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ED32DT

ED32DT On Shore Technology Inc.

ipg2.pdf Hersteller: On Shore Technology Inc.
Description: CONN IC DIP SOCKET 32POS TIN
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 110°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 60.0µin (1.52µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 60.0µin (1.52µm)
Contact Material - Post: Phosphor Bronze
auf Bestellung 4030 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
24+0.76 EUR
28+ 0.65 EUR
31+ 0.57 EUR
60+ 0.52 EUR
105+ 0.5 EUR
255+ 0.45 EUR
510+ 0.43 EUR
1005+ 0.36 EUR
2505+ 0.33 EUR
Mindestbestellmenge: 24
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Technische Details ED32DT On Shore Technology Inc.

Description: CONN IC DIP SOCKET 32POS TIN, Packaging: Tube, Features: Open Frame, Mounting Type: Through Hole, Type: DIP, 0.6" (15.24mm) Row Spacing, Operating Temperature: -55°C ~ 110°C, Number of Positions or Pins (Grid): 32 (2 x 16), Termination: Solder, Housing Material: Polybutylene Terephthalate (PBT), Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 60.0µin (1.52µm), Contact Material - Mating: Phosphor Bronze, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin, Contact Finish Thickness - Post: 60.0µin (1.52µm), Contact Material - Post: Phosphor Bronze.

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ED32DT ED32DT Hersteller : On-Shore Technology, Inc ed.pdf Conn DIP Socket SKT 32 POS Solder ST Thru-Hole
auf Bestellung 68 Stücke:
Lieferzeit 14-21 Tag (e)
ED32DT ED32DT Hersteller : On-Shore Technology, Inc ed.pdf Conn DIP Socket SKT 32 POS Solder ST Thru-Hole
auf Bestellung 68 Stücke:
Lieferzeit 14-21 Tag (e)