APF6-060-03.5-L-04-2-A-TR Samtec Inc.
Hersteller: Samtec Inc.Description: CONN 0.635MM SKT 240POS SMD
Packaging: Tape & Reel (TR)
Features: Board Guide
Connector Type: High Density Array, Female
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 240
Pitch: 0.025" (0.64mm)
Height Above Board: 0.144" (3.66mm)
Contact Finish Thickness: 10.0µin (0.25µm)
Mated Stacking Heights: 5mm, 10mm
Number of Rows: 4
auf Bestellung 500 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis ohne MwSt |
|---|---|
| 500+ | 31.28 EUR |
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Technische Details APF6-060-03.5-L-04-2-A-TR Samtec Inc.
Description: CONN 0.635MM SKT 240POS SMD, Packaging: Tape & Reel (TR), Features: Board Guide, Connector Type: High Density Array, Female, Contact Finish: Gold, Mounting Type: Surface Mount, Number of Positions: 240, Pitch: 0.025" (0.64mm), Height Above Board: 0.144" (3.66mm), Contact Finish Thickness: 10.0µin (0.25µm), Mated Stacking Heights: 5mm, 10mm, Number of Rows: 4.
Weitere Produktangebote APF6-060-03.5-L-04-2-A-TR nach Preis ab 28.14 EUR bis 48.33 EUR
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APF6-060-03.5-L-04-2-A-TR | Hersteller : Samtec |
Board to Board & Mezzanine Connectors 0.635 mm Pitch AcceleRate HP High-Performance Array Socket |
auf Bestellung 842 Stücke: Lieferzeit 10-14 Tag (e) |
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APF6-060-03.5-L-04-2-A-TR | Hersteller : Samtec Inc. |
Description: CONN 0.635MM SKT 240POS SMD Packaging: Cut Tape (CT) Features: Board Guide Connector Type: High Density Array, Female Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 240 Pitch: 0.025" (0.64mm) Height Above Board: 0.144" (3.66mm) Contact Finish Thickness: 10.0µin (0.25µm) Mated Stacking Heights: 5mm, 10mm Number of Rows: 4 |
auf Bestellung 500 Stücke: Lieferzeit 10-14 Tag (e) |