Produkte > TDK CORPORATION > CGB4B3X6S0J225M055AB
CGB4B3X6S0J225M055AB

CGB4B3X6S0J225M055AB TDK Corporation


mlccspec_commercial_lowprofile_en.pdf Hersteller: TDK Corporation
Description: CAP CER 2.2UF 6.3V X6S 0805
Tolerance: ±20%
Features: Low Profile
Packaging: Tape & Reel (TR)
Voltage - Rated: 6.3V
Package / Case: 0805 (2012 Metric)
Temperature Coefficient: X6S
Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
Mounting Type: Surface Mount, MLCC
Operating Temperature: -55°C ~ 105°C
Applications: General Purpose
Thickness (Max): 0.022" (0.55mm)
Capacitance: 2.2 µF
Produkt ist nicht verfügbar

Produktrezensionen
Produktbewertung abgeben

Technische Details CGB4B3X6S0J225M055AB TDK Corporation

Description: CAP CER 2.2UF 6.3V X6S 0805, Tolerance: ±20%, Features: Low Profile, Packaging: Tape & Reel (TR), Voltage - Rated: 6.3V, Package / Case: 0805 (2012 Metric), Temperature Coefficient: X6S, Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm), Mounting Type: Surface Mount, MLCC, Operating Temperature: -55°C ~ 105°C, Applications: General Purpose, Thickness (Max): 0.022" (0.55mm), Capacitance: 2.2 µF.

Weitere Produktangebote CGB4B3X6S0J225M055AB

Foto Bezeichnung Hersteller Beschreibung Verfügbarkeit
Preis ohne MwSt
CGB4B3X6S0J225M055AB CGB4B3X6S0J225M055AB Hersteller : TDK Corporation mlccspec_commercial_lowprofile_en.pdf Description: CAP CER 2.2UF 6.3V X6S 0805
Packaging: Cut Tape (CT)
Tolerance: ±20%
Features: Low Profile
Voltage - Rated: 6.3V
Package / Case: 0805 (2012 Metric)
Temperature Coefficient: X6S
Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
Mounting Type: Surface Mount, MLCC
Operating Temperature: -55°C ~ 105°C
Applications: General Purpose
Thickness (Max): 0.022" (0.55mm)
Capacitance: 2.2 µF
Produkt ist nicht verfügbar
CGB4B3X6S0J225M055AB CGB4B3X6S0J225M055AB Hersteller : TDK mlccspec_commercial_lowprofile_en.pdf Multilayer Ceramic Capacitors MLCC - SMD/SMT RECOMMENDED ALT 810-CGB4B3X6S0J225KB
Produkt ist nicht verfügbar