JET551LT10T5 Chip Quik Inc.
Hersteller: Chip Quik Inc.
Description: JET PRINTING SOLDER PASTE SN42/B
Packaging: Bulk
Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Type: Solder Paste
Melting Point: 280°F ~ 338°F (138°C ~ 170°C)
Form: Syringe, 1.23 oz (35g), 10cc
Flux Type: No-Clean
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: JET PRINTING SOLDER PASTE SN42/B
Packaging: Bulk
Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Type: Solder Paste
Melting Point: 280°F ~ 338°F (138°C ~ 170°C)
Form: Syringe, 1.23 oz (35g), 10cc
Flux Type: No-Clean
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Produkt ist nicht verfügbar
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Technische Details JET551LT10T5 Chip Quik Inc.
Description: JET PRINTING SOLDER PASTE SN42/B, Packaging: Bulk, Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4), Type: Solder Paste, Melting Point: 280°F ~ 338°F (138°C ~ 170°C), Form: Syringe, 1.23 oz (35g), 10cc, Flux Type: No-Clean, Shelf Life Start: Date of Manufacture, Shelf Life: 12 Months.
Weitere Produktangebote JET551LT10T5
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
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JET551LT10T5 | Hersteller : Chip Quik | Solder Jet Printing Solder Paste Sn42/Bi57.6/Ag0.4 T5 Vacuum Mixed 10cc/35g Syringe |
Produkt ist nicht verfügbar |