IPC0050-S Chip Quik Inc.
Hersteller: Chip Quik Inc.
Description: POWERSOIC-10/PSOP-10/HSOP-10 STE
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.050" (1.27mm)
Type: PowerSOIC
Inner Dimension: 0.370" L x 0.295" W (9.40mm x 7.50mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.413" L x 0.291" W (10.50mm x 7.40mm)
Number of Positions: 10
Description: POWERSOIC-10/PSOP-10/HSOP-10 STE
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.050" (1.27mm)
Type: PowerSOIC
Inner Dimension: 0.370" L x 0.295" W (9.40mm x 7.50mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.413" L x 0.291" W (10.50mm x 7.40mm)
Number of Positions: 10
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Technische Details IPC0050-S Chip Quik Inc.
Description: POWERSOIC-10/PSOP-10/HSOP-10 STE, Packaging: Bulk, Material: Stainless Steel, Pitch: 0.050" (1.27mm), Type: PowerSOIC, Inner Dimension: 0.370" L x 0.295" W (9.40mm x 7.50mm), Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm), Thermal Center Pad: 0.413" L x 0.291" W (10.50mm x 7.40mm), Number of Positions: 10.
Weitere Produktangebote IPC0050-S
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
---|---|---|---|---|---|
IPC0050-S | Hersteller : Chip Quik | Sockets & Adapters PowerSOIC-10 Steel Stencil |
Produkt ist nicht verfügbar |