QSE-014-01-F-D-DP-A-TR Samtec Inc.
Hersteller: Samtec Inc.Description: CONN DIFF ARRAY RCP 28P SMD GOLD
Features: Board Guide, Ground Bus (Plane)
Packaging: Tape & Reel (TR)
Connector Type: Differential Pair Array, Female
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 28
Pitch: 0.031" (0.80mm)
Height Above Board: 0.128" (3.25mm)
Contact Finish Thickness: 3.00µin (0.076µm)
Mated Stacking Heights: 5mm, 8mm, 11mm, 14mm, 16mm, 19mm, 25mm
Number of Rows: 2
auf Bestellung 1425 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis ohne MwSt |
|---|---|
| 475+ | 7.3 EUR |
| 950+ | 6.38 EUR |
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Technische Details QSE-014-01-F-D-DP-A-TR Samtec Inc.
Description: CONN DIFF ARRAY RCP 28P SMD GOLD, Features: Board Guide, Ground Bus (Plane), Packaging: Tape & Reel (TR), Connector Type: Differential Pair Array, Female, Contact Finish: Gold, Mounting Type: Surface Mount, Number of Positions: 28, Pitch: 0.031" (0.80mm), Height Above Board: 0.128" (3.25mm), Contact Finish Thickness: 3.00µin (0.076µm), Mated Stacking Heights: 5mm, 8mm, 11mm, 14mm, 16mm, 19mm, 25mm, Number of Rows: 2.
Weitere Produktangebote QSE-014-01-F-D-DP-A-TR nach Preis ab 11.72 EUR bis 14.57 EUR
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QSE-014-01-F-D-DP-A-TR | Hersteller : Samtec Inc. |
Description: CONN DIFF ARRAY RCP 28P SMD GOLD Features: Board Guide, Ground Bus (Plane) Packaging: Cut Tape (CT) Connector Type: Differential Pair Array, Female Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 28 Pitch: 0.031" (0.80mm) Height Above Board: 0.128" (3.25mm) Contact Finish Thickness: 3.00µin (0.076µm) Mated Stacking Heights: 5mm, 8mm, 11mm, 14mm, 16mm, 19mm, 25mm Number of Rows: 2 |
auf Bestellung 1520 Stücke: Lieferzeit 10-14 Tag (e) |
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QSE-014-01-F-D-DP-A-TR | Hersteller : Samtec |
Board to Board & Mezzanine Connectors 0.80 mm Q Strip High-Speed Ground Plane Socket Strip |
auf Bestellung 460 Stücke: Lieferzeit 10-14 Tag (e) |