APF6-100-03.5-S-04-2-A-TR Samtec Inc.
Hersteller: Samtec Inc.Description: 0.635 MM PITCH ACCELERATE HP HIG
Packaging: Bulk
Features: Board Guide
Connector Type: High Density Array, Female
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 400
Pitch: 0.025" (0.64mm)
Height Above Board: 0.144" (3.66mm)
Contact Finish Thickness: 30.0µin (0.76µm)
Mated Stacking Heights: 5mm, 10mm
Number of Rows: 4
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Technische Details APF6-100-03.5-S-04-2-A-TR Samtec Inc.
Description: 0.635 MM PITCH ACCELERATE HP HIG, Packaging: Bulk, Features: Board Guide, Connector Type: High Density Array, Female, Contact Finish: Gold, Mounting Type: Surface Mount, Number of Positions: 400, Pitch: 0.025" (0.64mm), Height Above Board: 0.144" (3.66mm), Contact Finish Thickness: 30.0µin (0.76µm), Mated Stacking Heights: 5mm, 10mm, Number of Rows: 4.
Weitere Produktangebote APF6-100-03.5-S-04-2-A-TR
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APF6-100-03.5-S-04-2-A-TR | Hersteller : Samtec |
Board to Board & Mezzanine Connectors 0.635 mm Pitch AcceleRate HP High-Performance Array Socket |
Produkt ist nicht verfügbar |