auf Bestellung 1000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl | Preis ohne MwSt |
---|---|
1+ | 11.84 EUR |
10+ | 10.7 EUR |
28+ | 9.86 EUR |
112+ | 9.38 EUR |
252+ | 8.38 EUR |
504+ | 7.88 EUR |
1008+ | 7.23 EUR |
Produktrezensionen
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Technische Details 123-93-314-41-801000 Mill-Max
Description: CONN IC DIP SOCKET 14POS GOLD, Features: Open Frame, Decoupling Capacitor, Packaging: Tube, Mounting Type: Through Hole, Type: DIP, 0.3" (7.62mm) Row Spacing, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 14 (2 x 7), Termination: Wire Wrap, Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin-Lead, Contact Finish Thickness - Post: 200.0µin (5.08µm), Contact Material - Post: Brass Alloy, Part Status: Active.
Weitere Produktangebote 123-93-314-41-801000 nach Preis ab 9.44 EUR bis 11.93 EUR
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123-93-314-41-801000 | Hersteller : Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 14POS GOLD Features: Open Frame, Decoupling Capacitor Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 14 (2 x 7) Termination: Wire Wrap Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
auf Bestellung 137 Stücke: Lieferzeit 10-14 Tag (e) |
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