SEAF-30-06.5-S-10-1-A-K-TR Samtec Inc.
Hersteller: Samtec Inc.Description: CONN HD ARRAY RCPT 300P SMD GOLD
Features: Board Guide, Pick and Place
Packaging: Cut Tape (CT)
Connector Type: High Density Array, Female
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 300
Pitch: 0.050" (1.27mm)
Height Above Board: 0.258" (6.55mm)
Contact Finish Thickness: 30.0µin (0.76µm)
Mated Stacking Heights: 8.5mm, 9.5mm, 10mm, 13mm, 13.5mm, 15.5mm, 17.5mm, 19.5mm
Number of Rows: 10
auf Bestellung 135 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 40.6 EUR |
| 10+ | 38.82 EUR |
| 25+ | 37.37 EUR |
| 50+ | 34.64 EUR |
| 100+ | 29.74 EUR |
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Technische Details SEAF-30-06.5-S-10-1-A-K-TR Samtec Inc.
Description: CONN HD ARRAY RCPT 300P SMD GOLD, Features: Board Guide, Pick and Place, Packaging: Tape & Reel (TR), Connector Type: High Density Array, Female, Contact Finish: Gold, Mounting Type: Surface Mount, Number of Positions: 300, Pitch: 0.050" (1.27mm), Height Above Board: 0.258" (6.55mm), Contact Finish Thickness: 30.0µin (0.76µm), Mated Stacking Heights: 8.5mm, 9.5mm, 10mm, 13mm, 13.5mm, 15.5mm, 17.5mm, 19.5mm, Number of Rows: 10.
Weitere Produktangebote SEAF-30-06.5-S-10-1-A-K-TR
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
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SEAF-30-06.5-S-10-1-A-K-TR | Hersteller : Samtec Inc. |
Description: CONN HD ARRAY RCPT 300P SMD GOLD Features: Board Guide, Pick and Place Packaging: Tape & Reel (TR) Connector Type: High Density Array, Female Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 300 Pitch: 0.050" (1.27mm) Height Above Board: 0.258" (6.55mm) Contact Finish Thickness: 30.0µin (0.76µm) Mated Stacking Heights: 8.5mm, 9.5mm, 10mm, 13mm, 13.5mm, 15.5mm, 17.5mm, 19.5mm Number of Rows: 10 |
Produkt ist nicht verfügbar |
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SEAF-30-06.5-S-10-1-A-K-TR | Hersteller : Samtec |
Board to Board & Mezzanine Connectors .050" SEARAY High-Speed High-Density Open-Pin-Field Array Socket |
Produkt ist nicht verfügbar |