HSB06-181810 CUI Devices
Hersteller: CUI Devices
Description: HEAT SINK, BGA, 18 X 18 X 10 MM
Packaging: Box
Material: Aluminum Alloy
Length: 0.709" (18.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 0.709" (18.00mm)
Package Cooled: BGA
Attachment Method: Adhesive
Power Dissipation @ Temperature Rise: 3.2W @ 75°C
Thermal Resistance @ Forced Air Flow: 18.80°C/W @ 200 LFM
Thermal Resistance @ Natural: 23.68°C/W
Fin Height: 0.394" (10.00mm)
Material Finish: Black Anodized
Part Status: Active
Description: HEAT SINK, BGA, 18 X 18 X 10 MM
Packaging: Box
Material: Aluminum Alloy
Length: 0.709" (18.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 0.709" (18.00mm)
Package Cooled: BGA
Attachment Method: Adhesive
Power Dissipation @ Temperature Rise: 3.2W @ 75°C
Thermal Resistance @ Forced Air Flow: 18.80°C/W @ 200 LFM
Thermal Resistance @ Natural: 23.68°C/W
Fin Height: 0.394" (10.00mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 1977 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl | Preis ohne MwSt |
---|---|
11+ | 1.64 EUR |
12+ | 1.55 EUR |
25+ | 1.51 EUR |
50+ | 1.47 EUR |
100+ | 1.39 EUR |
250+ | 1.31 EUR |
500+ | 1.23 EUR |
1000+ | 1.14 EUR |
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Technische Details HSB06-181810 CUI Devices
Description: HEAT SINK, BGA, 18 X 18 X 10 MM, Packaging: Box, Material: Aluminum Alloy, Length: 0.709" (18.00mm), Shape: Square, Pin Fins, Type: Top Mount, Width: 0.709" (18.00mm), Package Cooled: BGA, Attachment Method: Adhesive, Power Dissipation @ Temperature Rise: 3.2W @ 75°C, Thermal Resistance @ Forced Air Flow: 18.80°C/W @ 200 LFM, Thermal Resistance @ Natural: 23.68°C/W, Fin Height: 0.394" (10.00mm), Material Finish: Black Anodized, Part Status: Active.
Weitere Produktangebote HSB06-181810 nach Preis ab 1.27 EUR bis 1.67 EUR
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt | ||||||||||||||||
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HSB06-181810 | Hersteller : CUI Devices | Heat Sinks heat sink, BGA, 18 x 18 x 10 mm |
auf Bestellung 1732 Stücke: Lieferzeit 10-14 Tag (e) |
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