RE965-03PIN

RE965-03PIN ROTH ELEKTRONIK GMBH


en_RE965-03PIN.pdf de_RE965-03PIN.pdf Hersteller: ROTH ELEKTRONIK GMBH
Category: Universal PCBs
Description: Board: universal; double sided,multiadapter,prototyping; W: 11mm
Material: epoxy resin; FR4
Width: 11mm
Length: 11.7mm
Copper plating thickness: 35µm
Type of board: universal
Soldering pads configuration: SC70
Soldering pads pitch: 2.5mm
Board variant: double sided; multiadapter; prototyping
Trade name: printed circuit board
Kind of material: fiber glass reinforced
Hole diameter: 1.1mm
Laminate thickness: 1.5mm
Anzahl je Verpackung: 1 Stücke
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Technische Details RE965-03PIN ROTH ELEKTRONIK GMBH

Category: Universal PCBs, Description: Board: universal; double sided,multiadapter,prototyping; W: 11mm, Material: epoxy resin; FR4, Width: 11mm, Length: 11.7mm, Copper plating thickness: 35µm, Type of board: universal, Soldering pads configuration: SC70, Soldering pads pitch: 2.5mm, Board variant: double sided; multiadapter; prototyping, Trade name: printed circuit board, Kind of material: fiber glass reinforced, Hole diameter: 1.1mm, Laminate thickness: 1.5mm, Anzahl je Verpackung: 1 Stücke.

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RE965-03PIN RE965-03PIN Hersteller : ROTH ELEKTRONIK GMBH en_RE965-03PIN.pdf de_RE965-03PIN.pdf Category: Universal PCBs
Description: Board: universal; double sided,multiadapter,prototyping; W: 11mm
Material: epoxy resin; FR4
Width: 11mm
Length: 11.7mm
Copper plating thickness: 35µm
Type of board: universal
Soldering pads configuration: SC70
Soldering pads pitch: 2.5mm
Board variant: double sided; multiadapter; prototyping
Trade name: printed circuit board
Kind of material: fiber glass reinforced
Hole diameter: 1.1mm
Laminate thickness: 1.5mm
Produkt ist nicht verfügbar