auf Bestellung 4940 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis ohne MwSt |
|---|---|
| 2+ | 1.57 EUR |
| 10+ | 1.21 EUR |
| 100+ | 0.98 EUR |
| 250+ | 0.96 EUR |
| 500+ | 0.81 EUR |
| 1000+ | 0.71 EUR |
| 3000+ | 0.66 EUR |
Produktrezensionen
Produktbewertung abgeben
Technische Details F1206B3R00FSTR Kyocera AVX
Description: FUSE BOARD MOUNT 3A 63VDC 1206, Packaging: Tape & Reel (TR), Package / Case: 1206 (3216 Metric), Size / Dimension: 0.122" L x 0.063" W x 0.047" H (3.10mm x 1.60mm x 1.20mm), Fuse Type: Board Mount (Cartridge Style Excluded), Mounting Type: Surface Mount, Operating Temperature: -55°C ~ 125°C, Response Time: Fast Blow, Approval Agency: cUL, UL, Breaking Capacity @ Rated Voltage: 50A, Current Rating (Amps): 3 A, Voltage Rating - DC: 63 V, Melting I²t: 0.1.
Weitere Produktangebote F1206B3R00FSTR nach Preis ab 0.73 EUR bis 1.6 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung |
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F1206B3R00FSTR | Hersteller : KYOCERA AVX |
 Description: FUSE BOARD MOUNT 3A 63VDC 1206Packaging: Cut Tape (CT) Package / Case: 1206 (3216 Metric) Size / Dimension: 0.122" L x 0.063" W x 0.047" H (3.10mm x 1.60mm x 1.20mm) Fuse Type: Board Mount (Cartridge Style Excluded) Mounting Type: Surface Mount Operating Temperature: -55°C ~ 125°C Response Time: Fast Blow Approval Agency: cUL, UL Breaking Capacity @ Rated Voltage: 50A Current Rating (Amps): 3 A Voltage Rating - DC: 63 V Melting I²t: 0.1 |
auf Bestellung 3922 Stücke: Lieferzeit 10-14 Tag (e) |
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F1206B3R00FSTR | Hersteller : KYOCERA AVX Components |
Fuse Chip Fast Acting 3A 63V SMD Solder Pad 1206 T/R UL/cUL |
auf Bestellung 62 Stücke: Lieferzeit 14-21 Tag (e) |
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F1206B3R00FSTR | Hersteller : KYOCERA AVX Components |
Fuse Chip Fast Acting 3A 63V SMD Solder Pad 1206 T/R UL/cUL |
auf Bestellung 62 Stücke: Lieferzeit 14-21 Tag (e) |
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F1206B3R00FSTR | Hersteller : KYOCERA AVX Components |
Fuse Chip Fast Acting 3A 63V SMD Solder Pad 1206 T/R UL/cUL |
Produkt ist nicht verfügbar |
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F1206B3R00FSTR | Hersteller : KYOCERA AVX Components |
Fuse Chip Fast Acting 3A 63V SMD Solder Pad 1206 T/R UL/cUL |
Produkt ist nicht verfügbar |
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F1206B3R00FSTR | Hersteller : Kyocera AVX Components |
Fuse Chip Fast Acting 3A 63V SMD Solder Pad 1206 2.1 X 1.27 X 0.9mm T/R UL/cUL |
Produkt ist nicht verfügbar |
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F1206B3R00FSTR | Hersteller : KYOCERA AVX |
Description: FUSE BOARD MOUNT 3A 63VDC 1206 Packaging: Tape & Reel (TR) Package / Case: 1206 (3216 Metric) Size / Dimension: 0.122" L x 0.063" W x 0.047" H (3.10mm x 1.60mm x 1.20mm) Fuse Type: Board Mount (Cartridge Style Excluded) Mounting Type: Surface Mount Operating Temperature: -55°C ~ 125°C Response Time: Fast Blow Approval Agency: cUL, UL Breaking Capacity @ Rated Voltage: 50A Current Rating (Amps): 3 A Voltage Rating - DC: 63 V Melting I²t: 0.1 |
Produkt ist nicht verfügbar |