auf Bestellung 6 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl | Preis ohne MwSt |
---|---|
1+ | 5.76 EUR |
10+ | 5.09 EUR |
100+ | 4.79 EUR |
250+ | 4.47 EUR |
500+ | 4.4 EUR |
1000+ | 3.85 EUR |
2500+ | 3.59 EUR |
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Technische Details 04-3513-11H Aries Electronics
Description: CONN IC DIP SOCKET 4POS GOLD, Features: Closed Frame, Packaging: Bulk, Mounting Type: Through Hole, Type: DIP, 0.3" (7.62mm) Row Spacing, Operating Temperature: -55°C ~ 105°C, Number of Positions or Pins (Grid): 4 (2 x 2), Termination: Solder, Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Gold, Contact Finish Thickness - Post: 10.0µin (0.25µm), Contact Material - Post: Brass, Part Status: Active.
Weitere Produktangebote 04-3513-11H
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
---|---|---|---|---|---|
04-3513-11H | Hersteller : Aries Electronics |
Description: CONN IC DIP SOCKET 4POS GOLD Features: Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 105°C Number of Positions or Pins (Grid): 4 (2 x 2) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass Part Status: Active |
Produkt ist nicht verfügbar |