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518-77-360M19-001106 Preci-Dip


Default.aspx?c=12&i=1314&p=289&pdf=1&dsku=518-77-NNNMXX-XXX106 Hersteller: Preci-Dip
Description: CONN SOCKET PGA 360POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Surface Mount
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 360 (19 x 19)
Termination: Solder
Housing Material: FR4 Epoxy Glass
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: FLASH
Contact Material - Post: Brass
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Technische Details 518-77-360M19-001106 Preci-Dip

Description: CONN SOCKET PGA 360POS GOLD, Packaging: Bulk, Features: Open Frame, Mounting Type: Surface Mount, Type: PGA, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 360 (19 x 19), Termination: Solder, Housing Material: FR4 Epoxy Glass, Pitch - Mating: 0.050" (1.27mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: FLASH, Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.050" (1.27mm), Contact Finish - Post: Gold, Contact Finish Thickness - Post: FLASH, Contact Material - Post: Brass.

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518-77-360M19-001106 Hersteller : Preci-dip Preci_Dip_01252017_cat_144-1214585.pdf IC & Component Sockets
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