HSB28-606022 CUI Devices
auf Bestellung 306 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl | Preis ohne MwSt |
---|---|
1+ | 11.09 EUR |
10+ | 10.72 EUR |
25+ | 10.4 EUR |
50+ | 9.79 EUR |
100+ | 9.57 EUR |
500+ | 7.94 EUR |
1000+ | 7.83 EUR |
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Technische Details HSB28-606022 CUI Devices
Description: HEAT SINK, BGA, 60 X 60 X 22 MM,, Packaging: Box, Material: Aluminum Alloy, Length: 2.362" (60.00mm), Shape: Square, Pin Fins, Type: Top Mount, Width: 2.362" (60.00mm), Package Cooled: BGA, Attachment Method: Push Pin, Power Dissipation @ Temperature Rise: 15.83W @ 75°C, Thermal Resistance @ Forced Air Flow: 1.40°C/W @ 200 LFM, Thermal Resistance @ Natural: 4.74°C/W, Fin Height: 0.866" (22.00mm), Material Finish: Black Anodized.
Weitere Produktangebote HSB28-606022
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
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HSB28-606022 | Hersteller : CUI Devices |
Description: HEAT SINK, BGA, 60 X 60 X 22 MM, Packaging: Box Material: Aluminum Alloy Length: 2.362" (60.00mm) Shape: Square, Pin Fins Type: Top Mount Width: 2.362" (60.00mm) Package Cooled: BGA Attachment Method: Push Pin Power Dissipation @ Temperature Rise: 15.83W @ 75°C Thermal Resistance @ Forced Air Flow: 1.40°C/W @ 200 LFM Thermal Resistance @ Natural: 4.74°C/W Fin Height: 0.866" (22.00mm) Material Finish: Black Anodized |
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