: 68-QFN (8x8) GPIO: 45 Modulation: 2FSK, 2GFSK, DSSS, GMSK, MSK, O-QPSK RF Family/Standard: 802.15.4, Bluetooth Serial Interfaces: ADC, GPIO, I2C, I2S, IrDA, JTAG, PWM, SPI, UART, USART |
auf Bestellung 520 Stücke: Lieferzeit 10-14 Tag (e) |
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EFR32MG26B420F3200IM68-B | Silicon Labs |
Description: MG26 3200K FLASH 512K RAM QFN68Packaging: Tray Package / Case: 68-VFQFN Exposed Pad Sensitivity: -105.9dBm Mounting Type: Surface Mount Memory Size: 3.125MB Flash, 512kB RAM Type: TxRx + MCU Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1.71V ~ 3.8V Power - Output: 19.5dBm Protocol: Bluetooth v5.3, Zigbee® Current - Receiving: 5.4mA ~ 6.2mA Data Rate (Max): 2Mbps Current - Transmitting: 5.9mA ~ 152.7mA Supplier Device Package: 68-QFN (8x8) GPIO: 49 Modulation: 2FSK, 2GFSK, DSSS, GMSK, MSK, O-QPSK RF Family/Standard: 802.15.4, Bluetooth Serial Interfaces: ADC, GPIO, I2C, I2S, IrDA, JTAG, PWM, SPI, UART, USART |
auf Bestellung 481 Stücke: Lieferzeit 10-14 Tag (e) |
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EFR32MG26B510F3200IL136-B | Silicon Labs |
Description: MG26 3200K FLASH 512K RAM BGA136Packaging: Tray Package / Case: 136-VFBGA Sensitivity: -105.9dBm Mounting Type: Surface Mount Memory Size: 3.125MB Flash, 512kB RAM Type: TxRx + MCU Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1.71V ~ 3.8V Power - Output: 10dBm Protocol: Bluetooth v5.3, Zigbee® Current - Receiving: 5.4mA ~ 6.2mA Data Rate (Max): 2Mbps Current - Transmitting: 5.9mA ~ 152.7mA Supplier Device Package: 136-BGA (7x7) GPIO: 64 Modulation: 2FSK, 2GFSK, DSSS, GMSK, MSK, O-QPSK RF Family/Standard: 802.15.4, Bluetooth Serial Interfaces: ADC, GPIO, I2C, I2S, IrDA, JTAG, PWM, SPI, UART, USART |
auf Bestellung 1303 Stücke: Lieferzeit 10-14 Tag (e) |
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EFR32MG26B520F3200IM48-B | Silicon Labs |
Description: MG26 3200K FLASH 512K RAM QFN48Packaging: Tray Package / Case: 48-VFQFN Exposed Pad Sensitivity: -105.9dBm Mounting Type: Surface Mount Memory Size: 3.125MB Flash, 512kB RAM Type: TxRx + MCU Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1.71V ~ 3.8V Power - Output: 19.5dBm Protocol: Bluetooth v5.3, Zigbee® Current - Receiving: 5.4mA ~ 6.2mA Data Rate (Max): 2Mbps Current - Transmitting: 5.9mA ~ 152.7mA Supplier Device Package: 48-QFN (6x6) GPIO: 28 Modulation: 2FSK, 2GFSK, DSSS, GMSK, MSK, O-QPSK RF Family/Standard: 802.15.4, Bluetooth Serial Interfaces: ADC, GPIO, I2C, I2S, IrDA, JTAG, PWM, SPI, UART, USART |
auf Bestellung 465 Stücke: Lieferzeit 10-14 Tag (e) |
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EFR32MG26B520F3200IM68-B | Silicon Labs |
Description: MG26 3200K FLASH 512K RAM QFN68Packaging: Tape & Reel (TR) Package / Case: 68-QFN Sensitivity: -105.9dBm Mounting Type: Surface Mount Memory Size: 3.125MB Flash, 512kB RAM Type: TxRx + MCU Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1.71V ~ 3.8V Power - Output: 19.5dBm Protocol: Bluetooth v5.3, Zigbee® Current - Receiving: 5.4mA ~ 6.2mA Data Rate (Max): 2Mbps Current - Transmitting: 5.9mA ~ 152.7mA Supplier Device Package: 68-QFN (8x8) GPIO: 45 Modulation: 2FSK, 2GFSK, DSSS, GMSK, MSK, O-QPSK RF Family/Standard: 802.15.4, Bluetooth Serial Interfaces: ADC, GPIO, I2C, I2S, IrDA, JTAG, PWM, SPI, UART, USART |
auf Bestellung 520 Stücke: Lieferzeit 10-14 Tag (e) |
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XG26-DK2608A | Silicon Labs |
Description: XG26 + 10 DBM DEV KIT Packaging: Box Frequency: 2.4GHz Type: Transceiver; Bluetooth® 5.x (BLE) Contents: Board(s) Utilized IC / Part: EFR32MG26 |
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| EFR32BG27C320F768GJ39-B | Silicon Labs |
Description: IC RF TXRX+MCU 802.15.4 39WLCSPPackaging: Strip Package / Case: 39-UFBGA, WLCSP Sensitivity: -106.7dBm Mounting Type: Surface Mount Frequency: 2.4GHz Memory Size: 768kB Flash, 64kB RAM Type: TxRx + MCU Operating Temperature: -40°C ~ 85°C Voltage - Supply: 0.8V ~ 1.7V, 1.8V ~ 3.8V Power - Output: 4dBm Protocol: Bluetooth v5.0, Zigbee® Current - Receiving: 3.6mA Data Rate (Max): 2Mbps Current - Transmitting: 4.1mA ~ 11.3mA Supplier Device Package: 39-WLCSP (2.63x2.29) GPIO: 19 Modulation: DSSS, GFSK, GMSK, OOK, O-QPSK RF Family/Standard: 802.15.4, Bluetooth Serial Interfaces: GPIO, I2C, I2S, IrDA, JTAG, PWM, SPI, UART, USART |
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EFR32BG27C140F768IM32-BR | Silicon Labs |
Description: IC RF TXRX+MCU 802.15.4 32QFNPackaging: Tape & Reel (TR) Package / Case: 32-VFQFN Exposed Pad Sensitivity: -106.7dBm Mounting Type: Surface Mount Frequency: 2.4GHz Memory Size: 768kB Flash, 64kB RAM Type: TxRx + MCU Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1.8V ~ 3.8V Power - Output: 8dBm Protocol: Bluetooth v5.0, Zigbee® Current - Receiving: 3.6mA Data Rate (Max): 2Mbps Current - Transmitting: 4.1mA ~ 11.3mA Supplier Device Package: 32-QFN (4x4) GPIO: 18 Modulation: DSSS, GFSK, GMSK, OOK, O-QPSK RF Family/Standard: 802.15.4, Bluetooth Serial Interfaces: GPIO, I2C, I2S, IrDA, JTAG, PWM, SPI, UART, USART |
Produkt ist nicht verfügbar |
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EFR32BG27C230F768IM32-BR | Silicon Labs |
Description: IC RF TXRX+MCU 802.15.4 32QFNPackaging: Tape & Reel (TR) Package / Case: 32-VFQFN Exposed Pad Sensitivity: -106.7dBm Mounting Type: Surface Mount Frequency: 2.4GHz Memory Size: 768kB Flash, 64kB RAM Type: TxRx + MCU Operating Temperature: -40°C ~ 125°C Voltage - Supply: 0.8V ~ 1.7V Power - Output: 6dBm Protocol: Bluetooth v5.0, Zigbee® Current - Receiving: 3.6mA Data Rate (Max): 2Mbps Current - Transmitting: 4.1mA ~ 11.3mA Supplier Device Package: 32-QFN (4x4) GPIO: 17 Modulation: DSSS, GFSK, GMSK, OOK, O-QPSK RF Family/Standard: 802.15.4, Bluetooth Serial Interfaces: GPIO, I2C, I2S, IrDA, JTAG, PWM, SPI, UART, USART |
Produkt ist nicht verfügbar |
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EFR32BG27C320F768GJ39-BR | Silicon Labs |
Description: IC RF TXRX+MCU 802.15.4 39WLCSPPackaging: Tape & Reel (TR) Package / Case: 39-UFBGA, WLCSP Sensitivity: -106.7dBm Mounting Type: Surface Mount Frequency: 2.4GHz Memory Size: 768kB Flash, 64kB RAM Type: TxRx + MCU Operating Temperature: -40°C ~ 85°C Voltage - Supply: 0.8V ~ 1.7V, 1.8V ~ 3.8V Power - Output: 4dBm Protocol: Bluetooth v5.0, Zigbee® Current - Receiving: 3.6mA Data Rate (Max): 2Mbps Current - Transmitting: 4.1mA ~ 11.3mA Supplier Device Package: 39-WLCSP (2.63x2.29) GPIO: 19 Modulation: DSSS, GFSK, GMSK, OOK, O-QPSK RF Family/Standard: 802.15.4, Bluetooth Serial Interfaces: GPIO, I2C, I2S, IrDA, JTAG, PWM, SPI, UART, USART |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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EFR32BG27C230F768IM40-BR | Silicon Labs |
Description: IC RF TXRX+MCU 802.15.4 40QFNPackaging: Tape & Reel (TR) Package / Case: 40-VFQFN Exposed Pad Sensitivity: -106.7dBm Mounting Type: Surface Mount Frequency: 2.4GHz Memory Size: 768kB Flash, 64kB RAM Type: TxRx + MCU Operating Temperature: -40°C ~ 125°C Voltage - Supply: 0.8V ~ 1.7V Power - Output: 6dBm Protocol: Bluetooth v5.0, Zigbee® Current - Receiving: 3.6mA Data Rate (Max): 2Mbps Current - Transmitting: 4.1mA ~ 11.3mA Supplier Device Package: 40-QFN (5x5) GPIO: 25 Modulation: DSSS, GFSK, GMSK, OOK, O-QPSK RF Family/Standard: 802.15.4, Bluetooth Serial Interfaces: GPIO, I2C, I2S, IrDA, JTAG, PWM, SPI, UART, USART |
Produkt ist nicht verfügbar |
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EFR32BG27C320F768IJ39-BR | Silicon Labs |
Description: SOC WLCSP39 PACKAGE HIGH TEMPPackaging: Tape & Reel (TR) Package / Case: 39-UFBGA, WLCSP Sensitivity: -106.9dBm Mounting Type: Surface Mount Memory Size: 768kB Flash, 64kB RAM Type: TxRx + MCU Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 1.71V ~ 3.8V Power - Output: 8dBm Protocol: Bluetooth v5.4 Current - Receiving: 3.6mA ~ 4.5mA Data Rate (Max): 2Mbps Current - Transmitting: 4.1mA ~ 24.1mA Supplier Device Package: 39-WLCSP (2.63x2.29) GPIO: 19 Modulation: DSSS, GFSK, GMSK, OOK, O-QPSK RF Family/Standard: 802.15.4, Bluetooth Serial Interfaces: GPIO, I2C, I2S, IrDA, JTAG, PWM, SPI, UART, USART |
Produkt ist nicht verfügbar |
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EFM8BB31F16I-B-QFN24 | Silicon Labs |
Description: IC MCU 8BIT 16KB FLASH 24QFNPackaging: Tube Package / Case: 24-VFQFN Exposed Pad Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 16KB (16K x 8) RAM Size: 2.25K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: CIP-51 8051 Data Converters: A/D 12x10/12b SAR; D/A 2x12b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V Connectivity: I2C, SMBus, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, PWM, WDT Supplier Device Package: 24-QFN (3x3) Number of I/O: 20 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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EFM8BB31F16I-C-4QFN24 | Silicon Labs |
Description: IC MCU 8BIT 16KB FLASH 24QFNPackaging: Tube Package / Case: 24-WFQFN Exposed Pad Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 16KB (16K x 8) RAM Size: 2.25K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: CIP-51 8051 Data Converters: A/D 12x10/12b SAR; D/A 2x12b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V Connectivity: I2C, SMBus, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, PWM, WDT Supplier Device Package: 24-QFN (4x4) Number of I/O: 20 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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EFM8BB31F32A-B-4QFN24R | Silicon Labs |
Description: IC MCU 8BIT 32KB FLASH 24QFNPackaging: Tape & Reel (TR) Package / Case: 24-WFQFN Exposed Pad Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 32KB (32K x 8) RAM Size: 2.25K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: CIP-51 8051 Data Converters: A/D 12x10/12b SAR; D/A 2x12b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V Connectivity: I2C, SMBus, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, PWM, WDT Supplier Device Package: 24-QFN (4x4) Grade: Automotive Number of I/O: 20 DigiKey Programmable: Not Verified Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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EFM8BB31F32A-C-4QFN24R | Silicon Labs |
Description: IC MCU 8BIT 32KB FLASH 24QFNPackaging: Tape & Reel (TR) Package / Case: 24-WFQFN Exposed Pad Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 32KB (32K x 8) RAM Size: 2.25K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: CIP-51 8051 Data Converters: A/D 12x10/12b SAR; D/A 2x12b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V Connectivity: I2C, SMBus, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, PWM, WDT Supplier Device Package: 24-QFN (4x4) Grade: Automotive Number of I/O: 20 DigiKey Programmable: Not Verified Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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EFM8BB31F64I-D-4QFN24 | Silicon Labs |
Description: IC MCU 8BIT 64KB FLASH 24QFN Packaging: Tube Package / Case: 24-WFQFN Exposed Pad Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 64KB (64K x 8) RAM Size: 4.25K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: CIP-51 8051 Data Converters: A/D 12x12b; D/A 2x12b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V Connectivity: I2C, SMBus, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, PWM, WDT Supplier Device Package: 24-QFN (4x4) Number of I/O: 20 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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EFM8BB31F16A-B-4QFN24R | Silicon Labs |
Description: IC MCU 8BIT 16KB FLASH 24QFNPackaging: Tape & Reel (TR) Package / Case: 32-WFQFN Exposed Pad Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 16KB (16K x 8) RAM Size: 2.25K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: CIP-51 8051 Data Converters: A/D 12x10/12b SAR; D/A 2x12b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V Connectivity: I2C, SMBus, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, PWM, WDT Supplier Device Package: 32-QFN (5x5) Grade: Automotive Number of I/O: 20 DigiKey Programmable: Not Verified Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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EFM8BB31F16A-C-4QFN24R | Silicon Labs |
Description: IC MCU 8BIT 16KB FLASH 24QFNPackaging: Tape & Reel (TR) Package / Case: 24-WFQFN Exposed Pad Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 16KB (16K x 8) RAM Size: 2.25K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: CIP-51 8051 Data Converters: A/D 12x10/12b SAR; D/A 2x12b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V Connectivity: I2C, SMBus, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, PWM, WDT Supplier Device Package: 24-QFN (4x4) Grade: Automotive Number of I/O: 20 DigiKey Programmable: Not Verified Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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EFM8BB31F16A-D-4QFN24 | Silicon Labs |
Description: IC MCU 8BIT 16KB FLASH 24QFN Packaging: Tube Package / Case: 24-WFQFN Exposed Pad Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 16KB (16K x 8) RAM Size: 2.25K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: CIP-51 8051 Data Converters: A/D 12x12b; D/A 2x12b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V Connectivity: I2C, SMBus, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, PWM, WDT Supplier Device Package: 24-QFN (4x4) Number of I/O: 20 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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TS12011ITD1022T | Silicon Labs |
Description: IC OPAMP GP 1 CIRCUIT 10TDFNPackaging: Tape & Reel (TR) Package / Case: 10-UFDFN Exposed Pad Output Type: Push-Pull Mounting Type: Surface Mount Amplifier Type: General Purpose Operating Temperature: -40°C ~ 85°C Current - Supply: 1.1µA Slew Rate: 0.006V/µs Gain Bandwidth Product: 15 kHz Current - Input Bias: 20 nA Voltage - Input Offset: 3.5 mV Supplier Device Package: 10-TDFN (2x2) Number of Circuits: 1 Current - Output / Channel: 500 µA Voltage - Supply Span (Min): 0.8 V Voltage - Supply Span (Max): 2.5 V |
Produkt ist nicht verfügbar |
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SIWG917Y121MGNBAR | Silicon Labs |
Description: SIWG917Y SOC MODULE WI-FI 6 2.4Packaging: Cut Tape (CT) Package / Case: 71-SMD Module Sensitivity: -95dBm Mounting Type: Surface Mount Frequency: 2.4GHz Memory Size: 8MB Flash, 2MB PSRAM Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 1.71V ~ 1.98V, 2.97V ~ 3.63V Power - Output: 17.5dBm Data Rate: 54Mbps Protocol: 802.11b/g/n/ax, Bluetooth v5.4 Current - Receiving: 11mA ~ 55mA Current - Transmitting: 11mA ~ 231mA Antenna Type: Antenna Not Included Utilized IC / Part: SiWG917M Modulation: CCK, DSSS, OFDM RF Family/Standard: Bluetooth, WiFi Serial Interfaces: ADC, GPIO, I2C, I2S, ISP, JTAG, PCM, PWM, SDIO, SPI, UART, USART |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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SIWG917Y121MGNBAR | Silicon Labs |
Description: SIWG917Y SOC MODULE WI-FI 6 2.4Packaging: Tape & Box (TB) Package / Case: 71-SMD Module Sensitivity: -95dBm Mounting Type: Surface Mount Frequency: 2.4GHz Memory Size: 8MB Flash, 2MB PSRAM Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 1.71V ~ 1.98V, 2.97V ~ 3.63V Power - Output: 17.5dBm Data Rate: 54Mbps Protocol: 802.11b/g/n/ax, Bluetooth v5.4 Current - Receiving: 11mA ~ 55mA Current - Transmitting: 11mA ~ 231mA Antenna Type: Antenna Not Included Utilized IC / Part: SiWG917M Modulation: CCK, DSSS, OFDM RF Family/Standard: Bluetooth, WiFi Serial Interfaces: ADC, GPIO, I2C, I2S, ISP, JTAG, PCM, PWM, SDIO, SPI, UART, USART |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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SIWG917Y121MGABAR | Silicon Labs |
Description: SIWG917Y SOC MODULE WI-FI 6 2.4Packaging: Cut Tape (CT) Package / Case: 71-SMD Module Sensitivity: -95dBm Mounting Type: Surface Mount Frequency: 2.4GHz Memory Size: 8MB Flash, 2MB PSRAM Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 1.71V ~ 1.98V, 2.97V ~ 3.63V Power - Output: 17.5dBm Data Rate: 54Mbps Protocol: 802.11b/g/n/ax, Bluetooth v5.4 Current - Receiving: 11mA ~ 55mA Current - Transmitting: 11mA ~ 231mA Antenna Type: Integrated, Chip Utilized IC / Part: SiWG917M Modulation: CCK, DSSS, OFDM RF Family/Standard: Bluetooth, WiFi Serial Interfaces: ADC, GPIO, I2C, I2S, ISP, JTAG, PCM, PWM, SDIO, SPI, UART, USART |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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SIWG917Y121MGABAR | Silicon Labs |
Description: SIWG917Y SOC MODULE WI-FI 6 2.4Packaging: Tape & Box (TB) Package / Case: 71-SMD Module Sensitivity: -95dBm Mounting Type: Surface Mount Frequency: 2.4GHz Memory Size: 8MB Flash, 2MB PSRAM Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 1.71V ~ 1.98V, 2.97V ~ 3.63V Power - Output: 17.5dBm Data Rate: 54Mbps Protocol: 802.11b/g/n/ax, Bluetooth v5.4 Current - Receiving: 11mA ~ 55mA Current - Transmitting: 11mA ~ 231mA Antenna Type: Integrated, Chip Utilized IC / Part: SiWG917M Modulation: CCK, DSSS, OFDM RF Family/Standard: Bluetooth, WiFi Serial Interfaces: ADC, GPIO, I2C, I2S, ISP, JTAG, PCM, PWM, SDIO, SPI, UART, USART |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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EFM32PG26B101F512IL136-BR | Silicon Labs |
Description: PG26 512K FLASH 128K RAM BGA136Packaging: Tape & Reel (TR) Package / Case: 136-VFBGA Mounting Type: Surface Mount Speed: 80MHz Program Memory Size: 512KB (512K x 8) RAM Size: 128K x 8 Operating Temperature: -40°C ~ 125°C Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M33F Data Converters: A/D 4x16b; D/A 2x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.8V Connectivity: I2C, IrDA, SmartCard, SPI, UART/USART Peripherals: Crypto - AES, DMA, I2S, Keypad, LCD, POR. PWM, SHA, Temp Sensor, TRNG, WDT Supplier Device Package: 136-BGA (7x7) Number of I/O: 64 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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EFM32PG26B101F512IL136-B | Silicon Labs |
Description: PG26 512K FLASH 128K RAM BGA136Packaging: Tray Package / Case: 136-VFBGA Mounting Type: Surface Mount Speed: 80MHz Program Memory Size: 512KB (512K x 8) RAM Size: 128K x 8 Operating Temperature: -40°C ~ 125°C Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M33F Data Converters: A/D 4x16b; D/A 2x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.8V Connectivity: I2C, IrDA, SmartCard, SPI, UART/USART Peripherals: Crypto - AES, DMA, I2S, Keypad, LCD, POR. PWM, SHA, Temp Sensor, TRNG, WDT Supplier Device Package: 136-BGA (7x7) Number of I/O: 64 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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EFM32PG26B301F1024IL136-BR | Silicon Labs |
Description: PG26 1024K FLASH 256K RAM BGA136Packaging: Tape & Reel (TR) Package / Case: 136-VFBGA Mounting Type: Surface Mount Speed: 80MHz Program Memory Size: 1MB (1M x 8) RAM Size: 256K x 8 Operating Temperature: -40°C ~ 125°C Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M33F Data Converters: A/D 4x16b; D/A 2x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.8V Connectivity: I2C, IrDA, SmartCard, SPI, UART/USART Peripherals: Crypto - AES, DMA, I2S, Keypad, LCD, POR. PWM, SHA, Temp Sensor, TRNG, WDT Supplier Device Package: 136-BGA (7x7) Number of I/O: 64 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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EFM32PG26B301F1024IL136-B | Silicon Labs |
Description: PG26 1024K FLASH 256K RAM BGA136Packaging: Tray Package / Case: 136-VFBGA Mounting Type: Surface Mount Speed: 80MHz Program Memory Size: 1MB (1M x 8) RAM Size: 256K x 8 Operating Temperature: -40°C ~ 125°C Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M33F Data Converters: A/D 4x16b; D/A 2x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.8V Connectivity: I2C, IrDA, SmartCard, SPI, UART/USART Peripherals: Crypto - AES, DMA, I2S, Keypad, LCD, POR. PWM, SHA, Temp Sensor, TRNG, WDT Supplier Device Package: 136-BGA (7x7) Number of I/O: 64 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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EFR32BG26B311F1024IL136-BR | Silicon Labs |
Description: BG26 1024K FLASH 256K RAM BGA136Packaging: Tape & Reel (TR) Package / Case: 136-BGA Sensitivity: -105.9dBm Mounting Type: Surface Mount Memory Size: 1MB Flash, 256kB RAM Type: TxRx + MCU Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1.71V ~ 3.8V Power - Output: 10dBm Protocol: Bluetooth v5.3 Current - Receiving: 5.4mA Data Rate (Max): 2Mbps Current - Transmitting: 5.9mA ~ 152.7mA Supplier Device Package: 136-BGA (7x7) GPIO: 64 Modulation: 2FSK, 2GFSK, DSSS, GMSK, MSK, O-QPSK RF Family/Standard: 802.15.4, Bluetooth Serial Interfaces: ADC, GPIO, I2C, I2S, IrDA, JTAG, PWM, SPI, UART, USART |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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EFR32BG26B311F1024IL136-B | Silicon Labs |
Description: BG26 1024K FLASH 256K RAM BGA136Packaging: Tray Package / Case: 136-BGA Sensitivity: -105.9dBm Mounting Type: Surface Mount Memory Size: 1MB Flash, 256kB RAM Type: TxRx + MCU Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1.71V ~ 3.8V Power - Output: 10dBm Protocol: Bluetooth v5.3 Current - Receiving: 5.4mA Data Rate (Max): 2Mbps Current - Transmitting: 5.9mA ~ 152.7mA Supplier Device Package: 136-BGA (7x7) GPIO: 64 Modulation: 2FSK, 2GFSK, DSSS, GMSK, MSK, O-QPSK RF Family/Standard: 802.15.4, Bluetooth Serial Interfaces: ADC, GPIO, I2C, I2S, IrDA, JTAG, PWM, SPI, UART, USART |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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EFM32PG26B301F2048IL136-BR | Silicon Labs |
Description: PG26 2048K FLASH 256K RAM BGA136Packaging: Tape & Reel (TR) Package / Case: 136-VFBGA Mounting Type: Surface Mount Speed: 80MHz Program Memory Size: 2MB (2M x 8) RAM Size: 256K x 8 Operating Temperature: -40°C ~ 125°C Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M33F Data Converters: A/D 4x16b; D/A 2x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.8V Connectivity: I2C, IrDA, SmartCard, SPI, UART/USART Peripherals: Crypto - AES, DMA, I2S, Keypad, LCD, POR. PWM, SHA, Temp Sensor, TRNG, WDT Supplier Device Package: 136-BGA (7x7) Number of I/O: 64 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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EFM32PG26B301F2048IL136-B | Silicon Labs |
Description: PG26 2048K FLASH 256K RAM BGA136Packaging: Tray Package / Case: 136-VFBGA Mounting Type: Surface Mount Speed: 80MHz Program Memory Size: 2MB (2M x 8) RAM Size: 256K x 8 Operating Temperature: -40°C ~ 125°C Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M33F Data Converters: A/D 4x16b; D/A 2x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.8V Connectivity: I2C, IrDA, SmartCard, SPI, UART/USART Peripherals: Crypto - AES, DMA, I2S, Keypad, LCD, POR. PWM, SHA, Temp Sensor, TRNG, WDT Supplier Device Package: 136-BGA (7x7) Number of I/O: 64 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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EFR32BG26B311F2048IL136-BR | Silicon Labs |
Description: BG26 2048K FLASH 256K RAM BGA136Packaging: Tape & Reel (TR) Package / Case: 136-BGA Sensitivity: -105.9dBm Mounting Type: Surface Mount Memory Size: 2MB Flash, 256kB RAM Type: TxRx + MCU Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1.71V ~ 3.8V Power - Output: 10dBm Protocol: Bluetooth v5.3 Current - Receiving: 5.4mA Data Rate (Max): 2Mbps Current - Transmitting: 5.9mA ~ 152.7mA Supplier Device Package: 136-BGA (7x7) GPIO: 64 Modulation: 2FSK, 2GFSK, DSSS, GMSK, MSK, O-QPSK RF Family/Standard: 802.15.4, Bluetooth Serial Interfaces: ADC, GPIO, I2C, I2S, IrDA, JTAG, PWM, SPI, UART, USART |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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EFR32BG26B311F2048IL136-B | Silicon Labs |
Description: BG26 2048K FLASH 256K RAM BGA136Packaging: Tray Package / Case: 136-BGA Sensitivity: -105.9dBm Mounting Type: Surface Mount Memory Size: 2MB Flash, 256kB RAM Type: TxRx + MCU Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1.71V ~ 3.8V Power - Output: 10dBm Protocol: Bluetooth v5.3 Current - Receiving: 5.4mA Data Rate (Max): 2Mbps Current - Transmitting: 5.9mA ~ 152.7mA Supplier Device Package: 136-BGA (7x7) GPIO: 64 Modulation: 2FSK, 2GFSK, DSSS, GMSK, MSK, O-QPSK RF Family/Standard: 802.15.4, Bluetooth Serial Interfaces: ADC, GPIO, I2C, I2S, IrDA, JTAG, PWM, SPI, UART, USART |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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EFM32PG26B501F3200IL136-BR | Silicon Labs |
Description: PG26 3200K FLASH 512K RAM BGA136Packaging: Tape & Reel (TR) Package / Case: 136-VFBGA Mounting Type: Surface Mount Speed: 80MHz Program Memory Size: 3.125MB (3.125M x 8) RAM Size: 512K x 8 Operating Temperature: -40°C ~ 125°C Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M33F Data Converters: A/D 4x16b; D/A 2x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.8V Connectivity: I2C, IrDA, SmartCard, SPI, UART/USART Peripherals: Crypto - AES, DMA, I2S, Keypad, LCD, POR. PWM, SHA, Temp Sensor, TRNG, WDT Supplier Device Package: 136-BGA (7x7) Number of I/O: 64 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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EFM32PG26B501F3200IL136-B | Silicon Labs |
Description: PG26 3200K FLASH 512K RAM BGA136Packaging: Tray Package / Case: 136-VFBGA Mounting Type: Surface Mount Speed: 80MHz Program Memory Size: 3.125MB (3.125M x 8) RAM Size: 512K x 8 Operating Temperature: -40°C ~ 125°C Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M33F Data Converters: A/D 4x16b; D/A 2x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.8V Connectivity: I2C, IrDA, SmartCard, SPI, UART/USART Peripherals: Crypto - AES, DMA, I2S, Keypad, LCD, POR. PWM, SHA, Temp Sensor, TRNG, WDT Supplier Device Package: 136-BGA (7x7) Number of I/O: 64 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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EFR32MG26B311F3200IL136-BR | Silicon Labs |
Description: MG26 3200K FLASH 256K RAM BGA136Packaging: Tape & Reel (TR) Package / Case: 136-VFBGA Sensitivity: -105.9dBm Mounting Type: Surface Mount Memory Size: 3.125MB Flash, 256kB RAM Type: TxRx + MCU Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1.71V ~ 3.8V Power - Output: 10dBm Protocol: Bluetooth v5.3, Zigbee® Current - Receiving: 5.4mA ~ 6.2mA Data Rate (Max): 2Mbps Current - Transmitting: 5.9mA ~ 152.7mA Supplier Device Package: 136-BGA (7x7) GPIO: 64 Modulation: 2FSK, 2GFSK, DSSS, GMSK, MSK, O-QPSK RF Family/Standard: 802.15.4, Bluetooth Serial Interfaces: ADC, GPIO, I2C, I2S, IrDA, JTAG, PWM, SPI, UART, USART |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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EFR32BG26B511F3200IL136-BR | Silicon Labs |
Description: BG26 3200K FLASH 512K RAM BGA136Packaging: Tape & Reel (TR) Package / Case: 136-BGA Sensitivity: -105.9dBm Mounting Type: Surface Mount Memory Size: 3.125MB Flash, 512kB RAM Type: TxRx + MCU Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1.71V ~ 3.8V Power - Output: 10dBm Protocol: Bluetooth v5.3 Current - Receiving: 5.4mA Data Rate (Max): 2Mbps Current - Transmitting: 5.9mA ~ 152.7mA Supplier Device Package: 136-BGA (7x7) GPIO: 64 Modulation: 2FSK, 2GFSK, DSSS, GMSK, MSK, O-QPSK RF Family/Standard: 802.15.4, Bluetooth Serial Interfaces: ADC, GPIO, I2C, I2S, IrDA, JTAG, PWM, SPI, UART, USART |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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EFM32PG26B500F3200IL136-BR | Silicon Labs |
Description: PG26 3200K FLASH 512K RAM BGA136Packaging: Tape & Reel (TR) Package / Case: 136-VFBGA Mounting Type: Surface Mount Speed: 80MHz Program Memory Size: 3.125MB (3.125M x 8) RAM Size: 512K x 8 Operating Temperature: -40°C ~ 125°C Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M33F Data Converters: A/D 4x16b; D/A 2x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.8V Connectivity: I2C, IrDA, SmartCard, SPI, UART/USART Peripherals: Crypto - AES, DMA, I2S, Keypad, LCD, POR. PWM, SHA, Temp Sensor, TRNG, WDT Supplier Device Package: 136-BGA (7x7) Number of I/O: 64 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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EFR32BG26B511F3200IL136-B | Silicon Labs |
Description: BG26 3200K FLASH 512K RAM BGA136Packaging: Tray Package / Case: 136-BGA Sensitivity: -105.9dBm Mounting Type: Surface Mount Memory Size: 3.125MB Flash, 512kB RAM Type: TxRx + MCU Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1.71V ~ 3.8V Power - Output: 10dBm Protocol: Bluetooth v5.3 Current - Receiving: 5.4mA Data Rate (Max): 2Mbps Current - Transmitting: 5.9mA ~ 152.7mA Supplier Device Package: 136-BGA (7x7) GPIO: 64 Modulation: 2FSK, 2GFSK, DSSS, GMSK, MSK, O-QPSK RF Family/Standard: 802.15.4, Bluetooth Serial Interfaces: ADC, GPIO, I2C, I2S, IrDA, JTAG, PWM, SPI, UART, USART |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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EFR32MG26B311F3200IL136-B | Silicon Labs |
Description: MG26 3200K FLASH 256K RAM BGA136Packaging: Tray Package / Case: 136-VFBGA Sensitivity: -105.9dBm Mounting Type: Surface Mount Memory Size: 3.125MB Flash, 256kB RAM Type: TxRx + MCU Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1.71V ~ 3.8V Power - Output: 10dBm Protocol: Bluetooth v5.3, Zigbee® Current - Receiving: 5.4mA ~ 6.2mA Data Rate (Max): 2Mbps Current - Transmitting: 5.9mA ~ 152.7mA Supplier Device Package: 136-BGA (7x7) GPIO: 64 Modulation: 2FSK, 2GFSK, DSSS, GMSK, MSK, O-QPSK RF Family/Standard: 802.15.4, Bluetooth Serial Interfaces: ADC, GPIO, I2C, I2S, IrDA, JTAG, PWM, SPI, UART, USART |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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EFR32BG26B510F3200IL136-BR | Silicon Labs |
Description: BG26 3200K FLASH 512K RAM BGA136Packaging: Tape & Reel (TR) Package / Case: 136-BGA Sensitivity: -105.9dBm Mounting Type: Surface Mount Memory Size: 3.125MB Flash, 512kB RAM Type: TxRx + MCU Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1.71V ~ 3.8V Power - Output: 10dBm Protocol: Bluetooth v5.3 Current - Receiving: 5.4mA Data Rate (Max): 2Mbps Current - Transmitting: 5.9mA ~ 152.7mA Supplier Device Package: 136-BGA (7x7) GPIO: 64 Modulation: 2FSK, 2GFSK, DSSS, GMSK, MSK, O-QPSK RF Family/Standard: 802.15.4, Bluetooth Serial Interfaces: ADC, GPIO, I2C, I2S, IrDA, JTAG, PWM, SPI, UART, USART |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
| RS9116W-DB00-CC0-B2B |
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Hersteller: Silicon Labs
Description: RF TXRX MOD BLUETOOTH WIFISMD
Packaging: Tray
Package / Case: 173-LFLGA Module
Sensitivity: -104dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz, 5GHz
Memory Size: 4MB Flash, 512kB ROM, 384kB SRAM
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 3V ~ 3.63V
Power - Output: 18dBm
Data Rate: 54Mbps
Protocol: 802.11a/b/g/n, Bluetooth v5.0, GLONASS, GPS, GSM, LTE, WCDMA
Current - Receiving: 10.2mA ~ 135mA
Current - Transmitting: 8.9mA ~ 313mA
Antenna Type: Antenna Not Included
Utilized IC / Part: RS9116
Modulation: CCK, DSSS, OFDM
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: I2C, I2S, PCM, SDIO, SPI, UART, USB
Description: RF TXRX MOD BLUETOOTH WIFISMD
Packaging: Tray
Package / Case: 173-LFLGA Module
Sensitivity: -104dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz, 5GHz
Memory Size: 4MB Flash, 512kB ROM, 384kB SRAM
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 3V ~ 3.63V
Power - Output: 18dBm
Data Rate: 54Mbps
Protocol: 802.11a/b/g/n, Bluetooth v5.0, GLONASS, GPS, GSM, LTE, WCDMA
Current - Receiving: 10.2mA ~ 135mA
Current - Transmitting: 8.9mA ~ 313mA
Antenna Type: Antenna Not Included
Utilized IC / Part: RS9116
Modulation: CCK, DSSS, OFDM
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: I2C, I2S, PCM, SDIO, SPI, UART, USB
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| RS9116W-DB00-CC0-B2A |
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Hersteller: Silicon Labs
Description: RF TXRX MOD BLUETOOTH WIFISMD
Packaging: Tray
Package / Case: 173-LFLGA Module
Sensitivity: -104dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz, 5GHz
Memory Size: 4MB Flash, 512kB ROM, 384kB SRAM
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 3V ~ 3.63V
Power - Output: 18dBm
Data Rate: 54Mbps
Protocol: 802.11a/b/g/n, Bluetooth v5.0, GLONASS, GPS, GSM, LTE, WCDMA
Current - Receiving: 10.2mA ~ 135mA
Current - Transmitting: 8.9mA ~ 313mA
Antenna Type: Antenna Not Included
Utilized IC / Part: RS9116
Modulation: CCK, DSSS, OFDM
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: I2C, I2S, PCM, SDIO, SPI, UART, USB
Description: RF TXRX MOD BLUETOOTH WIFISMD
Packaging: Tray
Package / Case: 173-LFLGA Module
Sensitivity: -104dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz, 5GHz
Memory Size: 4MB Flash, 512kB ROM, 384kB SRAM
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 3V ~ 3.63V
Power - Output: 18dBm
Data Rate: 54Mbps
Protocol: 802.11a/b/g/n, Bluetooth v5.0, GLONASS, GPS, GSM, LTE, WCDMA
Current - Receiving: 10.2mA ~ 135mA
Current - Transmitting: 8.9mA ~ 313mA
Antenna Type: Antenna Not Included
Utilized IC / Part: RS9116
Modulation: CCK, DSSS, OFDM
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: I2C, I2S, PCM, SDIO, SPI, UART, USB
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| Si7201-B-83-IV |
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Hersteller: Silicon Labs
Description: MAGNETIC SWITCH OMNIPOL SOT23-3
Packaging: Strip
Package / Case: TO-236-3, SC-59, SOT-23-3
Output Type: Push-Pull
Polarization: North Pole, South Pole
Mounting Type: Surface Mount
Function: Omnipolar Switch
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.71V ~ 5.5V
Technology: Hall Effect
Sensing Range: ±3.7mT Trip, ±1.4mT Release
Current - Supply (Max): 56.7µA (Typ)
Supplier Device Package: SOT-23-3
Test Condition: -40°C ~ 125°C
Description: MAGNETIC SWITCH OMNIPOL SOT23-3
Packaging: Strip
Package / Case: TO-236-3, SC-59, SOT-23-3
Output Type: Push-Pull
Polarization: North Pole, South Pole
Mounting Type: Surface Mount
Function: Omnipolar Switch
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.71V ~ 5.5V
Technology: Hall Effect
Sensing Range: ±3.7mT Trip, ±1.4mT Release
Current - Supply (Max): 56.7µA (Typ)
Supplier Device Package: SOT-23-3
Test Condition: -40°C ~ 125°C
auf Bestellung 215 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 11+ | 1.62 EUR |
| 13+ | 1.42 EUR |
| 14+ | 1.35 EUR |
| 25+ | 1.26 EUR |
| 50+ | 1.2 EUR |
| TS1002IM8T |
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Hersteller: Silicon Labs
Description: IC OPAMP GP 2 CIRCUIT 8MSOP
Packaging: Tape & Reel (TR)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Output Type: Rail-to-Rail
Mounting Type: Surface Mount
Amplifier Type: General Purpose
Operating Temperature: -40°C ~ 85°C
Current - Supply: 1.2µA (x2 Channels)
Slew Rate: 0.0015V/µs
Gain Bandwidth Product: 4 kHz
Current - Input Bias: 25 pA
Voltage - Input Offset: 500 µV
Supplier Device Package: 8-MSOP
Number of Circuits: 2
Current - Output / Channel: 1.5 mA
Voltage - Supply Span (Min): 0.65 V
Voltage - Supply Span (Max): 2.5 V
Description: IC OPAMP GP 2 CIRCUIT 8MSOP
Packaging: Tape & Reel (TR)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Output Type: Rail-to-Rail
Mounting Type: Surface Mount
Amplifier Type: General Purpose
Operating Temperature: -40°C ~ 85°C
Current - Supply: 1.2µA (x2 Channels)
Slew Rate: 0.0015V/µs
Gain Bandwidth Product: 4 kHz
Current - Input Bias: 25 pA
Voltage - Input Offset: 500 µV
Supplier Device Package: 8-MSOP
Number of Circuits: 2
Current - Output / Channel: 1.5 mA
Voltage - Supply Span (Min): 0.65 V
Voltage - Supply Span (Max): 2.5 V
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| BGM260PB22VNA2 |
auf Bestellung 200 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 19.68 EUR |
| 10+ | 15.32 EUR |
| 25+ | 14.01 EUR |
| 100+ | 12.4 EUR |
| MGM260PB22VNA5 |
auf Bestellung 200 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 21.81 EUR |
| 10+ | 17.01 EUR |
| 25+ | 15.56 EUR |
| 100+ | 13.79 EUR |
| EFR32BG26B410F3200IM48-B |
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Hersteller: Silicon Labs
Description: BG26 3200K FLASH 512K RAM QFN48
Packaging: Tape & Reel (TR)
Package / Case: 48-QFN
Sensitivity: -105.9dBm
Mounting Type: Surface Mount
Memory Size: 3.125MB Flash, 512kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.71V ~ 3.8V
Power - Output: 10dBm
Protocol: Bluetooth v5.3
Current - Receiving: 5.4mA
Data Rate (Max): 2Mbps
Current - Transmitting: 5.9mA ~ 152.7mA
Supplier Device Package: 48-QFN (6x6)
GPIO: 32
Modulation: 2FSK, 2GFSK, DSSS, GMSK, MSK, O-QPSK
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: ADC, GPIO, I2C, I2S, IrDA, JTAG, PWM, SPI, UART, USART
Description: BG26 3200K FLASH 512K RAM QFN48
Packaging: Tape & Reel (TR)
Package / Case: 48-QFN
Sensitivity: -105.9dBm
Mounting Type: Surface Mount
Memory Size: 3.125MB Flash, 512kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.71V ~ 3.8V
Power - Output: 10dBm
Protocol: Bluetooth v5.3
Current - Receiving: 5.4mA
Data Rate (Max): 2Mbps
Current - Transmitting: 5.9mA ~ 152.7mA
Supplier Device Package: 48-QFN (6x6)
GPIO: 32
Modulation: 2FSK, 2GFSK, DSSS, GMSK, MSK, O-QPSK
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: ADC, GPIO, I2C, I2S, IrDA, JTAG, PWM, SPI, UART, USART
auf Bestellung 490 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 2+ | 12.92 EUR |
| 10+ | 11.21 EUR |
| 25+ | 10.61 EUR |
| 100+ | 9.79 EUR |
| 490+ | 8.97 EUR |
| EFM32PG26B500F3200IM68-B |
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Hersteller: Silicon Labs
Description: PG26 3200K FLASH 512K RAM QFN68
Packaging: Tray
Package / Case: 68-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 3.125MB (3.125M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33F
Data Converters: A/D 4x16b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.8V
Connectivity: I2C, IrDA, SmartCard, SPI, UART/USART
Peripherals: Crypto - AES, DMA, I2S, Keypad, LCD, POR. PWM, SHA, Temp Sensor, TRNG, WDT
Supplier Device Package: 68-QFN (8x8)
Number of I/O: 48
Description: PG26 3200K FLASH 512K RAM QFN68
Packaging: Tray
Package / Case: 68-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 3.125MB (3.125M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33F
Data Converters: A/D 4x16b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.8V
Connectivity: I2C, IrDA, SmartCard, SPI, UART/USART
Peripherals: Crypto - AES, DMA, I2S, Keypad, LCD, POR. PWM, SHA, Temp Sensor, TRNG, WDT
Supplier Device Package: 68-QFN (8x8)
Number of I/O: 48
auf Bestellung 1243 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 2+ | 12.44 EUR |
| 10+ | 10.8 EUR |
| 25+ | 10.22 EUR |
| 100+ | 9.43 EUR |
| 260+ | 8.94 EUR |
| 520+ | 8.61 EUR |
| 1040+ | 8.3 EUR |
| EFM32PG26B500F3200IL136-B |
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Hersteller: Silicon Labs
Description: PG26 3200K FLASH 512K RAM BGA136
Packaging: Tray
Package / Case: 136-VFBGA
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 3.125MB (3.125M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33F
Data Converters: A/D 4x16b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.8V
Connectivity: I2C, IrDA, SmartCard, SPI, UART/USART
Peripherals: Crypto - AES, DMA, I2S, Keypad, LCD, POR. PWM, SHA, Temp Sensor, TRNG, WDT
Supplier Device Package: 136-BGA (7x7)
Number of I/O: 64
Description: PG26 3200K FLASH 512K RAM BGA136
Packaging: Tray
Package / Case: 136-VFBGA
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 3.125MB (3.125M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33F
Data Converters: A/D 4x16b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.8V
Connectivity: I2C, IrDA, SmartCard, SPI, UART/USART
Peripherals: Crypto - AES, DMA, I2S, Keypad, LCD, POR. PWM, SHA, Temp Sensor, TRNG, WDT
Supplier Device Package: 136-BGA (7x7)
Number of I/O: 64
auf Bestellung 434 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 2+ | 12.57 EUR |
| 10+ | 10.91 EUR |
| 25+ | 10.33 EUR |
| 100+ | 9.53 EUR |
| 260+ | 9.03 EUR |
| EFR32BG26B510F3200IM48-B |
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Hersteller: Silicon Labs
Description: BG26 3200K FLASH 512K RAM QFN48
Packaging: Tape & Reel (TR)
Package / Case: 48-QFN
Sensitivity: -105.9dBm
Mounting Type: Surface Mount
Memory Size: 3.125MB Flash, 512kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.71V ~ 3.8V
Power - Output: 10dBm
Protocol: Bluetooth v5.3
Current - Receiving: 5.4mA
Data Rate (Max): 2Mbps
Current - Transmitting: 5.9mA ~ 152.7mA
Supplier Device Package: 48-QFN (6x6)
GPIO: 28
Modulation: 2FSK, 2GFSK, DSSS, GMSK, MSK, O-QPSK
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: ADC, GPIO, I2C, I2S, IrDA, JTAG, PWM, SPI, UART, USART
Description: BG26 3200K FLASH 512K RAM QFN48
Packaging: Tape & Reel (TR)
Package / Case: 48-QFN
Sensitivity: -105.9dBm
Mounting Type: Surface Mount
Memory Size: 3.125MB Flash, 512kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.71V ~ 3.8V
Power - Output: 10dBm
Protocol: Bluetooth v5.3
Current - Receiving: 5.4mA
Data Rate (Max): 2Mbps
Current - Transmitting: 5.9mA ~ 152.7mA
Supplier Device Package: 48-QFN (6x6)
GPIO: 28
Modulation: 2FSK, 2GFSK, DSSS, GMSK, MSK, O-QPSK
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: ADC, GPIO, I2C, I2S, IrDA, JTAG, PWM, SPI, UART, USART
auf Bestellung 490 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 2+ | 13.64 EUR |
| 10+ | 11.82 EUR |
| 25+ | 11.19 EUR |
| 100+ | 10.33 EUR |
| 490+ | 9.46 EUR |
| EFR32BG26B420F3200IM48-B |
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Hersteller: Silicon Labs
Description: BG26 3200K FLASH 512K RAM QFN48
Packaging: Tray
Package / Case: 48-QFN
Sensitivity: -105.9dBm
Mounting Type: Surface Mount
Memory Size: 3.125MB Flash, 512kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.71V ~ 3.8V
Power - Output: 19.5dBm
Protocol: Bluetooth v5.3
Current - Receiving: 5.4mA
Data Rate (Max): 2Mbps
Current - Transmitting: 5.9mA ~ 152.7mA
Supplier Device Package: 48-QFN (6x6)
GPIO: 32
Modulation: 2FSK, 2GFSK, DSSS, GMSK, MSK, O-QPSK
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: ADC, GPIO, I2C, I2S, IrDA, JTAG, PWM, SPI, UART, USART
Description: BG26 3200K FLASH 512K RAM QFN48
Packaging: Tray
Package / Case: 48-QFN
Sensitivity: -105.9dBm
Mounting Type: Surface Mount
Memory Size: 3.125MB Flash, 512kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.71V ~ 3.8V
Power - Output: 19.5dBm
Protocol: Bluetooth v5.3
Current - Receiving: 5.4mA
Data Rate (Max): 2Mbps
Current - Transmitting: 5.9mA ~ 152.7mA
Supplier Device Package: 48-QFN (6x6)
GPIO: 32
Modulation: 2FSK, 2GFSK, DSSS, GMSK, MSK, O-QPSK
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: ADC, GPIO, I2C, I2S, IrDA, JTAG, PWM, SPI, UART, USART
auf Bestellung 490 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 2+ | 13.68 EUR |
| 10+ | 11.85 EUR |
| 25+ | 11.22 EUR |
| 100+ | 10.36 EUR |
| 490+ | 9.49 EUR |
| EFR32BG26B510F3200IM68-B |
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Hersteller: Silicon Labs
Description: BG26 3200K FLASH 512K RAM QFN68
Packaging: Tray
Package / Case: 68-QFN
Sensitivity: -105.9dBm
Mounting Type: Surface Mount
Memory Size: 3.125MB Flash, 512kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.71V ~ 3.8V
Power - Output: 10dBm
Protocol: Bluetooth v5.3
Current - Receiving: 5.4mA
Data Rate (Max): 2Mbps
Current - Transmitting: 5.9mA ~ 152.7mA
Supplier Device Package: 68-QFN (8x8)
GPIO: 45
Modulation: 2FSK, 2GFSK, DSSS, GMSK, MSK, O-QPSK
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: ADC, GPIO, I2C, I2S, IrDA, JTAG, PWM, SPI, UART, USART
Description: BG26 3200K FLASH 512K RAM QFN68
Packaging: Tray
Package / Case: 68-QFN
Sensitivity: -105.9dBm
Mounting Type: Surface Mount
Memory Size: 3.125MB Flash, 512kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.71V ~ 3.8V
Power - Output: 10dBm
Protocol: Bluetooth v5.3
Current - Receiving: 5.4mA
Data Rate (Max): 2Mbps
Current - Transmitting: 5.9mA ~ 152.7mA
Supplier Device Package: 68-QFN (8x8)
GPIO: 45
Modulation: 2FSK, 2GFSK, DSSS, GMSK, MSK, O-QPSK
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: ADC, GPIO, I2C, I2S, IrDA, JTAG, PWM, SPI, UART, USART
auf Bestellung 220 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 2+ | 12.83 EUR |
| 10+ | 11.12 EUR |
| 25+ | 10.53 EUR |
| 100+ | 9.72 EUR |
| EFR32BG26B510F3200IL136-B |
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Hersteller: Silicon Labs
Description: BG26 3200K FLASH 512K RAM BGA136
Packaging: Tray
Package / Case: 136-BGA
Sensitivity: -105.9dBm
Mounting Type: Surface Mount
Memory Size: 3.125MB Flash, 512kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.71V ~ 3.8V
Power - Output: 10dBm
Protocol: Bluetooth v5.3
Current - Receiving: 5.4mA
Data Rate (Max): 2Mbps
Current - Transmitting: 5.9mA ~ 152.7mA
Supplier Device Package: 136-BGA (7x7)
GPIO: 64
Modulation: 2FSK, 2GFSK, DSSS, GMSK, MSK, O-QPSK
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: ADC, GPIO, I2C, I2S, IrDA, JTAG, PWM, SPI, UART, USART
Description: BG26 3200K FLASH 512K RAM BGA136
Packaging: Tray
Package / Case: 136-BGA
Sensitivity: -105.9dBm
Mounting Type: Surface Mount
Memory Size: 3.125MB Flash, 512kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.71V ~ 3.8V
Power - Output: 10dBm
Protocol: Bluetooth v5.3
Current - Receiving: 5.4mA
Data Rate (Max): 2Mbps
Current - Transmitting: 5.9mA ~ 152.7mA
Supplier Device Package: 136-BGA (7x7)
GPIO: 64
Modulation: 2FSK, 2GFSK, DSSS, GMSK, MSK, O-QPSK
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: ADC, GPIO, I2C, I2S, IrDA, JTAG, PWM, SPI, UART, USART
auf Bestellung 453 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 2+ | 13.04 EUR |
| 10+ | 11.32 EUR |
| 25+ | 10.71 EUR |
| 100+ | 9.89 EUR |
| 260+ | 9.38 EUR |
| EFR32MG26B410F3200IM48-B |
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Hersteller: Silicon Labs
Description: MG26 3200K FLASH 512K RAM QFN48
Packaging: Tray
Package / Case: 48-QFN
Sensitivity: -105.9dBm
Mounting Type: Surface Mount
Memory Size: 3.125MB Flash, 512kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.71V ~ 3.8V
Power - Output: 10dBm
Protocol: Bluetooth v5.3, Zigbee®
Current - Receiving: 5.4mA ~ 6.2mA
Data Rate (Max): 2Mbps
Current - Transmitting: 5.9mA ~ 152.7mA
Supplier Device Package: 48-QFN (6x6)
GPIO: 32
Modulation: 2FSK, 2GFSK, DSSS, GMSK, MSK, O-QPSK
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: ADC, GPIO, I2C, I2S, IrDA, JTAG, PWM, SPI, UART, USART
Description: MG26 3200K FLASH 512K RAM QFN48
Packaging: Tray
Package / Case: 48-QFN
Sensitivity: -105.9dBm
Mounting Type: Surface Mount
Memory Size: 3.125MB Flash, 512kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.71V ~ 3.8V
Power - Output: 10dBm
Protocol: Bluetooth v5.3, Zigbee®
Current - Receiving: 5.4mA ~ 6.2mA
Data Rate (Max): 2Mbps
Current - Transmitting: 5.9mA ~ 152.7mA
Supplier Device Package: 48-QFN (6x6)
GPIO: 32
Modulation: 2FSK, 2GFSK, DSSS, GMSK, MSK, O-QPSK
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: ADC, GPIO, I2C, I2S, IrDA, JTAG, PWM, SPI, UART, USART
auf Bestellung 486 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 2+ | 14.19 EUR |
| 10+ | 12.32 EUR |
| 25+ | 11.66 EUR |
| 100+ | 10.77 EUR |
| EFR32MG26B410F3200IM68-B |
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Hersteller: Silicon Labs
Description: MG26 3200K FLASH 512K RAM QFN68
Packaging: Tray
Package / Case: 68-VFQFN Exposed Pad
Sensitivity: -105.9dBm
Mounting Type: Surface Mount
Memory Size: 3.125MB Flash, 512kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.71V ~ 3.8V
Power - Output: 10dBm
Protocol: Bluetooth v5.3, Zigbee®
Current - Receiving: 5.4mA ~ 6.2mA
Data Rate (Max): 2Mbps
Current - Transmitting: 5.9mA ~ 152.7mA
Supplier Device Package: 68-QFN (8x8)
GPIO: 49
Modulation: 2FSK, 2GFSK, DSSS, GMSK, MSK, O-QPSK
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: ADC, GPIO, I2C, I2S, IrDA, JTAG, PWM, SPI, UART, USART
Description: MG26 3200K FLASH 512K RAM QFN68
Packaging: Tray
Package / Case: 68-VFQFN Exposed Pad
Sensitivity: -105.9dBm
Mounting Type: Surface Mount
Memory Size: 3.125MB Flash, 512kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.71V ~ 3.8V
Power - Output: 10dBm
Protocol: Bluetooth v5.3, Zigbee®
Current - Receiving: 5.4mA ~ 6.2mA
Data Rate (Max): 2Mbps
Current - Transmitting: 5.9mA ~ 152.7mA
Supplier Device Package: 68-QFN (8x8)
GPIO: 49
Modulation: 2FSK, 2GFSK, DSSS, GMSK, MSK, O-QPSK
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: ADC, GPIO, I2C, I2S, IrDA, JTAG, PWM, SPI, UART, USART
auf Bestellung 520 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 2+ | 13.32 EUR |
| 10+ | 11.56 EUR |
| 25+ | 10.94 EUR |
| 100+ | 10.1 EUR |
| 260+ | 9.58 EUR |
| 520+ | 9.22 EUR |
| EFR32MG26B510F3200IM48-B |
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Hersteller: Silicon Labs
Description: MG26 3200K FLASH 512K RAM QFN48
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Sensitivity: -105.9dBm
Mounting Type: Surface Mount
Memory Size: 3.125MB Flash, 512kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.71V ~ 3.8V
Power - Output: 10dBm
Protocol: Bluetooth v5.3, Zigbee®
Current - Receiving: 5.4mA ~ 6.2mA
Data Rate (Max): 2Mbps
Current - Transmitting: 5.9mA ~ 152.7mA
Supplier Device Package: 48-QFN (6x6)
GPIO: 28
Modulation: 2FSK, 2GFSK, DSSS, GMSK, MSK, O-QPSK
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: ADC, GPIO, I2C, I2S, IrDA, JTAG, PWM, SPI, UART, USART
Description: MG26 3200K FLASH 512K RAM QFN48
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Sensitivity: -105.9dBm
Mounting Type: Surface Mount
Memory Size: 3.125MB Flash, 512kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.71V ~ 3.8V
Power - Output: 10dBm
Protocol: Bluetooth v5.3, Zigbee®
Current - Receiving: 5.4mA ~ 6.2mA
Data Rate (Max): 2Mbps
Current - Transmitting: 5.9mA ~ 152.7mA
Supplier Device Package: 48-QFN (6x6)
GPIO: 28
Modulation: 2FSK, 2GFSK, DSSS, GMSK, MSK, O-QPSK
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: ADC, GPIO, I2C, I2S, IrDA, JTAG, PWM, SPI, UART, USART
auf Bestellung 2405 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 2+ | 13.9 EUR |
| 10+ | 12.08 EUR |
| 25+ | 11.44 EUR |
| 100+ | 10.56 EUR |
| 490+ | 9.67 EUR |
| 980+ | 9.32 EUR |
| 1470+ | 9.13 EUR |
| EFR32MG26B420F3200IM48-B |
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Hersteller: Silicon Labs
Description: MG26 3200K FLASH 512K RAM QFN48
Packaging: Tray
Package / Case: 48-QFN
Sensitivity: -105.9dBm
Mounting Type: Surface Mount
Memory Size: 3.125MB Flash, 512kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.71V ~ 3.8V
Power - Output: 19.5dBm
Protocol: Bluetooth v5.3, Zigbee®
Current - Receiving: 5.4mA ~ 6.2mA
Data Rate (Max): 2Mbps
Current - Transmitting: 5.9mA ~ 152.7mA
Supplier Device Package: 48-QFN (6x6)
GPIO: 32
Modulation: 2FSK, 2GFSK, DSSS, GMSK, MSK, O-QPSK
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: ADC, GPIO, I2C, I2S, IrDA, JTAG, PWM, SPI, UART, USART
Description: MG26 3200K FLASH 512K RAM QFN48
Packaging: Tray
Package / Case: 48-QFN
Sensitivity: -105.9dBm
Mounting Type: Surface Mount
Memory Size: 3.125MB Flash, 512kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.71V ~ 3.8V
Power - Output: 19.5dBm
Protocol: Bluetooth v5.3, Zigbee®
Current - Receiving: 5.4mA ~ 6.2mA
Data Rate (Max): 2Mbps
Current - Transmitting: 5.9mA ~ 152.7mA
Supplier Device Package: 48-QFN (6x6)
GPIO: 32
Modulation: 2FSK, 2GFSK, DSSS, GMSK, MSK, O-QPSK
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: ADC, GPIO, I2C, I2S, IrDA, JTAG, PWM, SPI, UART, USART
auf Bestellung 490 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 2+ | 14.89 EUR |
| 10+ | 12.93 EUR |
| 25+ | 12.24 EUR |
| 100+ | 11.3 EUR |
| 490+ | 10.35 EUR |
| EFR32MG26B510F3200IM68-B |
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Hersteller: Silicon Labs
Description: MG26 3200K FLASH 512K RAM QFN68
Packaging: Tray
Package / Case: 68-QFN
Sensitivity: -105.9dBm
Mounting Type: Surface Mount
Memory Size: 3.125MB Flash, 512kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.71V ~ 3.8V
Power - Output: 10dBm
Protocol: Bluetooth v5.3, Zigbee®
Current - Receiving: 5.4mA ~ 6.2mA
Data Rate (Max): 2Mbps
Current - Transmitting: 5.9mA ~ 152.7mA
Supplier Device Package: 68-QFN (8x8)
GPIO: 45
Modulation: 2FSK, 2GFSK, DSSS, GMSK, MSK, O-QPSK
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: ADC, GPIO, I2C, I2S, IrDA, JTAG, PWM, SPI, UART, USART
Description: MG26 3200K FLASH 512K RAM QFN68
Packaging: Tray
Package / Case: 68-QFN
Sensitivity: -105.9dBm
Mounting Type: Surface Mount
Memory Size: 3.125MB Flash, 512kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.71V ~ 3.8V
Power - Output: 10dBm
Protocol: Bluetooth v5.3, Zigbee®
Current - Receiving: 5.4mA ~ 6.2mA
Data Rate (Max): 2Mbps
Current - Transmitting: 5.9mA ~ 152.7mA
Supplier Device Package: 68-QFN (8x8)
GPIO: 45
Modulation: 2FSK, 2GFSK, DSSS, GMSK, MSK, O-QPSK
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: ADC, GPIO, I2C, I2S, IrDA, JTAG, PWM, SPI, UART, USART
auf Bestellung 520 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 2+ | 15.03 EUR |
| 10+ | 13.04 EUR |
| 25+ | 12.35 EUR |
| 100+ | 11.4 EUR |
| 260+ | 10.81 EUR |
| 520+ | 10.42 EUR |
| EFR32MG26B420F3200IM68-B |
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Hersteller: Silicon Labs
Description: MG26 3200K FLASH 512K RAM QFN68
Packaging: Tray
Package / Case: 68-VFQFN Exposed Pad
Sensitivity: -105.9dBm
Mounting Type: Surface Mount
Memory Size: 3.125MB Flash, 512kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.71V ~ 3.8V
Power - Output: 19.5dBm
Protocol: Bluetooth v5.3, Zigbee®
Current - Receiving: 5.4mA ~ 6.2mA
Data Rate (Max): 2Mbps
Current - Transmitting: 5.9mA ~ 152.7mA
Supplier Device Package: 68-QFN (8x8)
GPIO: 49
Modulation: 2FSK, 2GFSK, DSSS, GMSK, MSK, O-QPSK
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: ADC, GPIO, I2C, I2S, IrDA, JTAG, PWM, SPI, UART, USART
Description: MG26 3200K FLASH 512K RAM QFN68
Packaging: Tray
Package / Case: 68-VFQFN Exposed Pad
Sensitivity: -105.9dBm
Mounting Type: Surface Mount
Memory Size: 3.125MB Flash, 512kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.71V ~ 3.8V
Power - Output: 19.5dBm
Protocol: Bluetooth v5.3, Zigbee®
Current - Receiving: 5.4mA ~ 6.2mA
Data Rate (Max): 2Mbps
Current - Transmitting: 5.9mA ~ 152.7mA
Supplier Device Package: 68-QFN (8x8)
GPIO: 49
Modulation: 2FSK, 2GFSK, DSSS, GMSK, MSK, O-QPSK
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: ADC, GPIO, I2C, I2S, IrDA, JTAG, PWM, SPI, UART, USART
auf Bestellung 481 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 2+ | 13.97 EUR |
| 10+ | 12.12 EUR |
| 25+ | 11.48 EUR |
| 100+ | 10.6 EUR |
| 260+ | 10.05 EUR |
| EFR32MG26B510F3200IL136-B |
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Hersteller: Silicon Labs
Description: MG26 3200K FLASH 512K RAM BGA136
Packaging: Tray
Package / Case: 136-VFBGA
Sensitivity: -105.9dBm
Mounting Type: Surface Mount
Memory Size: 3.125MB Flash, 512kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.71V ~ 3.8V
Power - Output: 10dBm
Protocol: Bluetooth v5.3, Zigbee®
Current - Receiving: 5.4mA ~ 6.2mA
Data Rate (Max): 2Mbps
Current - Transmitting: 5.9mA ~ 152.7mA
Supplier Device Package: 136-BGA (7x7)
GPIO: 64
Modulation: 2FSK, 2GFSK, DSSS, GMSK, MSK, O-QPSK
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: ADC, GPIO, I2C, I2S, IrDA, JTAG, PWM, SPI, UART, USART
Description: MG26 3200K FLASH 512K RAM BGA136
Packaging: Tray
Package / Case: 136-VFBGA
Sensitivity: -105.9dBm
Mounting Type: Surface Mount
Memory Size: 3.125MB Flash, 512kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.71V ~ 3.8V
Power - Output: 10dBm
Protocol: Bluetooth v5.3, Zigbee®
Current - Receiving: 5.4mA ~ 6.2mA
Data Rate (Max): 2Mbps
Current - Transmitting: 5.9mA ~ 152.7mA
Supplier Device Package: 136-BGA (7x7)
GPIO: 64
Modulation: 2FSK, 2GFSK, DSSS, GMSK, MSK, O-QPSK
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: ADC, GPIO, I2C, I2S, IrDA, JTAG, PWM, SPI, UART, USART
auf Bestellung 1303 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 2+ | 14.22 EUR |
| 10+ | 12.35 EUR |
| 25+ | 11.69 EUR |
| 100+ | 10.8 EUR |
| 260+ | 10.24 EUR |
| 520+ | 9.86 EUR |
| 1040+ | 9.51 EUR |
| EFR32MG26B520F3200IM48-B |
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Hersteller: Silicon Labs
Description: MG26 3200K FLASH 512K RAM QFN48
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Sensitivity: -105.9dBm
Mounting Type: Surface Mount
Memory Size: 3.125MB Flash, 512kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.71V ~ 3.8V
Power - Output: 19.5dBm
Protocol: Bluetooth v5.3, Zigbee®
Current - Receiving: 5.4mA ~ 6.2mA
Data Rate (Max): 2Mbps
Current - Transmitting: 5.9mA ~ 152.7mA
Supplier Device Package: 48-QFN (6x6)
GPIO: 28
Modulation: 2FSK, 2GFSK, DSSS, GMSK, MSK, O-QPSK
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: ADC, GPIO, I2C, I2S, IrDA, JTAG, PWM, SPI, UART, USART
Description: MG26 3200K FLASH 512K RAM QFN48
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Sensitivity: -105.9dBm
Mounting Type: Surface Mount
Memory Size: 3.125MB Flash, 512kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.71V ~ 3.8V
Power - Output: 19.5dBm
Protocol: Bluetooth v5.3, Zigbee®
Current - Receiving: 5.4mA ~ 6.2mA
Data Rate (Max): 2Mbps
Current - Transmitting: 5.9mA ~ 152.7mA
Supplier Device Package: 48-QFN (6x6)
GPIO: 28
Modulation: 2FSK, 2GFSK, DSSS, GMSK, MSK, O-QPSK
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: ADC, GPIO, I2C, I2S, IrDA, JTAG, PWM, SPI, UART, USART
auf Bestellung 465 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 2+ | 14.56 EUR |
| 10+ | 12.64 EUR |
| 25+ | 11.98 EUR |
| 100+ | 11.06 EUR |
| EFR32MG26B520F3200IM68-B |
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Hersteller: Silicon Labs
Description: MG26 3200K FLASH 512K RAM QFN68
Packaging: Tape & Reel (TR)
Package / Case: 68-QFN
Sensitivity: -105.9dBm
Mounting Type: Surface Mount
Memory Size: 3.125MB Flash, 512kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.71V ~ 3.8V
Power - Output: 19.5dBm
Protocol: Bluetooth v5.3, Zigbee®
Current - Receiving: 5.4mA ~ 6.2mA
Data Rate (Max): 2Mbps
Current - Transmitting: 5.9mA ~ 152.7mA
Supplier Device Package: 68-QFN (8x8)
GPIO: 45
Modulation: 2FSK, 2GFSK, DSSS, GMSK, MSK, O-QPSK
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: ADC, GPIO, I2C, I2S, IrDA, JTAG, PWM, SPI, UART, USART
Description: MG26 3200K FLASH 512K RAM QFN68
Packaging: Tape & Reel (TR)
Package / Case: 68-QFN
Sensitivity: -105.9dBm
Mounting Type: Surface Mount
Memory Size: 3.125MB Flash, 512kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.71V ~ 3.8V
Power - Output: 19.5dBm
Protocol: Bluetooth v5.3, Zigbee®
Current - Receiving: 5.4mA ~ 6.2mA
Data Rate (Max): 2Mbps
Current - Transmitting: 5.9mA ~ 152.7mA
Supplier Device Package: 68-QFN (8x8)
GPIO: 45
Modulation: 2FSK, 2GFSK, DSSS, GMSK, MSK, O-QPSK
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: ADC, GPIO, I2C, I2S, IrDA, JTAG, PWM, SPI, UART, USART
auf Bestellung 520 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 2+ | 15.75 EUR |
| 10+ | 13.68 EUR |
| 25+ | 12.95 EUR |
| 100+ | 11.96 EUR |
| 260+ | 11.34 EUR |
| 520+ | 10.93 EUR |
| XG26-DK2608A |
Hersteller: Silicon Labs
Description: XG26 + 10 DBM DEV KIT
Packaging: Box
Frequency: 2.4GHz
Type: Transceiver; Bluetooth® 5.x (BLE)
Contents: Board(s)
Utilized IC / Part: EFR32MG26
Description: XG26 + 10 DBM DEV KIT
Packaging: Box
Frequency: 2.4GHz
Type: Transceiver; Bluetooth® 5.x (BLE)
Contents: Board(s)
Utilized IC / Part: EFR32MG26
auf Bestellung 45 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 145.64 EUR |
| EFR32BG27C320F768GJ39-B |
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Hersteller: Silicon Labs
Description: IC RF TXRX+MCU 802.15.4 39WLCSP
Packaging: Strip
Package / Case: 39-UFBGA, WLCSP
Sensitivity: -106.7dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 768kB Flash, 64kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 0.8V ~ 1.7V, 1.8V ~ 3.8V
Power - Output: 4dBm
Protocol: Bluetooth v5.0, Zigbee®
Current - Receiving: 3.6mA
Data Rate (Max): 2Mbps
Current - Transmitting: 4.1mA ~ 11.3mA
Supplier Device Package: 39-WLCSP (2.63x2.29)
GPIO: 19
Modulation: DSSS, GFSK, GMSK, OOK, O-QPSK
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: GPIO, I2C, I2S, IrDA, JTAG, PWM, SPI, UART, USART
Description: IC RF TXRX+MCU 802.15.4 39WLCSP
Packaging: Strip
Package / Case: 39-UFBGA, WLCSP
Sensitivity: -106.7dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 768kB Flash, 64kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 0.8V ~ 1.7V, 1.8V ~ 3.8V
Power - Output: 4dBm
Protocol: Bluetooth v5.0, Zigbee®
Current - Receiving: 3.6mA
Data Rate (Max): 2Mbps
Current - Transmitting: 4.1mA ~ 11.3mA
Supplier Device Package: 39-WLCSP (2.63x2.29)
GPIO: 19
Modulation: DSSS, GFSK, GMSK, OOK, O-QPSK
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: GPIO, I2C, I2S, IrDA, JTAG, PWM, SPI, UART, USART
auf Bestellung 17 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 3+ | 6.25 EUR |
| 10+ | 5.41 EUR |
| EFR32BG27C140F768IM32-BR |
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Hersteller: Silicon Labs
Description: IC RF TXRX+MCU 802.15.4 32QFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Sensitivity: -106.7dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 768kB Flash, 64kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.8V ~ 3.8V
Power - Output: 8dBm
Protocol: Bluetooth v5.0, Zigbee®
Current - Receiving: 3.6mA
Data Rate (Max): 2Mbps
Current - Transmitting: 4.1mA ~ 11.3mA
Supplier Device Package: 32-QFN (4x4)
GPIO: 18
Modulation: DSSS, GFSK, GMSK, OOK, O-QPSK
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: GPIO, I2C, I2S, IrDA, JTAG, PWM, SPI, UART, USART
Description: IC RF TXRX+MCU 802.15.4 32QFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Sensitivity: -106.7dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 768kB Flash, 64kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.8V ~ 3.8V
Power - Output: 8dBm
Protocol: Bluetooth v5.0, Zigbee®
Current - Receiving: 3.6mA
Data Rate (Max): 2Mbps
Current - Transmitting: 4.1mA ~ 11.3mA
Supplier Device Package: 32-QFN (4x4)
GPIO: 18
Modulation: DSSS, GFSK, GMSK, OOK, O-QPSK
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: GPIO, I2C, I2S, IrDA, JTAG, PWM, SPI, UART, USART
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| EFR32BG27C230F768IM32-BR |
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Hersteller: Silicon Labs
Description: IC RF TXRX+MCU 802.15.4 32QFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Sensitivity: -106.7dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 768kB Flash, 64kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 0.8V ~ 1.7V
Power - Output: 6dBm
Protocol: Bluetooth v5.0, Zigbee®
Current - Receiving: 3.6mA
Data Rate (Max): 2Mbps
Current - Transmitting: 4.1mA ~ 11.3mA
Supplier Device Package: 32-QFN (4x4)
GPIO: 17
Modulation: DSSS, GFSK, GMSK, OOK, O-QPSK
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: GPIO, I2C, I2S, IrDA, JTAG, PWM, SPI, UART, USART
Description: IC RF TXRX+MCU 802.15.4 32QFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Sensitivity: -106.7dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 768kB Flash, 64kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 0.8V ~ 1.7V
Power - Output: 6dBm
Protocol: Bluetooth v5.0, Zigbee®
Current - Receiving: 3.6mA
Data Rate (Max): 2Mbps
Current - Transmitting: 4.1mA ~ 11.3mA
Supplier Device Package: 32-QFN (4x4)
GPIO: 17
Modulation: DSSS, GFSK, GMSK, OOK, O-QPSK
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: GPIO, I2C, I2S, IrDA, JTAG, PWM, SPI, UART, USART
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| EFR32BG27C320F768GJ39-BR |
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Hersteller: Silicon Labs
Description: IC RF TXRX+MCU 802.15.4 39WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 39-UFBGA, WLCSP
Sensitivity: -106.7dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 768kB Flash, 64kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 0.8V ~ 1.7V, 1.8V ~ 3.8V
Power - Output: 4dBm
Protocol: Bluetooth v5.0, Zigbee®
Current - Receiving: 3.6mA
Data Rate (Max): 2Mbps
Current - Transmitting: 4.1mA ~ 11.3mA
Supplier Device Package: 39-WLCSP (2.63x2.29)
GPIO: 19
Modulation: DSSS, GFSK, GMSK, OOK, O-QPSK
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: GPIO, I2C, I2S, IrDA, JTAG, PWM, SPI, UART, USART
Description: IC RF TXRX+MCU 802.15.4 39WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 39-UFBGA, WLCSP
Sensitivity: -106.7dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 768kB Flash, 64kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 0.8V ~ 1.7V, 1.8V ~ 3.8V
Power - Output: 4dBm
Protocol: Bluetooth v5.0, Zigbee®
Current - Receiving: 3.6mA
Data Rate (Max): 2Mbps
Current - Transmitting: 4.1mA ~ 11.3mA
Supplier Device Package: 39-WLCSP (2.63x2.29)
GPIO: 19
Modulation: DSSS, GFSK, GMSK, OOK, O-QPSK
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: GPIO, I2C, I2S, IrDA, JTAG, PWM, SPI, UART, USART
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| EFR32BG27C230F768IM40-BR |
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Hersteller: Silicon Labs
Description: IC RF TXRX+MCU 802.15.4 40QFN
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -106.7dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 768kB Flash, 64kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 0.8V ~ 1.7V
Power - Output: 6dBm
Protocol: Bluetooth v5.0, Zigbee®
Current - Receiving: 3.6mA
Data Rate (Max): 2Mbps
Current - Transmitting: 4.1mA ~ 11.3mA
Supplier Device Package: 40-QFN (5x5)
GPIO: 25
Modulation: DSSS, GFSK, GMSK, OOK, O-QPSK
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: GPIO, I2C, I2S, IrDA, JTAG, PWM, SPI, UART, USART
Description: IC RF TXRX+MCU 802.15.4 40QFN
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -106.7dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 768kB Flash, 64kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 0.8V ~ 1.7V
Power - Output: 6dBm
Protocol: Bluetooth v5.0, Zigbee®
Current - Receiving: 3.6mA
Data Rate (Max): 2Mbps
Current - Transmitting: 4.1mA ~ 11.3mA
Supplier Device Package: 40-QFN (5x5)
GPIO: 25
Modulation: DSSS, GFSK, GMSK, OOK, O-QPSK
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: GPIO, I2C, I2S, IrDA, JTAG, PWM, SPI, UART, USART
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| EFR32BG27C320F768IJ39-BR |
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Hersteller: Silicon Labs
Description: SOC WLCSP39 PACKAGE HIGH TEMP
Packaging: Tape & Reel (TR)
Package / Case: 39-UFBGA, WLCSP
Sensitivity: -106.9dBm
Mounting Type: Surface Mount
Memory Size: 768kB Flash, 64kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.71V ~ 3.8V
Power - Output: 8dBm
Protocol: Bluetooth v5.4
Current - Receiving: 3.6mA ~ 4.5mA
Data Rate (Max): 2Mbps
Current - Transmitting: 4.1mA ~ 24.1mA
Supplier Device Package: 39-WLCSP (2.63x2.29)
GPIO: 19
Modulation: DSSS, GFSK, GMSK, OOK, O-QPSK
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: GPIO, I2C, I2S, IrDA, JTAG, PWM, SPI, UART, USART
Description: SOC WLCSP39 PACKAGE HIGH TEMP
Packaging: Tape & Reel (TR)
Package / Case: 39-UFBGA, WLCSP
Sensitivity: -106.9dBm
Mounting Type: Surface Mount
Memory Size: 768kB Flash, 64kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.71V ~ 3.8V
Power - Output: 8dBm
Protocol: Bluetooth v5.4
Current - Receiving: 3.6mA ~ 4.5mA
Data Rate (Max): 2Mbps
Current - Transmitting: 4.1mA ~ 24.1mA
Supplier Device Package: 39-WLCSP (2.63x2.29)
GPIO: 19
Modulation: DSSS, GFSK, GMSK, OOK, O-QPSK
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: GPIO, I2C, I2S, IrDA, JTAG, PWM, SPI, UART, USART
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| EFM8BB31F16I-B-QFN24 |
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Hersteller: Silicon Labs
Description: IC MCU 8BIT 16KB FLASH 24QFN
Packaging: Tube
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2.25K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: CIP-51 8051
Data Converters: A/D 12x10/12b SAR; D/A 2x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: I2C, SMBus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 24-QFN (3x3)
Number of I/O: 20
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 16KB FLASH 24QFN
Packaging: Tube
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2.25K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: CIP-51 8051
Data Converters: A/D 12x10/12b SAR; D/A 2x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: I2C, SMBus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 24-QFN (3x3)
Number of I/O: 20
DigiKey Programmable: Not Verified
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| EFM8BB31F16I-C-4QFN24 |
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Hersteller: Silicon Labs
Description: IC MCU 8BIT 16KB FLASH 24QFN
Packaging: Tube
Package / Case: 24-WFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2.25K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: CIP-51 8051
Data Converters: A/D 12x10/12b SAR; D/A 2x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: I2C, SMBus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 24-QFN (4x4)
Number of I/O: 20
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 16KB FLASH 24QFN
Packaging: Tube
Package / Case: 24-WFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2.25K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: CIP-51 8051
Data Converters: A/D 12x10/12b SAR; D/A 2x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: I2C, SMBus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 24-QFN (4x4)
Number of I/O: 20
DigiKey Programmable: Not Verified
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| EFM8BB31F32A-B-4QFN24R |
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Hersteller: Silicon Labs
Description: IC MCU 8BIT 32KB FLASH 24QFN
Packaging: Tape & Reel (TR)
Package / Case: 24-WFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2.25K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: CIP-51 8051
Data Converters: A/D 12x10/12b SAR; D/A 2x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: I2C, SMBus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 24-QFN (4x4)
Grade: Automotive
Number of I/O: 20
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
Description: IC MCU 8BIT 32KB FLASH 24QFN
Packaging: Tape & Reel (TR)
Package / Case: 24-WFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2.25K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: CIP-51 8051
Data Converters: A/D 12x10/12b SAR; D/A 2x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: I2C, SMBus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 24-QFN (4x4)
Grade: Automotive
Number of I/O: 20
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
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| EFM8BB31F32A-C-4QFN24R |
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Hersteller: Silicon Labs
Description: IC MCU 8BIT 32KB FLASH 24QFN
Packaging: Tape & Reel (TR)
Package / Case: 24-WFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2.25K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: CIP-51 8051
Data Converters: A/D 12x10/12b SAR; D/A 2x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: I2C, SMBus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 24-QFN (4x4)
Grade: Automotive
Number of I/O: 20
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
Description: IC MCU 8BIT 32KB FLASH 24QFN
Packaging: Tape & Reel (TR)
Package / Case: 24-WFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2.25K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: CIP-51 8051
Data Converters: A/D 12x10/12b SAR; D/A 2x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: I2C, SMBus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 24-QFN (4x4)
Grade: Automotive
Number of I/O: 20
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
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| EFM8BB31F64I-D-4QFN24 |
Hersteller: Silicon Labs
Description: IC MCU 8BIT 64KB FLASH 24QFN
Packaging: Tube
Package / Case: 24-WFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4.25K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: CIP-51 8051
Data Converters: A/D 12x12b; D/A 2x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: I2C, SMBus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 24-QFN (4x4)
Number of I/O: 20
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 64KB FLASH 24QFN
Packaging: Tube
Package / Case: 24-WFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4.25K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: CIP-51 8051
Data Converters: A/D 12x12b; D/A 2x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: I2C, SMBus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 24-QFN (4x4)
Number of I/O: 20
DigiKey Programmable: Not Verified
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| EFM8BB31F16A-B-4QFN24R |
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Hersteller: Silicon Labs
Description: IC MCU 8BIT 16KB FLASH 24QFN
Packaging: Tape & Reel (TR)
Package / Case: 32-WFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2.25K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: CIP-51 8051
Data Converters: A/D 12x10/12b SAR; D/A 2x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: I2C, SMBus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 32-QFN (5x5)
Grade: Automotive
Number of I/O: 20
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
Description: IC MCU 8BIT 16KB FLASH 24QFN
Packaging: Tape & Reel (TR)
Package / Case: 32-WFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2.25K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: CIP-51 8051
Data Converters: A/D 12x10/12b SAR; D/A 2x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: I2C, SMBus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 32-QFN (5x5)
Grade: Automotive
Number of I/O: 20
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
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| EFM8BB31F16A-C-4QFN24R |
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Hersteller: Silicon Labs
Description: IC MCU 8BIT 16KB FLASH 24QFN
Packaging: Tape & Reel (TR)
Package / Case: 24-WFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2.25K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: CIP-51 8051
Data Converters: A/D 12x10/12b SAR; D/A 2x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: I2C, SMBus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 24-QFN (4x4)
Grade: Automotive
Number of I/O: 20
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
Description: IC MCU 8BIT 16KB FLASH 24QFN
Packaging: Tape & Reel (TR)
Package / Case: 24-WFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2.25K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: CIP-51 8051
Data Converters: A/D 12x10/12b SAR; D/A 2x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: I2C, SMBus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 24-QFN (4x4)
Grade: Automotive
Number of I/O: 20
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
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| EFM8BB31F16A-D-4QFN24 |
Hersteller: Silicon Labs
Description: IC MCU 8BIT 16KB FLASH 24QFN
Packaging: Tube
Package / Case: 24-WFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2.25K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: CIP-51 8051
Data Converters: A/D 12x12b; D/A 2x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: I2C, SMBus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 24-QFN (4x4)
Number of I/O: 20
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 16KB FLASH 24QFN
Packaging: Tube
Package / Case: 24-WFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2.25K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: CIP-51 8051
Data Converters: A/D 12x12b; D/A 2x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: I2C, SMBus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 24-QFN (4x4)
Number of I/O: 20
DigiKey Programmable: Not Verified
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| TS12011ITD1022T |
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Hersteller: Silicon Labs
Description: IC OPAMP GP 1 CIRCUIT 10TDFN
Packaging: Tape & Reel (TR)
Package / Case: 10-UFDFN Exposed Pad
Output Type: Push-Pull
Mounting Type: Surface Mount
Amplifier Type: General Purpose
Operating Temperature: -40°C ~ 85°C
Current - Supply: 1.1µA
Slew Rate: 0.006V/µs
Gain Bandwidth Product: 15 kHz
Current - Input Bias: 20 nA
Voltage - Input Offset: 3.5 mV
Supplier Device Package: 10-TDFN (2x2)
Number of Circuits: 1
Current - Output / Channel: 500 µA
Voltage - Supply Span (Min): 0.8 V
Voltage - Supply Span (Max): 2.5 V
Description: IC OPAMP GP 1 CIRCUIT 10TDFN
Packaging: Tape & Reel (TR)
Package / Case: 10-UFDFN Exposed Pad
Output Type: Push-Pull
Mounting Type: Surface Mount
Amplifier Type: General Purpose
Operating Temperature: -40°C ~ 85°C
Current - Supply: 1.1µA
Slew Rate: 0.006V/µs
Gain Bandwidth Product: 15 kHz
Current - Input Bias: 20 nA
Voltage - Input Offset: 3.5 mV
Supplier Device Package: 10-TDFN (2x2)
Number of Circuits: 1
Current - Output / Channel: 500 µA
Voltage - Supply Span (Min): 0.8 V
Voltage - Supply Span (Max): 2.5 V
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| SIWG917Y121MGNBAR |
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Hersteller: Silicon Labs
Description: SIWG917Y SOC MODULE WI-FI 6 2.4
Packaging: Cut Tape (CT)
Package / Case: 71-SMD Module
Sensitivity: -95dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 8MB Flash, 2MB PSRAM
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.71V ~ 1.98V, 2.97V ~ 3.63V
Power - Output: 17.5dBm
Data Rate: 54Mbps
Protocol: 802.11b/g/n/ax, Bluetooth v5.4
Current - Receiving: 11mA ~ 55mA
Current - Transmitting: 11mA ~ 231mA
Antenna Type: Antenna Not Included
Utilized IC / Part: SiWG917M
Modulation: CCK, DSSS, OFDM
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: ADC, GPIO, I2C, I2S, ISP, JTAG, PCM, PWM, SDIO, SPI, UART, USART
Description: SIWG917Y SOC MODULE WI-FI 6 2.4
Packaging: Cut Tape (CT)
Package / Case: 71-SMD Module
Sensitivity: -95dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 8MB Flash, 2MB PSRAM
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.71V ~ 1.98V, 2.97V ~ 3.63V
Power - Output: 17.5dBm
Data Rate: 54Mbps
Protocol: 802.11b/g/n/ax, Bluetooth v5.4
Current - Receiving: 11mA ~ 55mA
Current - Transmitting: 11mA ~ 231mA
Antenna Type: Antenna Not Included
Utilized IC / Part: SiWG917M
Modulation: CCK, DSSS, OFDM
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: ADC, GPIO, I2C, I2S, ISP, JTAG, PCM, PWM, SDIO, SPI, UART, USART
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| SIWG917Y121MGNBAR |
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Hersteller: Silicon Labs
Description: SIWG917Y SOC MODULE WI-FI 6 2.4
Packaging: Tape & Box (TB)
Package / Case: 71-SMD Module
Sensitivity: -95dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 8MB Flash, 2MB PSRAM
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.71V ~ 1.98V, 2.97V ~ 3.63V
Power - Output: 17.5dBm
Data Rate: 54Mbps
Protocol: 802.11b/g/n/ax, Bluetooth v5.4
Current - Receiving: 11mA ~ 55mA
Current - Transmitting: 11mA ~ 231mA
Antenna Type: Antenna Not Included
Utilized IC / Part: SiWG917M
Modulation: CCK, DSSS, OFDM
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: ADC, GPIO, I2C, I2S, ISP, JTAG, PCM, PWM, SDIO, SPI, UART, USART
Description: SIWG917Y SOC MODULE WI-FI 6 2.4
Packaging: Tape & Box (TB)
Package / Case: 71-SMD Module
Sensitivity: -95dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 8MB Flash, 2MB PSRAM
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.71V ~ 1.98V, 2.97V ~ 3.63V
Power - Output: 17.5dBm
Data Rate: 54Mbps
Protocol: 802.11b/g/n/ax, Bluetooth v5.4
Current - Receiving: 11mA ~ 55mA
Current - Transmitting: 11mA ~ 231mA
Antenna Type: Antenna Not Included
Utilized IC / Part: SiWG917M
Modulation: CCK, DSSS, OFDM
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: ADC, GPIO, I2C, I2S, ISP, JTAG, PCM, PWM, SDIO, SPI, UART, USART
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| SIWG917Y121MGABAR |
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Hersteller: Silicon Labs
Description: SIWG917Y SOC MODULE WI-FI 6 2.4
Packaging: Cut Tape (CT)
Package / Case: 71-SMD Module
Sensitivity: -95dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 8MB Flash, 2MB PSRAM
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.71V ~ 1.98V, 2.97V ~ 3.63V
Power - Output: 17.5dBm
Data Rate: 54Mbps
Protocol: 802.11b/g/n/ax, Bluetooth v5.4
Current - Receiving: 11mA ~ 55mA
Current - Transmitting: 11mA ~ 231mA
Antenna Type: Integrated, Chip
Utilized IC / Part: SiWG917M
Modulation: CCK, DSSS, OFDM
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: ADC, GPIO, I2C, I2S, ISP, JTAG, PCM, PWM, SDIO, SPI, UART, USART
Description: SIWG917Y SOC MODULE WI-FI 6 2.4
Packaging: Cut Tape (CT)
Package / Case: 71-SMD Module
Sensitivity: -95dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 8MB Flash, 2MB PSRAM
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.71V ~ 1.98V, 2.97V ~ 3.63V
Power - Output: 17.5dBm
Data Rate: 54Mbps
Protocol: 802.11b/g/n/ax, Bluetooth v5.4
Current - Receiving: 11mA ~ 55mA
Current - Transmitting: 11mA ~ 231mA
Antenna Type: Integrated, Chip
Utilized IC / Part: SiWG917M
Modulation: CCK, DSSS, OFDM
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: ADC, GPIO, I2C, I2S, ISP, JTAG, PCM, PWM, SDIO, SPI, UART, USART
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| SIWG917Y121MGABAR |
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Hersteller: Silicon Labs
Description: SIWG917Y SOC MODULE WI-FI 6 2.4
Packaging: Tape & Box (TB)
Package / Case: 71-SMD Module
Sensitivity: -95dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 8MB Flash, 2MB PSRAM
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.71V ~ 1.98V, 2.97V ~ 3.63V
Power - Output: 17.5dBm
Data Rate: 54Mbps
Protocol: 802.11b/g/n/ax, Bluetooth v5.4
Current - Receiving: 11mA ~ 55mA
Current - Transmitting: 11mA ~ 231mA
Antenna Type: Integrated, Chip
Utilized IC / Part: SiWG917M
Modulation: CCK, DSSS, OFDM
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: ADC, GPIO, I2C, I2S, ISP, JTAG, PCM, PWM, SDIO, SPI, UART, USART
Description: SIWG917Y SOC MODULE WI-FI 6 2.4
Packaging: Tape & Box (TB)
Package / Case: 71-SMD Module
Sensitivity: -95dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 8MB Flash, 2MB PSRAM
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.71V ~ 1.98V, 2.97V ~ 3.63V
Power - Output: 17.5dBm
Data Rate: 54Mbps
Protocol: 802.11b/g/n/ax, Bluetooth v5.4
Current - Receiving: 11mA ~ 55mA
Current - Transmitting: 11mA ~ 231mA
Antenna Type: Integrated, Chip
Utilized IC / Part: SiWG917M
Modulation: CCK, DSSS, OFDM
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: ADC, GPIO, I2C, I2S, ISP, JTAG, PCM, PWM, SDIO, SPI, UART, USART
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| EFM32PG26B101F512IL136-BR |
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Hersteller: Silicon Labs
Description: PG26 512K FLASH 128K RAM BGA136
Packaging: Tape & Reel (TR)
Package / Case: 136-VFBGA
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33F
Data Converters: A/D 4x16b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.8V
Connectivity: I2C, IrDA, SmartCard, SPI, UART/USART
Peripherals: Crypto - AES, DMA, I2S, Keypad, LCD, POR. PWM, SHA, Temp Sensor, TRNG, WDT
Supplier Device Package: 136-BGA (7x7)
Number of I/O: 64
Description: PG26 512K FLASH 128K RAM BGA136
Packaging: Tape & Reel (TR)
Package / Case: 136-VFBGA
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33F
Data Converters: A/D 4x16b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.8V
Connectivity: I2C, IrDA, SmartCard, SPI, UART/USART
Peripherals: Crypto - AES, DMA, I2S, Keypad, LCD, POR. PWM, SHA, Temp Sensor, TRNG, WDT
Supplier Device Package: 136-BGA (7x7)
Number of I/O: 64
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| EFM32PG26B101F512IL136-B |
![]() |
Hersteller: Silicon Labs
Description: PG26 512K FLASH 128K RAM BGA136
Packaging: Tray
Package / Case: 136-VFBGA
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33F
Data Converters: A/D 4x16b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.8V
Connectivity: I2C, IrDA, SmartCard, SPI, UART/USART
Peripherals: Crypto - AES, DMA, I2S, Keypad, LCD, POR. PWM, SHA, Temp Sensor, TRNG, WDT
Supplier Device Package: 136-BGA (7x7)
Number of I/O: 64
Description: PG26 512K FLASH 128K RAM BGA136
Packaging: Tray
Package / Case: 136-VFBGA
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33F
Data Converters: A/D 4x16b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.8V
Connectivity: I2C, IrDA, SmartCard, SPI, UART/USART
Peripherals: Crypto - AES, DMA, I2S, Keypad, LCD, POR. PWM, SHA, Temp Sensor, TRNG, WDT
Supplier Device Package: 136-BGA (7x7)
Number of I/O: 64
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| EFM32PG26B301F1024IL136-BR |
![]() |
Hersteller: Silicon Labs
Description: PG26 1024K FLASH 256K RAM BGA136
Packaging: Tape & Reel (TR)
Package / Case: 136-VFBGA
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33F
Data Converters: A/D 4x16b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.8V
Connectivity: I2C, IrDA, SmartCard, SPI, UART/USART
Peripherals: Crypto - AES, DMA, I2S, Keypad, LCD, POR. PWM, SHA, Temp Sensor, TRNG, WDT
Supplier Device Package: 136-BGA (7x7)
Number of I/O: 64
Description: PG26 1024K FLASH 256K RAM BGA136
Packaging: Tape & Reel (TR)
Package / Case: 136-VFBGA
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33F
Data Converters: A/D 4x16b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.8V
Connectivity: I2C, IrDA, SmartCard, SPI, UART/USART
Peripherals: Crypto - AES, DMA, I2S, Keypad, LCD, POR. PWM, SHA, Temp Sensor, TRNG, WDT
Supplier Device Package: 136-BGA (7x7)
Number of I/O: 64
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| EFM32PG26B301F1024IL136-B |
![]() |
Hersteller: Silicon Labs
Description: PG26 1024K FLASH 256K RAM BGA136
Packaging: Tray
Package / Case: 136-VFBGA
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33F
Data Converters: A/D 4x16b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.8V
Connectivity: I2C, IrDA, SmartCard, SPI, UART/USART
Peripherals: Crypto - AES, DMA, I2S, Keypad, LCD, POR. PWM, SHA, Temp Sensor, TRNG, WDT
Supplier Device Package: 136-BGA (7x7)
Number of I/O: 64
Description: PG26 1024K FLASH 256K RAM BGA136
Packaging: Tray
Package / Case: 136-VFBGA
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33F
Data Converters: A/D 4x16b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.8V
Connectivity: I2C, IrDA, SmartCard, SPI, UART/USART
Peripherals: Crypto - AES, DMA, I2S, Keypad, LCD, POR. PWM, SHA, Temp Sensor, TRNG, WDT
Supplier Device Package: 136-BGA (7x7)
Number of I/O: 64
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| EFR32BG26B311F1024IL136-BR |
![]() |
Hersteller: Silicon Labs
Description: BG26 1024K FLASH 256K RAM BGA136
Packaging: Tape & Reel (TR)
Package / Case: 136-BGA
Sensitivity: -105.9dBm
Mounting Type: Surface Mount
Memory Size: 1MB Flash, 256kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.71V ~ 3.8V
Power - Output: 10dBm
Protocol: Bluetooth v5.3
Current - Receiving: 5.4mA
Data Rate (Max): 2Mbps
Current - Transmitting: 5.9mA ~ 152.7mA
Supplier Device Package: 136-BGA (7x7)
GPIO: 64
Modulation: 2FSK, 2GFSK, DSSS, GMSK, MSK, O-QPSK
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: ADC, GPIO, I2C, I2S, IrDA, JTAG, PWM, SPI, UART, USART
Description: BG26 1024K FLASH 256K RAM BGA136
Packaging: Tape & Reel (TR)
Package / Case: 136-BGA
Sensitivity: -105.9dBm
Mounting Type: Surface Mount
Memory Size: 1MB Flash, 256kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.71V ~ 3.8V
Power - Output: 10dBm
Protocol: Bluetooth v5.3
Current - Receiving: 5.4mA
Data Rate (Max): 2Mbps
Current - Transmitting: 5.9mA ~ 152.7mA
Supplier Device Package: 136-BGA (7x7)
GPIO: 64
Modulation: 2FSK, 2GFSK, DSSS, GMSK, MSK, O-QPSK
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: ADC, GPIO, I2C, I2S, IrDA, JTAG, PWM, SPI, UART, USART
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| EFR32BG26B311F1024IL136-B |
![]() |
Hersteller: Silicon Labs
Description: BG26 1024K FLASH 256K RAM BGA136
Packaging: Tray
Package / Case: 136-BGA
Sensitivity: -105.9dBm
Mounting Type: Surface Mount
Memory Size: 1MB Flash, 256kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.71V ~ 3.8V
Power - Output: 10dBm
Protocol: Bluetooth v5.3
Current - Receiving: 5.4mA
Data Rate (Max): 2Mbps
Current - Transmitting: 5.9mA ~ 152.7mA
Supplier Device Package: 136-BGA (7x7)
GPIO: 64
Modulation: 2FSK, 2GFSK, DSSS, GMSK, MSK, O-QPSK
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: ADC, GPIO, I2C, I2S, IrDA, JTAG, PWM, SPI, UART, USART
Description: BG26 1024K FLASH 256K RAM BGA136
Packaging: Tray
Package / Case: 136-BGA
Sensitivity: -105.9dBm
Mounting Type: Surface Mount
Memory Size: 1MB Flash, 256kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.71V ~ 3.8V
Power - Output: 10dBm
Protocol: Bluetooth v5.3
Current - Receiving: 5.4mA
Data Rate (Max): 2Mbps
Current - Transmitting: 5.9mA ~ 152.7mA
Supplier Device Package: 136-BGA (7x7)
GPIO: 64
Modulation: 2FSK, 2GFSK, DSSS, GMSK, MSK, O-QPSK
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: ADC, GPIO, I2C, I2S, IrDA, JTAG, PWM, SPI, UART, USART
Produkt ist nicht verfügbar
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| EFM32PG26B301F2048IL136-BR |
![]() |
Hersteller: Silicon Labs
Description: PG26 2048K FLASH 256K RAM BGA136
Packaging: Tape & Reel (TR)
Package / Case: 136-VFBGA
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33F
Data Converters: A/D 4x16b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.8V
Connectivity: I2C, IrDA, SmartCard, SPI, UART/USART
Peripherals: Crypto - AES, DMA, I2S, Keypad, LCD, POR. PWM, SHA, Temp Sensor, TRNG, WDT
Supplier Device Package: 136-BGA (7x7)
Number of I/O: 64
Description: PG26 2048K FLASH 256K RAM BGA136
Packaging: Tape & Reel (TR)
Package / Case: 136-VFBGA
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33F
Data Converters: A/D 4x16b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.8V
Connectivity: I2C, IrDA, SmartCard, SPI, UART/USART
Peripherals: Crypto - AES, DMA, I2S, Keypad, LCD, POR. PWM, SHA, Temp Sensor, TRNG, WDT
Supplier Device Package: 136-BGA (7x7)
Number of I/O: 64
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| EFM32PG26B301F2048IL136-B |
![]() |
Hersteller: Silicon Labs
Description: PG26 2048K FLASH 256K RAM BGA136
Packaging: Tray
Package / Case: 136-VFBGA
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33F
Data Converters: A/D 4x16b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.8V
Connectivity: I2C, IrDA, SmartCard, SPI, UART/USART
Peripherals: Crypto - AES, DMA, I2S, Keypad, LCD, POR. PWM, SHA, Temp Sensor, TRNG, WDT
Supplier Device Package: 136-BGA (7x7)
Number of I/O: 64
Description: PG26 2048K FLASH 256K RAM BGA136
Packaging: Tray
Package / Case: 136-VFBGA
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33F
Data Converters: A/D 4x16b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.8V
Connectivity: I2C, IrDA, SmartCard, SPI, UART/USART
Peripherals: Crypto - AES, DMA, I2S, Keypad, LCD, POR. PWM, SHA, Temp Sensor, TRNG, WDT
Supplier Device Package: 136-BGA (7x7)
Number of I/O: 64
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| EFR32BG26B311F2048IL136-BR |
![]() |
Hersteller: Silicon Labs
Description: BG26 2048K FLASH 256K RAM BGA136
Packaging: Tape & Reel (TR)
Package / Case: 136-BGA
Sensitivity: -105.9dBm
Mounting Type: Surface Mount
Memory Size: 2MB Flash, 256kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.71V ~ 3.8V
Power - Output: 10dBm
Protocol: Bluetooth v5.3
Current - Receiving: 5.4mA
Data Rate (Max): 2Mbps
Current - Transmitting: 5.9mA ~ 152.7mA
Supplier Device Package: 136-BGA (7x7)
GPIO: 64
Modulation: 2FSK, 2GFSK, DSSS, GMSK, MSK, O-QPSK
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: ADC, GPIO, I2C, I2S, IrDA, JTAG, PWM, SPI, UART, USART
Description: BG26 2048K FLASH 256K RAM BGA136
Packaging: Tape & Reel (TR)
Package / Case: 136-BGA
Sensitivity: -105.9dBm
Mounting Type: Surface Mount
Memory Size: 2MB Flash, 256kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.71V ~ 3.8V
Power - Output: 10dBm
Protocol: Bluetooth v5.3
Current - Receiving: 5.4mA
Data Rate (Max): 2Mbps
Current - Transmitting: 5.9mA ~ 152.7mA
Supplier Device Package: 136-BGA (7x7)
GPIO: 64
Modulation: 2FSK, 2GFSK, DSSS, GMSK, MSK, O-QPSK
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: ADC, GPIO, I2C, I2S, IrDA, JTAG, PWM, SPI, UART, USART
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| EFR32BG26B311F2048IL136-B |
![]() |
Hersteller: Silicon Labs
Description: BG26 2048K FLASH 256K RAM BGA136
Packaging: Tray
Package / Case: 136-BGA
Sensitivity: -105.9dBm
Mounting Type: Surface Mount
Memory Size: 2MB Flash, 256kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.71V ~ 3.8V
Power - Output: 10dBm
Protocol: Bluetooth v5.3
Current - Receiving: 5.4mA
Data Rate (Max): 2Mbps
Current - Transmitting: 5.9mA ~ 152.7mA
Supplier Device Package: 136-BGA (7x7)
GPIO: 64
Modulation: 2FSK, 2GFSK, DSSS, GMSK, MSK, O-QPSK
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: ADC, GPIO, I2C, I2S, IrDA, JTAG, PWM, SPI, UART, USART
Description: BG26 2048K FLASH 256K RAM BGA136
Packaging: Tray
Package / Case: 136-BGA
Sensitivity: -105.9dBm
Mounting Type: Surface Mount
Memory Size: 2MB Flash, 256kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.71V ~ 3.8V
Power - Output: 10dBm
Protocol: Bluetooth v5.3
Current - Receiving: 5.4mA
Data Rate (Max): 2Mbps
Current - Transmitting: 5.9mA ~ 152.7mA
Supplier Device Package: 136-BGA (7x7)
GPIO: 64
Modulation: 2FSK, 2GFSK, DSSS, GMSK, MSK, O-QPSK
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: ADC, GPIO, I2C, I2S, IrDA, JTAG, PWM, SPI, UART, USART
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| EFM32PG26B501F3200IL136-BR |
![]() |
Hersteller: Silicon Labs
Description: PG26 3200K FLASH 512K RAM BGA136
Packaging: Tape & Reel (TR)
Package / Case: 136-VFBGA
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 3.125MB (3.125M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33F
Data Converters: A/D 4x16b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.8V
Connectivity: I2C, IrDA, SmartCard, SPI, UART/USART
Peripherals: Crypto - AES, DMA, I2S, Keypad, LCD, POR. PWM, SHA, Temp Sensor, TRNG, WDT
Supplier Device Package: 136-BGA (7x7)
Number of I/O: 64
Description: PG26 3200K FLASH 512K RAM BGA136
Packaging: Tape & Reel (TR)
Package / Case: 136-VFBGA
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 3.125MB (3.125M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33F
Data Converters: A/D 4x16b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.8V
Connectivity: I2C, IrDA, SmartCard, SPI, UART/USART
Peripherals: Crypto - AES, DMA, I2S, Keypad, LCD, POR. PWM, SHA, Temp Sensor, TRNG, WDT
Supplier Device Package: 136-BGA (7x7)
Number of I/O: 64
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| EFM32PG26B501F3200IL136-B |
![]() |
Hersteller: Silicon Labs
Description: PG26 3200K FLASH 512K RAM BGA136
Packaging: Tray
Package / Case: 136-VFBGA
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 3.125MB (3.125M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33F
Data Converters: A/D 4x16b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.8V
Connectivity: I2C, IrDA, SmartCard, SPI, UART/USART
Peripherals: Crypto - AES, DMA, I2S, Keypad, LCD, POR. PWM, SHA, Temp Sensor, TRNG, WDT
Supplier Device Package: 136-BGA (7x7)
Number of I/O: 64
Description: PG26 3200K FLASH 512K RAM BGA136
Packaging: Tray
Package / Case: 136-VFBGA
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 3.125MB (3.125M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33F
Data Converters: A/D 4x16b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.8V
Connectivity: I2C, IrDA, SmartCard, SPI, UART/USART
Peripherals: Crypto - AES, DMA, I2S, Keypad, LCD, POR. PWM, SHA, Temp Sensor, TRNG, WDT
Supplier Device Package: 136-BGA (7x7)
Number of I/O: 64
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| EFR32MG26B311F3200IL136-BR |
![]() |
Hersteller: Silicon Labs
Description: MG26 3200K FLASH 256K RAM BGA136
Packaging: Tape & Reel (TR)
Package / Case: 136-VFBGA
Sensitivity: -105.9dBm
Mounting Type: Surface Mount
Memory Size: 3.125MB Flash, 256kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.71V ~ 3.8V
Power - Output: 10dBm
Protocol: Bluetooth v5.3, Zigbee®
Current - Receiving: 5.4mA ~ 6.2mA
Data Rate (Max): 2Mbps
Current - Transmitting: 5.9mA ~ 152.7mA
Supplier Device Package: 136-BGA (7x7)
GPIO: 64
Modulation: 2FSK, 2GFSK, DSSS, GMSK, MSK, O-QPSK
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: ADC, GPIO, I2C, I2S, IrDA, JTAG, PWM, SPI, UART, USART
Description: MG26 3200K FLASH 256K RAM BGA136
Packaging: Tape & Reel (TR)
Package / Case: 136-VFBGA
Sensitivity: -105.9dBm
Mounting Type: Surface Mount
Memory Size: 3.125MB Flash, 256kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.71V ~ 3.8V
Power - Output: 10dBm
Protocol: Bluetooth v5.3, Zigbee®
Current - Receiving: 5.4mA ~ 6.2mA
Data Rate (Max): 2Mbps
Current - Transmitting: 5.9mA ~ 152.7mA
Supplier Device Package: 136-BGA (7x7)
GPIO: 64
Modulation: 2FSK, 2GFSK, DSSS, GMSK, MSK, O-QPSK
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: ADC, GPIO, I2C, I2S, IrDA, JTAG, PWM, SPI, UART, USART
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| EFR32BG26B511F3200IL136-BR |
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Hersteller: Silicon Labs
Description: BG26 3200K FLASH 512K RAM BGA136
Packaging: Tape & Reel (TR)
Package / Case: 136-BGA
Sensitivity: -105.9dBm
Mounting Type: Surface Mount
Memory Size: 3.125MB Flash, 512kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.71V ~ 3.8V
Power - Output: 10dBm
Protocol: Bluetooth v5.3
Current - Receiving: 5.4mA
Data Rate (Max): 2Mbps
Current - Transmitting: 5.9mA ~ 152.7mA
Supplier Device Package: 136-BGA (7x7)
GPIO: 64
Modulation: 2FSK, 2GFSK, DSSS, GMSK, MSK, O-QPSK
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: ADC, GPIO, I2C, I2S, IrDA, JTAG, PWM, SPI, UART, USART
Description: BG26 3200K FLASH 512K RAM BGA136
Packaging: Tape & Reel (TR)
Package / Case: 136-BGA
Sensitivity: -105.9dBm
Mounting Type: Surface Mount
Memory Size: 3.125MB Flash, 512kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.71V ~ 3.8V
Power - Output: 10dBm
Protocol: Bluetooth v5.3
Current - Receiving: 5.4mA
Data Rate (Max): 2Mbps
Current - Transmitting: 5.9mA ~ 152.7mA
Supplier Device Package: 136-BGA (7x7)
GPIO: 64
Modulation: 2FSK, 2GFSK, DSSS, GMSK, MSK, O-QPSK
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: ADC, GPIO, I2C, I2S, IrDA, JTAG, PWM, SPI, UART, USART
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| EFM32PG26B500F3200IL136-BR |
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Hersteller: Silicon Labs
Description: PG26 3200K FLASH 512K RAM BGA136
Packaging: Tape & Reel (TR)
Package / Case: 136-VFBGA
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 3.125MB (3.125M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33F
Data Converters: A/D 4x16b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.8V
Connectivity: I2C, IrDA, SmartCard, SPI, UART/USART
Peripherals: Crypto - AES, DMA, I2S, Keypad, LCD, POR. PWM, SHA, Temp Sensor, TRNG, WDT
Supplier Device Package: 136-BGA (7x7)
Number of I/O: 64
Description: PG26 3200K FLASH 512K RAM BGA136
Packaging: Tape & Reel (TR)
Package / Case: 136-VFBGA
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 3.125MB (3.125M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33F
Data Converters: A/D 4x16b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.8V
Connectivity: I2C, IrDA, SmartCard, SPI, UART/USART
Peripherals: Crypto - AES, DMA, I2S, Keypad, LCD, POR. PWM, SHA, Temp Sensor, TRNG, WDT
Supplier Device Package: 136-BGA (7x7)
Number of I/O: 64
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| EFR32BG26B511F3200IL136-B |
![]() |
Hersteller: Silicon Labs
Description: BG26 3200K FLASH 512K RAM BGA136
Packaging: Tray
Package / Case: 136-BGA
Sensitivity: -105.9dBm
Mounting Type: Surface Mount
Memory Size: 3.125MB Flash, 512kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.71V ~ 3.8V
Power - Output: 10dBm
Protocol: Bluetooth v5.3
Current - Receiving: 5.4mA
Data Rate (Max): 2Mbps
Current - Transmitting: 5.9mA ~ 152.7mA
Supplier Device Package: 136-BGA (7x7)
GPIO: 64
Modulation: 2FSK, 2GFSK, DSSS, GMSK, MSK, O-QPSK
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: ADC, GPIO, I2C, I2S, IrDA, JTAG, PWM, SPI, UART, USART
Description: BG26 3200K FLASH 512K RAM BGA136
Packaging: Tray
Package / Case: 136-BGA
Sensitivity: -105.9dBm
Mounting Type: Surface Mount
Memory Size: 3.125MB Flash, 512kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.71V ~ 3.8V
Power - Output: 10dBm
Protocol: Bluetooth v5.3
Current - Receiving: 5.4mA
Data Rate (Max): 2Mbps
Current - Transmitting: 5.9mA ~ 152.7mA
Supplier Device Package: 136-BGA (7x7)
GPIO: 64
Modulation: 2FSK, 2GFSK, DSSS, GMSK, MSK, O-QPSK
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: ADC, GPIO, I2C, I2S, IrDA, JTAG, PWM, SPI, UART, USART
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| EFR32MG26B311F3200IL136-B |
![]() |
Hersteller: Silicon Labs
Description: MG26 3200K FLASH 256K RAM BGA136
Packaging: Tray
Package / Case: 136-VFBGA
Sensitivity: -105.9dBm
Mounting Type: Surface Mount
Memory Size: 3.125MB Flash, 256kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.71V ~ 3.8V
Power - Output: 10dBm
Protocol: Bluetooth v5.3, Zigbee®
Current - Receiving: 5.4mA ~ 6.2mA
Data Rate (Max): 2Mbps
Current - Transmitting: 5.9mA ~ 152.7mA
Supplier Device Package: 136-BGA (7x7)
GPIO: 64
Modulation: 2FSK, 2GFSK, DSSS, GMSK, MSK, O-QPSK
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: ADC, GPIO, I2C, I2S, IrDA, JTAG, PWM, SPI, UART, USART
Description: MG26 3200K FLASH 256K RAM BGA136
Packaging: Tray
Package / Case: 136-VFBGA
Sensitivity: -105.9dBm
Mounting Type: Surface Mount
Memory Size: 3.125MB Flash, 256kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.71V ~ 3.8V
Power - Output: 10dBm
Protocol: Bluetooth v5.3, Zigbee®
Current - Receiving: 5.4mA ~ 6.2mA
Data Rate (Max): 2Mbps
Current - Transmitting: 5.9mA ~ 152.7mA
Supplier Device Package: 136-BGA (7x7)
GPIO: 64
Modulation: 2FSK, 2GFSK, DSSS, GMSK, MSK, O-QPSK
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: ADC, GPIO, I2C, I2S, IrDA, JTAG, PWM, SPI, UART, USART
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| EFR32BG26B510F3200IL136-BR |
![]() |
Hersteller: Silicon Labs
Description: BG26 3200K FLASH 512K RAM BGA136
Packaging: Tape & Reel (TR)
Package / Case: 136-BGA
Sensitivity: -105.9dBm
Mounting Type: Surface Mount
Memory Size: 3.125MB Flash, 512kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.71V ~ 3.8V
Power - Output: 10dBm
Protocol: Bluetooth v5.3
Current - Receiving: 5.4mA
Data Rate (Max): 2Mbps
Current - Transmitting: 5.9mA ~ 152.7mA
Supplier Device Package: 136-BGA (7x7)
GPIO: 64
Modulation: 2FSK, 2GFSK, DSSS, GMSK, MSK, O-QPSK
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: ADC, GPIO, I2C, I2S, IrDA, JTAG, PWM, SPI, UART, USART
Description: BG26 3200K FLASH 512K RAM BGA136
Packaging: Tape & Reel (TR)
Package / Case: 136-BGA
Sensitivity: -105.9dBm
Mounting Type: Surface Mount
Memory Size: 3.125MB Flash, 512kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.71V ~ 3.8V
Power - Output: 10dBm
Protocol: Bluetooth v5.3
Current - Receiving: 5.4mA
Data Rate (Max): 2Mbps
Current - Transmitting: 5.9mA ~ 152.7mA
Supplier Device Package: 136-BGA (7x7)
GPIO: 64
Modulation: 2FSK, 2GFSK, DSSS, GMSK, MSK, O-QPSK
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: ADC, GPIO, I2C, I2S, IrDA, JTAG, PWM, SPI, UART, USART
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