BDN16-3CB/A01 CTS Thermal Management Products
Hersteller: CTS Thermal Management ProductsDescription: HEATSINK CPU W/ADHESIVE 1.61"SQ
Packaging: Tray
Material: Aluminum
Length: 1.610" (40.89mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.610" (40.89mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Thermal Tape, Adhesive (Included)
Thermal Resistance @ Forced Air Flow: 4.50°C/W @ 400 LFM
Thermal Resistance @ Natural: 13.50°C/W
Fin Height: 0.355" (9.02mm)
Material Finish: Black Anodized
Part Status: Active
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Technische Details BDN16-3CB/A01 CTS Thermal Management Products
Description: HEATSINK CPU W/ADHESIVE 1.61"SQ, Packaging: Tray, Material: Aluminum, Length: 1.610" (40.89mm), Shape: Square, Pin Fins, Type: Top Mount, Width: 1.610" (40.89mm), Package Cooled: Assorted (BGA, LGA, CPU, ASIC...), Attachment Method: Thermal Tape, Adhesive (Included), Thermal Resistance @ Forced Air Flow: 4.50°C/W @ 400 LFM, Thermal Resistance @ Natural: 13.50°C/W, Fin Height: 0.355" (9.02mm), Material Finish: Black Anodized, Part Status: Active.
Weitere Produktangebote BDN16-3CB/A01
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
|---|---|---|---|---|---|
| BDN163CBA01 | Hersteller : CTS Electronic Components |
Heat Sinks IERC Heat Sink 1.61x1.61x0.355 |
Produkt ist nicht verfügbar |