210-47-308-41-001000 Mill-Max
auf Bestellung 1367 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl | Preis ohne MwSt |
---|---|
3+ | 1.23 EUR |
10+ | 0.96 EUR |
100+ | 0.83 EUR |
500+ | 0.75 EUR |
1000+ | 0.66 EUR |
2500+ | 0.58 EUR |
10000+ | 0.54 EUR |
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Technische Details 210-47-308-41-001000 Mill-Max
Description: CONN IC DIP SOCKET 8POS GOLD, Packaging: Tube, Features: Closed Frame, Mounting Type: Surface Mount, Type: DIP, 0.3" (7.62mm) Row Spacing, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 8 (2 x 4), Termination: Solder, Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: FLASH, Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin, Contact Finish Thickness - Post: 200.0µin (5.08µm), Contact Material - Post: Brass Alloy.
Weitere Produktangebote 210-47-308-41-001000 nach Preis ab 0.68 EUR bis 1.23 EUR
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210-47-308-41-001000 | Hersteller : Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 8POS GOLD Packaging: Tube Features: Closed Frame Mounting Type: Surface Mount Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 8 (2 x 4) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: FLASH Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy |
auf Bestellung 1032 Stücke: Lieferzeit 10-14 Tag (e) |
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