208-7391-55-1902 3M
Hersteller: 3M
Description: CONN SOCKET SOIC 8POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: SOIC
Operating Temperature: -55°C ~ 150°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polyethersulfone (PES), Glass Filled
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Description: CONN SOCKET SOIC 8POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: SOIC
Operating Temperature: -55°C ~ 150°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polyethersulfone (PES), Glass Filled
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 211 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl | Preis ohne MwSt |
---|---|
1+ | 59.59 EUR |
10+ | 52.19 EUR |
30+ | 49.94 EUR |
50+ | 48.33 EUR |
100+ | 46.71 EUR |
Produktrezensionen
Produktbewertung abgeben
Technische Details 208-7391-55-1902 3M
Description: CONN SOCKET SOIC 8POS GOLD, Packaging: Bulk, Features: Closed Frame, Mounting Type: Through Hole, Type: SOIC, Operating Temperature: -55°C ~ 150°C, Number of Positions or Pins (Grid): 8 (2 x 4), Termination: Solder, Housing Material: Polyethersulfone (PES), Glass Filled, Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper, Contact Finish - Post: Gold, Contact Finish Thickness - Post: 30.0µin (0.76µm), Contact Material - Post: Beryllium Copper, Part Status: Active.
Weitere Produktangebote 208-7391-55-1902 nach Preis ab 44.46 EUR bis 59.84 EUR
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt | ||||||||||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
208-7391-55-1902 | Hersteller : 3M Electronic Solutions Division | IC & Component Sockets BURN-IN SOIC SOCKET 8 Leads |
auf Bestellung 15 Stücke: Lieferzeit 10-14 Tag (e) |
|
|||||||||||||||||
208-7391-55-1902 | Hersteller : 3M |
Description: 3M - 208-7391-55-1902 - IC- & Baustein-Sockel, 8 Kontakt(e), IC-Sockel, 3.81 mm, 208-7391, 1.27 mm, Berylliumkupfer tariffCode: 85366930 productTraceability: No Kontaktüberzug: Vergoldete Kontakte Steckverbindertyp: IC-Sockel rohsCompliant: YES Rastermaß: 3.81mm Anzahl der Kontakte: 8Kontakt(e) euEccn: NLR Kontaktmaterial: Berylliumkupfer hazardous: false Reihenabstand: 1.27mm rohsPhthalatesCompliant: YES usEccn: EAR99 Produktpalette: 208-7391 SVHC: No SVHC (15-Jan-2018) |
auf Bestellung 39 Stücke: Lieferzeit 14-21 Tag (e) |
||||||||||||||||||
208-7391-55-1902 | Hersteller : 3M Interconnect Solutions | Conn SOIC Test Clip SKT 8 POS Solder ST Thru-Hole 8 Port Box |
Produkt ist nicht verfügbar |
||||||||||||||||||
208-7391-55-1902 | Hersteller : 3M Interconnect Solutions | Conn SOIC Test Clip SKT 8 POS Solder ST Thru-Hole 8 Port Box |
Produkt ist nicht verfügbar |
||||||||||||||||||
208-7391-55-1902 | Hersteller : 3M Interconnect Solutions | Conn SOIC Test Clip SKT 8 POS Solder ST Thru-Hole 8 Port Box |
Produkt ist nicht verfügbar |