auf Bestellung 187 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 41.31 EUR |
| 10+ | 37.42 EUR |
| 20+ | 37.07 EUR |
| 50+ | 35.34 EUR |
| 100+ | 32.26 EUR |
| 200+ | 32.16 EUR |
| 500+ | 31.93 EUR |
Produktrezensionen
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Technische Details 8080-1G1-LF TE Connectivity
Description: CONN TRANSIST TO-3 3POS TIN, Features: Closed Frame, Packaging: Bulk, Mounting Type: Chassis Mount, Type: Transistor, TO-3, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 3 (Oval), Termination: Solder, Housing Material: Polytetrafluoroethylene (PTFE), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 200.0µin (5.08µm), Contact Material - Mating: Beryllium Copper, Contact Finish - Post: Tin, Contact Finish Thickness - Post: 200.0µin (5.08µm), Contact Material - Post: Beryllium Copper, Part Status: Active.
Weitere Produktangebote 8080-1G1-LF nach Preis ab 30.46 EUR bis 43.28 EUR
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8080-1G1-LF | Hersteller : TE Connectivity AMP Connectors |
 Description: CONN TRANSIST TO-3 3POS TINFeatures: Closed Frame Packaging: Bulk Mounting Type: Chassis Mount Type: Transistor, TO-3 Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 3 (Oval) Termination: Solder Housing Material: Polytetrafluoroethylene (PTFE) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 200.0µin (5.08µm) Contact Material - Mating: Beryllium Copper Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Beryllium Copper Part Status: Active |
auf Bestellung 378 Stücke: Lieferzeit 10-14 Tag (e) |
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