HSB30-373710 CUI Devices
Hersteller: CUI Devices
Description: HEAT SINK, BGA, 37.4 X 37 X 10 M
Packaging: Box
Material: Aluminum Alloy
Length: 1.472" (37.39mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.472" (37.39mm)
Package Cooled: BGA
Attachment Method: Push Pin
Power Dissipation @ Temperature Rise: 6.45W @ 75°C
Thermal Resistance @ Forced Air Flow: 4°C/W @ 200 LFM
Thermal Resistance @ Natural: 11.63°C/W
Fin Height: 0.394" (10.00mm)
Material Finish: Black Anodized
Description: HEAT SINK, BGA, 37.4 X 37 X 10 M
Packaging: Box
Material: Aluminum Alloy
Length: 1.472" (37.39mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.472" (37.39mm)
Package Cooled: BGA
Attachment Method: Push Pin
Power Dissipation @ Temperature Rise: 6.45W @ 75°C
Thermal Resistance @ Forced Air Flow: 4°C/W @ 200 LFM
Thermal Resistance @ Natural: 11.63°C/W
Fin Height: 0.394" (10.00mm)
Material Finish: Black Anodized
auf Bestellung 417 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl | Preis ohne MwSt |
---|---|
5+ | 3.61 EUR |
10+ | 3.49 EUR |
25+ | 3.39 EUR |
50+ | 3.19 EUR |
100+ | 2.86 EUR |
250+ | 2.82 EUR |
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Technische Details HSB30-373710 CUI Devices
Description: HEAT SINK, BGA, 37.4 X 37 X 10 M, Packaging: Box, Material: Aluminum Alloy, Length: 1.472" (37.39mm), Shape: Square, Pin Fins, Type: Top Mount, Width: 1.472" (37.39mm), Package Cooled: BGA, Attachment Method: Push Pin, Power Dissipation @ Temperature Rise: 6.45W @ 75°C, Thermal Resistance @ Forced Air Flow: 4°C/W @ 200 LFM, Thermal Resistance @ Natural: 11.63°C/W, Fin Height: 0.394" (10.00mm), Material Finish: Black Anodized.
Weitere Produktangebote HSB30-373710 nach Preis ab 2.69 EUR bis 3.66 EUR
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt | ||||||||||||||||
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HSB30-373710 | Hersteller : CUI Devices | Heat Sinks heat sink, BGA, 37.4 x 37 x 10 mm, push pins |
auf Bestellung 319 Stücke: Lieferzeit 10-14 Tag (e) |
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