IPC0091 Chip Quik Inc.
Hersteller: Chip Quik Inc.
Description: POWERSSOP-28 TO DIP-32 SMT ADAPT
Packaging: Bulk
Size / Dimension: 1.000" x 1.600" (25.40mm x 40.64mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: PowerSSO
Part Status: Active
Description: POWERSSOP-28 TO DIP-32 SMT ADAPT
Packaging: Bulk
Size / Dimension: 1.000" x 1.600" (25.40mm x 40.64mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: PowerSSO
Part Status: Active
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Technische Details IPC0091 Chip Quik Inc.
Description: POWERSSOP-28 TO DIP-32 SMT ADAPT, Packaging: Bulk, Size / Dimension: 1.000" x 1.600" (25.40mm x 40.64mm), Material: FR4 Epoxy Glass, Number of Positions: 28, Pitch: 0.026" (0.65mm), Board Thickness: 0.062" (1.57mm) 1/16", Proto Board Type: SMD to DIP, Package Accepted: PowerSSO, Part Status: Active.
Weitere Produktangebote IPC0091
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
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IPC0091 | Hersteller : Chip Quik | Sockets & Adapters PwrSSOP-28 to DIP-32 SMT Adapter |
Produkt ist nicht verfügbar |