CPG-07-TH-B CUI Devices
Hersteller: CUI DevicesDescription: POGOPIN, THROUGH HOLE, 6.20MM WO
Packaging: Bag
Contact Finish: Gold
Mounting Type: Through Hole
Contact Type: Sleeve & Plunger (Pogo Pins)
Contact Finish Thickness: 20.0µin (0.51µm)
Contact Material: Brass Alloy
Mating Cycles: 10000
Maximum Working Height: 0.276" (7.00mm)
Recommended Working Height: 0.256" (6.50mm)
Minimum Working Height: 0.236" (6.00mm)
Pad Layout Dimension: Circular - 0.079" (2.00mm) (TH)
Plunger Size: 0.039" (1.00mm) Dia
Operating Force - Initial: 40gf
Operating Force - Mid Compression: 70gf
auf Bestellung 6000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis ohne MwSt |
|---|---|
| 14+ | 1.32 EUR |
| 16+ | 1.11 EUR |
| 25+ | 1.06 EUR |
| 50+ | 1.04 EUR |
| 100+ | 0.99 EUR |
| 250+ | 0.9 EUR |
| 500+ | 0.81 EUR |
| 2000+ | 0.68 EUR |
| 4000+ | 0.65 EUR |
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Technische Details CPG-07-TH-B CUI Devices
Description: POGOPIN, THROUGH HOLE, 6.20MM WO, Packaging: Bag, Contact Finish: Gold, Mounting Type: Through Hole, Contact Type: Sleeve & Plunger (Pogo Pins), Contact Finish Thickness: 20.0µin (0.51µm), Contact Material: Brass Alloy, Mating Cycles: 10000, Maximum Working Height: 0.276" (7.00mm), Recommended Working Height: 0.256" (6.50mm), Minimum Working Height: 0.236" (6.00mm), Pad Layout Dimension: Circular - 0.079" (2.00mm) (TH), Plunger Size: 0.039" (1.00mm) Dia, Operating Force - Initial: 40gf, Operating Force - Mid Compression: 70gf.
Weitere Produktangebote CPG-07-TH-B nach Preis ab 0.63 EUR bis 1.33 EUR
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CPG-07-TH-B | Hersteller : CUI Devices |
Circuit Board Hardware - PCB Pogopin, Through Hole, 6.20mm Working Height, Bulk Packaging |
auf Bestellung 6000 Stücke: Lieferzeit 10-14 Tag (e) |
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