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DF9B-13P-1V(32)

DF9B-13P-1V(32) Hirose Connector


DF9_Catalog_D31692_en-2301602.pdf Hersteller: Hirose Connector
Board to Board & Mezzanine Connectors 1.0MM V SMT HEADER 13P TIN PLT MTL FIT
auf Bestellung 2955 Stücke:

Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2+1.88 EUR
10+ 1.7 EUR
100+ 1.53 EUR
500+ 1.25 EUR
1000+ 1.04 EUR
2000+ 1.02 EUR
10000+ 0.92 EUR
Mindestbestellmenge: 2
Produktrezensionen
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Technische Details DF9B-13P-1V(32) Hirose Connector

Description: CONN HDR 13POS SMD TIN, Features: Solder Retention, Packaging: Tape & Reel (TR), Connector Type: Header, Center Strip Contacts, Contact Finish: Tin, Mounting Type: Surface Mount, Number of Positions: 13, Pitch: 0.039" (1.00mm), Height Above Board: 0.130" (3.30mm), Contact Finish Thickness: 39.4µin (1.00µm), Mated Stacking Heights: 4.3mm, Part Status: Active, Number of Rows: 2.

Weitere Produktangebote DF9B-13P-1V(32)

Foto Bezeichnung Hersteller Beschreibung Verfügbarkeit
Preis ohne MwSt
DF9B-13P-1V(32) DF9B-13P-1V(32) Hersteller : Hirose Electric Co Ltd DF9.pdf Description: CONN HDR 13POS SMD TIN
Features: Solder Retention
Packaging: Tape & Reel (TR)
Connector Type: Header, Center Strip Contacts
Contact Finish: Tin
Mounting Type: Surface Mount
Number of Positions: 13
Pitch: 0.039" (1.00mm)
Height Above Board: 0.130" (3.30mm)
Contact Finish Thickness: 39.4µin (1.00µm)
Mated Stacking Heights: 4.3mm
Part Status: Active
Number of Rows: 2
Produkt ist nicht verfügbar
DF9B-13P-1V(32) DF9B-13P-1V(32) Hersteller : Hirose Electric Co Ltd DF9.pdf Description: CONN HDR 13POS SMD TIN
Packaging: Cut Tape (CT)
Features: Solder Retention
Connector Type: Header, Center Strip Contacts
Contact Finish: Tin
Mounting Type: Surface Mount
Number of Positions: 13
Pitch: 0.039" (1.00mm)
Height Above Board: 0.130" (3.30mm)
Contact Finish Thickness: 39.4µin (1.00µm)
Mated Stacking Heights: 4.3mm
Part Status: Active
Number of Rows: 2
Produkt ist nicht verfügbar