BM23FR0.6-24DP-0.35V(51) Hirose Electric Co Ltd
Hersteller: Hirose Electric Co Ltd
Description: CONN HDR 24POS SMD GOLD
Packaging: Cut Tape (CT)
Features: Solder Retention
Connector Type: Header, Outer Shroud Contacts
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 24
Pitch: 0.014" (0.35mm)
Height Above Board: 0.020" (0.50mm)
Contact Finish Thickness: 1.97µin (0.050µm)
Mated Stacking Heights: 0.6mm
Number of Rows: 2
Description: CONN HDR 24POS SMD GOLD
Packaging: Cut Tape (CT)
Features: Solder Retention
Connector Type: Header, Outer Shroud Contacts
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 24
Pitch: 0.014" (0.35mm)
Height Above Board: 0.020" (0.50mm)
Contact Finish Thickness: 1.97µin (0.050µm)
Mated Stacking Heights: 0.6mm
Number of Rows: 2
auf Bestellung 9990 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl | Preis ohne MwSt |
---|---|
13+ | 1.41 EUR |
15+ | 1.19 EUR |
25+ | 1.14 EUR |
50+ | 1.12 EUR |
100+ | 1.07 EUR |
250+ | 0.97 EUR |
500+ | 0.88 EUR |
1000+ | 0.78 EUR |
2500+ | 0.7 EUR |
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Produktbewertung abgeben
Technische Details BM23FR0.6-24DP-0.35V(51) Hirose Electric Co Ltd
Description: CONN HDR 24POS SMD GOLD, Packaging: Tape & Reel (TR), Features: Solder Retention, Connector Type: Header, Outer Shroud Contacts, Contact Finish: Gold, Mounting Type: Surface Mount, Number of Positions: 24, Pitch: 0.014" (0.35mm), Height Above Board: 0.020" (0.50mm), Contact Finish Thickness: 1.97µin (0.050µm), Mated Stacking Heights: 0.6mm, Number of Rows: 2.
Weitere Produktangebote BM23FR0.6-24DP-0.35V(51)
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
---|---|---|---|---|---|
BM23FR0.6-24DP-0.35V(51) | Hersteller : HIROSE | BM23FR0624DP035V51 Other Hirose Connectors |
Produkt ist nicht verfügbar |
||
BM23FR0.6-24DP-0.35V(51) | Hersteller : Hirose Electric Co Ltd |
Description: CONN HDR 24POS SMD GOLD Packaging: Tape & Reel (TR) Features: Solder Retention Connector Type: Header, Outer Shroud Contacts Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 24 Pitch: 0.014" (0.35mm) Height Above Board: 0.020" (0.50mm) Contact Finish Thickness: 1.97µin (0.050µm) Mated Stacking Heights: 0.6mm Number of Rows: 2 |
Produkt ist nicht verfügbar |
||
BM23FR0.6-24DP-0.35V(51) | Hersteller : Hirose Connector | Board to Board & Mezzanine Connectors |
Produkt ist nicht verfügbar |