DF9-19P-1V(32) Hirose Electric Co Ltd
Hersteller: Hirose Electric Co LtdDescription: CONN HDR 19POS SMD TIN
Packaging: Cut Tape (CT)
Features: Board Guide, Solder Retention
Connector Type: Header, Center Strip Contacts
Contact Finish: Tin
Mounting Type: Surface Mount
Number of Positions: 19
Pitch: 0.039" (1.00mm)
Height Above Board: 0.130" (3.30mm)
Contact Finish Thickness: 39.4µin (1.00µm)
Mated Stacking Heights: 4.3mm
Number of Rows: 2
auf Bestellung 945 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis ohne MwSt |
|---|---|
| 8+ | 2.38 EUR |
| 10+ | 2 EUR |
| 25+ | 1.92 EUR |
| 50+ | 1.88 EUR |
| 100+ | 1.79 EUR |
| 250+ | 1.63 EUR |
| 500+ | 1.47 EUR |
Produktrezensionen
Produktbewertung abgeben
Technische Details DF9-19P-1V(32) Hirose Electric Co Ltd
Description: CONN HDR 19POS SMD TIN, Packaging: Tape & Reel (TR), Features: Board Guide, Solder Retention, Connector Type: Header, Center Strip Contacts, Contact Finish: Tin, Mounting Type: Surface Mount, Number of Positions: 19, Pitch: 0.039" (1.00mm), Height Above Board: 0.130" (3.30mm), Contact Finish Thickness: 39.4µin (1.00µm), Mated Stacking Heights: 4.3mm, Number of Rows: 2.
Weitere Produktangebote DF9-19P-1V(32)
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
|---|---|---|---|---|---|
|
|
DF9-19P-1V(32) | Hersteller : Hirose Electric Co Ltd |
Description: CONN HDR 19POS SMD TIN Packaging: Tape & Reel (TR) Features: Board Guide, Solder Retention Connector Type: Header, Center Strip Contacts Contact Finish: Tin Mounting Type: Surface Mount Number of Positions: 19 Pitch: 0.039" (1.00mm) Height Above Board: 0.130" (3.30mm) Contact Finish Thickness: 39.4µin (1.00µm) Mated Stacking Heights: 4.3mm Number of Rows: 2 |
Produkt ist nicht verfügbar |
|
 |
DF9-19P-1V(32) | Hersteller : Hirose Connector |
Board to Board & Mezzanine Connectors 1.0MM V SMT HEADER 19P TIN PLATING |
Produkt ist nicht verfügbar |