WP27D-SX60VA3-R15000 JAE Electronics
Hersteller: JAE Electronics
Description: Interconnect Rectangular
Features: Solder Retention
Packaging: Bulk
Connector Type: Receptacle, Center Strip Contacts
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 60
Pitch: 0.014" (0.35mm)
Height Above Board: 0.028" (0.71mm)
Number of Rows: 2
Description: Interconnect Rectangular
Features: Solder Retention
Packaging: Bulk
Connector Type: Receptacle, Center Strip Contacts
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 60
Pitch: 0.014" (0.35mm)
Height Above Board: 0.028" (0.71mm)
Number of Rows: 2
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Technische Details WP27D-SX60VA3-R15000 JAE Electronics
Description: Interconnect Rectangular, Features: Solder Retention, Packaging: Bulk, Connector Type: Receptacle, Center Strip Contacts, Contact Finish: Gold, Mounting Type: Surface Mount, Number of Positions: 60, Pitch: 0.014" (0.35mm), Height Above Board: 0.028" (0.71mm), Number of Rows: 2.
Weitere Produktangebote WP27D-SX60VA3-R15000
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
|---|---|---|---|---|---|
| WP27D-SX60VA3-R15000 | Hersteller : JAE Electronics | Board to Board & Mezzanine Connectors |
Produkt ist nicht verfügbar |