200-6310-9UN-1900 3M Interconnect Solutions
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Technische Details 200-6310-9UN-1900 3M Interconnect Solutions
Description: CONN SOCKET PGA ZIF 100POS GOLD, Packaging: Bulk, Mounting Type: Through Hole, Type: PGA, ZIF (ZIP), Operating Temperature: -55°C ~ 150°C, Number of Positions or Pins (Grid): 100 (10 x 10), Termination: Solder, Housing Material: Polyethersulfone (PES), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Gold, Contact Finish Thickness - Post: 30.0µin (0.76µm), Contact Material - Post: Beryllium Copper, Part Status: Obsolete.
Weitere Produktangebote 200-6310-9UN-1900
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
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200-6310-9UN-1900 | Hersteller : 3M Interconnect Solutions | Connector Accessories Kit Straight Box |
Produkt ist nicht verfügbar |
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200-6310-9UN-1900 | Hersteller : 3M |
Description: CONN SOCKET PGA ZIF 100POS GOLD Packaging: Bulk Mounting Type: Through Hole Type: PGA, ZIF (ZIP) Operating Temperature: -55°C ~ 150°C Number of Positions or Pins (Grid): 100 (10 x 10) Termination: Solder Housing Material: Polyethersulfone (PES) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 30.0µin (0.76µm) Contact Material - Post: Beryllium Copper Part Status: Obsolete |
Produkt ist nicht verfügbar |
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200-6310-9UN-1900 | Hersteller : 3M Electronic Solutions Division | IC & Component Sockets 10X10 SKT KIT WITHOUT CONTACTS |
Produkt ist nicht verfügbar |