518-77-360M19-001106 Preci-Dip
Hersteller: Preci-Dip
Description: CONN SOCKET PGA 360POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Surface Mount
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 360 (19 x 19)
Termination: Solder
Housing Material: FR4 Epoxy Glass
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: FLASH
Contact Material - Post: Brass
Description: CONN SOCKET PGA 360POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Surface Mount
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 360 (19 x 19)
Termination: Solder
Housing Material: FR4 Epoxy Glass
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: FLASH
Contact Material - Post: Brass
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Technische Details 518-77-360M19-001106 Preci-Dip
Description: CONN SOCKET PGA 360POS GOLD, Packaging: Bulk, Features: Open Frame, Mounting Type: Surface Mount, Type: PGA, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 360 (19 x 19), Termination: Solder, Housing Material: FR4 Epoxy Glass, Pitch - Mating: 0.050" (1.27mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: FLASH, Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.050" (1.27mm), Contact Finish - Post: Gold, Contact Finish Thickness - Post: FLASH, Contact Material - Post: Brass.
Weitere Produktangebote 518-77-360M19-001106
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
---|---|---|---|---|---|
518-77-360M19-001106 | Hersteller : Preci-dip | IC & Component Sockets |
Produkt ist nicht verfügbar |