V-1102-SMD/A-L Assmann WSW Components
Hersteller: Assmann WSW Components
Description: HEATSINK TO-263 19.38X25.40MM
Packaging: Bulk
Material: Copper
Length: 0.763" (19.38mm)
Shape: Rectangular, Fins
Type: Top Mount
Width: 1.000" (25.40mm)
Package Cooled: TO-263 (D²Pak)
Attachment Method: SMD Pad
Thermal Resistance @ Forced Air Flow: 23.00°C/W @ 300 LFM
Thermal Resistance @ Natural: 11.00°C/W
Fin Height: 0.450" (11.43mm)
Material Finish: Tin
Part Status: Active
Description: HEATSINK TO-263 19.38X25.40MM
Packaging: Bulk
Material: Copper
Length: 0.763" (19.38mm)
Shape: Rectangular, Fins
Type: Top Mount
Width: 1.000" (25.40mm)
Package Cooled: TO-263 (D²Pak)
Attachment Method: SMD Pad
Thermal Resistance @ Forced Air Flow: 23.00°C/W @ 300 LFM
Thermal Resistance @ Natural: 11.00°C/W
Fin Height: 0.450" (11.43mm)
Material Finish: Tin
Part Status: Active
auf Bestellung 6552 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl | Preis ohne MwSt |
---|---|
8+ | 2.24 EUR |
10+ | 2.13 EUR |
25+ | 2.07 EUR |
50+ | 2.01 EUR |
100+ | 1.9 EUR |
250+ | 1.79 EUR |
500+ | 1.68 EUR |
1000+ | 1.57 EUR |
5000+ | 1.51 EUR |
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Technische Details V-1102-SMD/A-L Assmann WSW Components
Description: HEATSINK TO-263 19.38X25.40MM, Packaging: Bulk, Material: Copper, Length: 0.763" (19.38mm), Shape: Rectangular, Fins, Type: Top Mount, Width: 1.000" (25.40mm), Package Cooled: TO-263 (D²Pak), Attachment Method: SMD Pad, Thermal Resistance @ Forced Air Flow: 23.00°C/W @ 300 LFM, Thermal Resistance @ Natural: 11.00°C/W, Fin Height: 0.450" (11.43mm), Material Finish: Tin, Part Status: Active.
Weitere Produktangebote V-1102-SMD/A-L
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
---|---|---|---|---|---|
V-1102-SMD/A-L | Hersteller : Assmann WSW Components GMBH | FINGER-SHAPED SMD-HEATSINK |
Produkt ist nicht verfügbar |