228-5204-01 3M
Hersteller: 3M
Description: CONN SOCKET QFN 28POS GOLD
Packaging: Bulk
Mounting Type: Through Hole
Type: QFN
Number of Positions or Pins (Grid): 28 (4 x 7)
Termination: Solder
Housing Material: Polyethersulfone (PES)
Pitch - Mating: 0.020" (0.50mm)
Contact Finish - Mating: Gold
Contact Material - Mating: Beryllium Copper
Contact Finish - Post: Gold
Contact Material - Post: Beryllium Copper
Part Status: Active
Description: CONN SOCKET QFN 28POS GOLD
Packaging: Bulk
Mounting Type: Through Hole
Type: QFN
Number of Positions or Pins (Grid): 28 (4 x 7)
Termination: Solder
Housing Material: Polyethersulfone (PES)
Pitch - Mating: 0.020" (0.50mm)
Contact Finish - Mating: Gold
Contact Material - Mating: Beryllium Copper
Contact Finish - Post: Gold
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 5 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl | Preis ohne MwSt |
---|---|
1+ | 182.41 EUR |
Produktrezensionen
Produktbewertung abgeben
Technische Details 228-5204-01 3M
Description: CONN SOCKET QFN 28POS GOLD, Packaging: Bulk, Mounting Type: Through Hole, Type: QFN, Number of Positions or Pins (Grid): 28 (4 x 7), Termination: Solder, Housing Material: Polyethersulfone (PES), Pitch - Mating: 0.020" (0.50mm), Contact Finish - Mating: Gold, Contact Material - Mating: Beryllium Copper, Contact Finish - Post: Gold, Contact Material - Post: Beryllium Copper, Part Status: Active.
Weitere Produktangebote 228-5204-01
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Verfügbarkeit |
Preis ohne MwSt |
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228-5204-01 | Hersteller : 3M Interconnect Solutions | Conn QFN Socket SKT 28 POS Solder ST Thru-Hole Box |
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228-5204-01 | Hersteller : 3M Interconnect Solutions | Conn QFN Socket SKT 28 POS Solder ST Thru-Hole Box |
Produkt ist nicht verfügbar |
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228-5204-01 | Hersteller : 3M Electronic Solutions Division | IC & Component Sockets Textool QFN .5MM,28P ODD ROW, W/THRML PIN |
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