R7F7016503ABG-C#BC1 Renesas Electronics Corporation
Hersteller: Renesas Electronics CorporationDescription: IC MCU 32BIT 3MB FLASH 223FBGA
Packaging: Tray
Package / Case: 233-FBGA
Mounting Type: Surface Mount
Speed: 240MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: RH850G3KH
Data Converters: A/D 20x10b, 16x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, CSI, I2C, LINbus, UART/USART
Peripherals: DMA, LVD, PWM, WDT
Supplier Device Package: 233-FBGA (15x15)
Number of I/O: 174
auf Bestellung 1071 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 38.47 EUR |
| 10+ | 35.49 EUR |
| 25+ | 33.9 EUR |
| 80+ | 30.31 EUR |
| 230+ | 28.91 EUR |
| 440+ | 27.52 EUR |
Produktrezensionen
Produktbewertung abgeben
Technische Details R7F7016503ABG-C#BC1 Renesas Electronics Corporation
Description: IC MCU 32BIT 3MB FLASH 223FBGA, Packaging: Tray, Package / Case: 233-FBGA, Mounting Type: Surface Mount, Speed: 240MHz, Program Memory Size: 3MB (3M x 8), RAM Size: 384K x 8, Operating Temperature: -40°C ~ 105°C (TA), Oscillator Type: Internal, Program Memory Type: FLASH, EEPROM Size: 128K x 8, Core Processor: RH850G3KH, Data Converters: A/D 20x10b, 16x12b, Core Size: 32-Bit, Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V, Connectivity: CANbus, CSI, I2C, LINbus, UART/USART, Peripherals: DMA, LVD, PWM, WDT, Supplier Device Package: 233-FBGA (15x15), Number of I/O: 174.
Weitere Produktangebote R7F7016503ABG-C#BC1
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
|---|---|---|---|---|---|
| R7F7016503ABG-C#BC1 | Hersteller : Renesas Electronics |
Renesas Electronics 32-BIT GENERAL MCU_RH850/RH850/F1KM_3MB |
Produkt ist nicht verfügbar |