HSB26-343408 CUI Devices
Hersteller: CUI DevicesDescription: HEAT SINK, BGA, 33.5 X 33.5 X 8
Packaging: Box
Material: Aluminum Alloy
Length: 1.319" (33.50mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.319" (33.50mm)
Package Cooled: BGA
Attachment Method: Adhesive
Power Dissipation @ Temperature Rise: 4.94W @ 75°C
Thermal Resistance @ Forced Air Flow: 5.30°C/W @ 200 LFM
Thermal Resistance @ Natural: 15.19°C/W
Fin Height: 0.315" (8.00mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 750 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis ohne MwSt |
|---|---|
| 10+ | 1.81 EUR |
| 25+ | 1.76 EUR |
| 50+ | 1.66 EUR |
| 100+ | 1.49 EUR |
| 250+ | 1.47 EUR |
| 500+ | 1.37 EUR |
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Technische Details HSB26-343408 CUI Devices
Description: HEAT SINK, BGA, 33.5 X 33.5 X 8, Packaging: Box, Material: Aluminum Alloy, Length: 1.319" (33.50mm), Shape: Square, Pin Fins, Type: Top Mount, Width: 1.319" (33.50mm), Package Cooled: BGA, Attachment Method: Adhesive, Power Dissipation @ Temperature Rise: 4.94W @ 75°C, Thermal Resistance @ Forced Air Flow: 5.30°C/W @ 200 LFM, Thermal Resistance @ Natural: 15.19°C/W, Fin Height: 0.315" (8.00mm), Material Finish: Black Anodized, Part Status: Active.
Weitere Produktangebote HSB26-343408 nach Preis ab 1.36 EUR bis 1.87 EUR
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HSB26-343408 | Hersteller : CUI Devices |
Heat Sinks heat sink, BGA, 33.5 x 33.5 x 8 mm |
auf Bestellung 1101 Stücke: Lieferzeit 10-14 Tag (e) |
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