BSW-113-04-S-D Samtec
auf Bestellung 13 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl | Preis ohne MwSt |
---|---|
1+ | 13.41 EUR |
10+ | 12.85 EUR |
100+ | 10.61 EUR |
500+ | 8.94 EUR |
1000+ | 7.83 EUR |
2500+ | 7.43 EUR |
5000+ | 7.27 EUR |
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Technische Details BSW-113-04-S-D Samtec
Description: CONN RCPT 26POS 0.1 GOLD PCB, Packaging: Bulk, Connector Type: Receptacle, Breakaway, Mounting Type: Through Hole, Bottom Mount, Number of Positions: 26, Style: Board to Board, Operating Temperature: -55°C ~ 125°C, Contact Type: Female Socket, Fastening Type: Push-Pull, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Insulation Color: Black, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Finish - Post: Tin, Part Status: Active, Contact Length - Post: 0.165" (4.19mm), Insulation Height: 0.350" (8.89mm), Row Spacing - Mating: 0.100" (2.54mm), Number of Rows: 2.
Weitere Produktangebote BSW-113-04-S-D nach Preis ab 9.02 EUR bis 13.52 EUR
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BSW-113-04-S-D | Hersteller : Samtec Inc. |
Description: CONN RCPT 26POS 0.1 GOLD PCB Packaging: Bulk Connector Type: Receptacle, Breakaway Mounting Type: Through Hole, Bottom Mount Number of Positions: 26 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Post: Tin Part Status: Active Contact Length - Post: 0.165" (4.19mm) Insulation Height: 0.350" (8.89mm) Row Spacing - Mating: 0.100" (2.54mm) Number of Rows: 2 |
auf Bestellung 602 Stücke: Lieferzeit 10-14 Tag (e) |
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