AF500-204005 CUI Devices
Hersteller: CUI Devices
Description: THERM PAD 20MMX40MM 1 SHT=100PC
Packaging: Sheet
Color: White
Material: Non-Silicone
Shape: Rectangular
Thickness: 0.0197" (0.500mm)
Type: Pad, Sheet
Outline: 20.00mm x 40.00mm
Thermal Conductivity: 3.0W/m-K
Adhesive: Tacky - Both Sides
Description: THERM PAD 20MMX40MM 1 SHT=100PC
Packaging: Sheet
Color: White
Material: Non-Silicone
Shape: Rectangular
Thickness: 0.0197" (0.500mm)
Type: Pad, Sheet
Outline: 20.00mm x 40.00mm
Thermal Conductivity: 3.0W/m-K
Adhesive: Tacky - Both Sides
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Technische Details AF500-204005 CUI Devices
Description: THERM PAD 20MMX40MM 1 SHT=100PC, Packaging: Sheet, Color: White, Material: Non-Silicone, Shape: Rectangular, Thickness: 0.0197" (0.500mm), Type: Pad, Sheet, Outline: 20.00mm x 40.00mm, Thermal Conductivity: 3.0W/m-K, Adhesive: Tacky - Both Sides.
Weitere Produktangebote AF500-204005
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
---|---|---|---|---|---|
AF500-204005 | Hersteller : CUI Devices | Thermal Interface Products Thermal interface material, AF500, non-silicone- based, 20x40x0.5 mm |
Produkt ist nicht verfügbar |