25-0503-30 Aries Electronics
Hersteller: Aries Electronics
Description: CONN SOCKET SIP 25POS GOLD
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 25 (1 x 25)
Termination: Wire Wrap
Housing Material: Polyamide (PA), Nylon, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
Description: CONN SOCKET SIP 25POS GOLD
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 25 (1 x 25)
Termination: Wire Wrap
Housing Material: Polyamide (PA), Nylon, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
auf Bestellung 103 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl | Preis ohne MwSt |
---|---|
1+ | 22.49 EUR |
10+ | 19.94 EUR |
100+ | 17.38 EUR |
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Technische Details 25-0503-30 Aries Electronics
Description: CONN SOCKET SIP 25POS GOLD, Packaging: Bulk, Mounting Type: Through Hole, Type: SIP, Number of Positions or Pins (Grid): 25 (1 x 25), Termination: Wire Wrap, Housing Material: Polyamide (PA), Nylon, Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin, Contact Finish Thickness - Post: 200.0µin (5.08µm), Contact Material - Post: Brass, Part Status: Active.
Weitere Produktangebote 25-0503-30 nach Preis ab 13.68 EUR bis 22.63 EUR
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt | ||||||||||||||||
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25-0503-30 | Hersteller : Aries Electronics | IC & Component Sockets PIN LINE COLLET SCKT WIRE WRAP 25 PINS |
auf Bestellung 40 Stücke: Lieferzeit 10-14 Tag (e) |
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25-0503-30 | Hersteller : ARIES |
Description: ARIES - 25-0503-30 - IC- & Baustein-Sockel, 25 Kontakt(e), SIP-Buchse, 2.54 mm, 0503 Series, Berylliumkupfer tariffCode: 85366930 productTraceability: No Kontaktüberzug: Vergoldete Kontakte Steckverbindertyp: SIP-Buchse rohsCompliant: YES Rastermaß: 2.54mm Anzahl der Kontakte: 25Kontakt(e) euEccn: NLR Kontaktmaterial: Berylliumkupfer hazardous: false Reihenabstand: - rohsPhthalatesCompliant: YES usEccn: EAR99 Produktpalette: 0503 Series SVHC: No SVHC |
auf Bestellung 20 Stücke: Lieferzeit 14-21 Tag (e) |