IPC0108-S Chip Quik Inc.
Hersteller: Chip Quik Inc.
Description: QFN-20 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.018" (0.45mm)
Type: QFN/LFCSP
Inner Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.061" L x 0.061" W (1.55mm x 1.55mm)
Number of Positions: 20
Description: QFN-20 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.018" (0.45mm)
Type: QFN/LFCSP
Inner Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.061" L x 0.061" W (1.55mm x 1.55mm)
Number of Positions: 20
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Technische Details IPC0108-S Chip Quik Inc.
Description: QFN-20 STENCIL, Packaging: Bulk, Material: Stainless Steel, Pitch: 0.018" (0.45mm), Type: QFN/LFCSP, Inner Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm), Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm), Thermal Center Pad: 0.061" L x 0.061" W (1.55mm x 1.55mm), Number of Positions: 20.
Weitere Produktangebote IPC0108-S
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
---|---|---|---|---|---|
IPC0108-S | Hersteller : Chip Quik | Sockets & Adapters QFN-20 Stainless Steel Stencil |
Produkt ist nicht verfügbar |