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V62/18606-01XF

V62/18606-01XF Texas Instruments


spns253.pdf Hersteller: Texas Instruments
Microcontroller Based on the ARM Cortex-R Core
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Technische Details V62/18606-01XF Texas Instruments

Description: IC MCU 32BIT 4MB FLASH 337LFBGA, Packaging: Bulk, Package / Case: 337-LFBGA, Mounting Type: Surface Mount, Speed: 300MHz, Program Memory Size: 4MB (4M x 8), RAM Size: 512K x 8, Operating Temperature: -55°C ~ 125°C (TA), Oscillator Type: Internal, Program Memory Type: FLASH, EEPROM Size: 128K x 8, Core Processor: Arm® Cortex®-R5F, Data Converters: A/D 41x12b, Core Size: 32-Bit, Voltage - Supply (Vcc/Vdd): 1.14V ~ 1.32V, Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, MibSPI, SCI, SPI, UART/USART, Peripherals: DMA, POR, PWM, WDT, Supplier Device Package: 337-NFBGA (16x16), Number of I/O: 168.

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V62/18606-01XF V62/18606-01XF Hersteller : Texas Instruments tms570lc4357-ep.pdf?ts=1710338965865 Description: IC MCU 32BIT 4MB FLASH 337LFBGA
Packaging: Bulk
Package / Case: 337-LFBGA
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -55°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: Arm® Cortex®-R5F
Data Converters: A/D 41x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.14V ~ 1.32V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, MibSPI, SCI, SPI, UART/USART
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 337-NFBGA (16x16)
Number of I/O: 168
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V62/18606-01XF V62/18606-01XF Hersteller : Texas Instruments tms570lc4357-ep.pdf?ts=1710338965865 ARM Microcontrollers - MCU Enhanced product, 16/32 bit RISC flash MCU, Arm Cortex-R5F, EMAC, FlexRay 337-NFBGA -55 to 125
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